Insulated metal substrate or other insulated electrically conductive substrate

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Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...

    • Publication number 20240164015
    • Publication date May 16, 2024
    • HS Elektronik Systeme GmbH
    • Josef MAIER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION AND USES THEREOF

    • Publication number 20240150567
    • Publication date May 9, 2024
    • TAIWAN UNION TECHNOLOGY CORPORATION
    • JEN-CHI CHIANG
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC DEVICE

    • Publication number 20240138072
    • Publication date Apr 25, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • SHINYA ONOUE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

    • Publication number 20240130093
    • Publication date Apr 18, 2024
    • Toyota Motor Engineering & Manufacturing North America, Inc.
    • Feng Zhou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic Device

    • Publication number 20240130048
    • Publication date Apr 18, 2024
    • Honor Device Co., Ltd.
    • Xiaoyong Dong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

    • Publication number 20240130076
    • Publication date Apr 18, 2024
    • Toyota Motor Engineering & Manufacturing North America, Inc.
    • Tianzhu Fan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION

    • Publication number 20240121895
    • Publication date Apr 11, 2024
    • Nitride Global Inc.
    • Jason Schmitt
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE

    • Publication number 20240117119
    • Publication date Apr 11, 2024
    • MITSUBISHI MATERIALS CORPORATION
    • Shintaro Hara
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

    • Publication number 20240114615
    • Publication date Apr 4, 2024
    • Nitto Denko Corporation
    • Hayato TAKAKURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEALED LAMINATED WINDOW UNIT

    • Publication number 20240110627
    • Publication date Apr 4, 2024
    • DelStar Technologies, Inc.
    • Nandan Ukidwe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD

    • Publication number 20240107667
    • Publication date Mar 28, 2024
    • Nitto Denko Corporation
    • Kenta FUKUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD

    • Publication number 20240101858
    • Publication date Mar 28, 2024
    • Mitsui Mining and Smelting Co., Ltd.
    • Kazuhiro OOSAWA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

    • Publication number 20240098886
    • Publication date Mar 21, 2024
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING COMPOSITION AND LAMINATE

    • Publication number 20240093052
    • Publication date Mar 21, 2024
    • DAIKIN INDUSTRIES, LTD.
    • Yuki UEDA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    EMBEDDED SMART MODULE

    • Publication number 20240098893
    • Publication date Mar 21, 2024
    • National Taipei University of Technology
    • Syang-Peng Rwei
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD

    • Publication number 20240090128
    • Publication date Mar 14, 2024
    • Nitto Denko Corporation
    • Yusaku TAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING COMPOSITION AND LAMINATE

    • Publication number 20240084158
    • Publication date Mar 14, 2024
    • DAIKIN INDUSTRIES, LTD.
    • Yuki UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...

    • Publication number 20240074031
    • Publication date Feb 29, 2024
    • CreeLED, Inc.
    • Everett Bradford
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20240074127
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Chen-Yu Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISK DEVICE

    • Publication number 20240071422
    • Publication date Feb 29, 2024
    • Kabushiki Kaisha Toshiba
    • Kota TOKUDA
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

    • Publication number 20240055745
    • Publication date Feb 15, 2024
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20240049389
    • Publication date Feb 8, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20240032201
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Jae Yoo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT ASSEMBLY

    • Publication number 20240032210
    • Publication date Jan 25, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Taiji YANAGIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

    • Publication number 20240023242
    • Publication date Jan 18, 2024
    • SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    • Jennifer ADAMCHUK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD

    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION AND METAL CLAD SUBSTRATE

    • Publication number 20240002653
    • Publication date Jan 4, 2024
    • ITEQ CORPORATION
    • SHENG-YEN WU
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    SUBSTRATE STRUCTURE

    • Publication number 20230422411
    • Publication date Dec 28, 2023
    • Subtron Technology Co., Ltd.
    • Chung Ying Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

    • Publication number 20230413431
    • Publication date Dec 21, 2023
    • Nitto Denko Corporation
    • Takahiro IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...

    • Publication number 20230397332
    • Publication date Dec 7, 2023
    • JUMATECH GMBH
    • Philipp WÖLFEL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR