Insulated metal substrate or other insulated electrically conductive substrate

Industry

CPC
H05K1/05

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/05Insulated metal substrate or other insulated electrically conductive substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board assembly
- Patent number 12,369,260
- Issue date Jul 22, 2025
- Vitesco Technologies GmbH
- Stefan Peck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing bonded body and method for manufacturing i...
- Patent number 12,356,554
- Issue date Jul 8, 2025
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board module and electronic device comprising same
- Patent number 12,349,280
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,342,471
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 12,342,452
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, copper foil with resin, and printed wiring board
- Patent number 12,331,212
- Issue date Jun 17, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhiro Oosawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate, bonding method, and intermediate product for circuit board
- Patent number 12,336,117
- Issue date Jun 17, 2025
- NHK Spring Co., Ltd.
- Takeshi Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating member arrangement structure and electronic device inclu...
- Patent number 12,328,811
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Wooram Ki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 12,297,354
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and wiring circuit board assembly
- Patent number 12,289,830
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, prepreg, resin-coated metal foil,...
- Patent number 12,258,468
- Issue date Mar 25, 2025
- Resonac Corporation
- Yuya Hirayama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,262,468
- Issue date Mar 25, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,250,769
- Issue date Mar 11, 2025
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating composition and laminate
- Patent number 12,240,988
- Issue date Mar 4, 2025
- Daikin Industries, Ltd.
- Yuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,238,859
- Issue date Feb 25, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,237,556
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,232,255
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,207,410
- Issue date Jan 21, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded smart module
- Patent number 12,207,401
- Issue date Jan 21, 2025
- National Taipel University of Technology
- Syang-Peng Rwei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disk device
- Patent number 12,198,734
- Issue date Jan 14, 2025
- Kabushiki Kaisha Toshiba
- Kota Tokuda
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board module
- Patent number 12,193,158
- Issue date Jan 7, 2025
- LG Innotek Co., Ltd
- Jeong Heum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20250240877
- Publication date Jul 24, 2025
- Nitto Denko Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20250227850
- Publication date Jul 10, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212326
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING LAMINATED ELE...
- Publication number 20250210217
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Kenta KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...
- Publication number 20250185151
- Publication date Jun 5, 2025
- NOF Corporation
- Toshinobu FUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250142737
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION
- Publication number 20250120008
- Publication date Apr 10, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE...
- Publication number 20250112142
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- MARKUS LASCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER AND METHOD
- Publication number 20250106993
- Publication date Mar 27, 2025
- Vitesco Technologies GMBH
- Detlev BAGUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250089162
- Publication date Mar 13, 2025
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, CURED PRODUCT, METAL-...
- Publication number 20250075062
- Publication date Mar 6, 2025
- TAIYO Holdings Co., Ltd.
- Yoshikazu DAIGO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081340
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR...
- Publication number 20250026951
- Publication date Jan 23, 2025
- NHK Spring Co., Ltd.
- Katsumi MIZUNO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Isolation Slots for an Antenna and Printed Circuit Board Interface
- Publication number 20240357732
- Publication date Oct 24, 2024
- Aptiv Technologies Limited
- Yuxiao He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE
- Publication number 20240324116
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Hayato YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240306292
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING BOARD
- Publication number 20240292532
- Publication date Aug 29, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
- Publication number 20240290708
- Publication date Aug 29, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268021
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240260179
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240244742
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240237224
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- SHINYA ONOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
- Publication number 20240224421
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Ryoma TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Insulated metal substrate or other insulated electrically conductive substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board assembly

Method for manufacturing bonded body and method for manufacturing i...

Printed circuit board module and electronic device comprising same

Electronic component and method for manufacturing electronic component

Circuit board and electronic device

Resin composition, copper foil with resin, and printed wiring board

Laminate, bonding method, and intermediate product for circuit board

Insulating member arrangement structure and electronic device inclu...

Electronic package and method of manufacturing the same

Resin composition, copper foil with resin, dielectric layer, copper...

Wiring circuit board and wiring circuit board assembly

Wiring circuit board

Multilayer substrate module with filter function

Thermosetting resin composition, prepreg, resin-coated metal foil,...

Copper-clad laminate and method of forming the same

Circuit board and manufacturing method thereof

Dielectric substrate and method of forming the same

Coating composition and laminate

Wiring circuit board

Electronic device

Circuit board

Circuit board

Component carrier having a double dielectric layer and method of ma...

Wiring circuit board

Embedded smart module

Disk device

Printed circuit board module

Electronic device including electrostatic discharge path

Heat-dissipating circuit board, heat-dissipating member, and produc...

Method of forming a flexible electronics assembly

Patents Applicationslast 30 patents

WIRING CIRCUIT BOARD

Method for Embedding a Component in a Printed Circuit Board

PRINTED CIRCUIT BOARD

PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING LAMINATED ELE...

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION

ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE...

CIRCUIT CARRIER AND METHOD

SUBSTRATE STRUCTURE

RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, CURED PRODUCT, METAL-...

PRINTED CIRCUIT BOARD

EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR...

PRINTED WIRING BOARD

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

Isolation Slots for an Antenna and Printed Circuit Board Interface

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

STORAGE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT MOUNTING BOARD

SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...

Method for preparing novel material layer structure of circuit boar...

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

PRINTED WIRING BOARD

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

PRINTED WIRING BOARD

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

METHOD OF MANUFACTURING ELECTRONIC DEVICE

WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET