Insulated metal substrate or other insulated electrically conductive substrate

Industry

CPC
H05K1/05

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/05Insulated metal substrate or other insulated electrically conductive substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Disk device
- Patent number 12,198,734
- Issue date Jan 14, 2025
- Kabushiki Kaisha Toshiba
- Kota Tokuda
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board module
- Patent number 12,193,158
- Issue date Jan 7, 2025
- LG Innotek Co., Ltd
- Jeong Heum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal clad laminated plate and method for manufacturing metal clad...
- Patent number 12,162,257
- Issue date Dec 10, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masaya Koyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,137,522
- Issue date Nov 5, 2024
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal base substrate, electronic component mounting substrate
- Patent number 12,127,342
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,108,529
- Issue date Oct 1, 2024
- Nitto Denko Corporation
- Yoshito Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-ceramic substrate with a foil formed for direct cooling as su...
- Patent number 12,087,660
- Issue date Sep 10, 2024
- Heraeus Deutschland GmbH & Co. KG
- Peter Dietrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,082,346
- Issue date Sep 3, 2024
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and electronic device
- Patent number 12,075,563
- Issue date Aug 27, 2024
- Sony Interactive Entertainment Inc.
- Minoru Wakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for manufacturing thin substrate
- Patent number 12,035,466
- Issue date Jul 9, 2024
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, insulated circuit board with heat sink, and heat sink
- Patent number 12,035,468
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting for underwater use
- Patent number 12,031,710
- Issue date Jul 9, 2024
- PROPULSION SYSTEMS
- Marc Lamberts
- F21 - LIGHTING
Information Patent Grant
Circuit board, light emitting device, and manufacturing method thereof
- Patent number 12,035,481
- Issue date Jul 9, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
- Patent number 11,975,507
- Issue date May 7, 2024
- Shengyi Technology Co., Ltd.
- Zhenwen Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Isolation Slots for an Antenna and Printed Circuit Board Interface
- Publication number 20240357732
- Publication date Oct 24, 2024
- Aptiv Technologies Limited
- Yuxiao He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
- Publication number 20240349424
- Publication date Oct 17, 2024
- John Simonetti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE
- Publication number 20240324116
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Hayato YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240306292
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING BOARD
- Publication number 20240292532
- Publication date Aug 29, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
- Publication number 20240290708
- Publication date Aug 29, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268021
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240260179
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240244742
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240237224
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- SHINYA ONOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
- Publication number 20240224421
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Ryoma TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...
- Publication number 20240199829
- Publication date Jun 20, 2024
- AGC Inc.
- Seigo KOTERA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING BOARD
- Publication number 20240206051
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Kaori KOIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240196528
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangik CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOR WIRING BOARD
- Publication number 20240179849
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- G01 - MEASURING TESTING
Information Patent Application
LIGHTING FOR UNDERWATER USE
- Publication number 20240175570
- Publication date May 30, 2024
- PROPULSION SYSTEMS
- Marc LAMBERTS
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...
- Publication number 20240164015
- Publication date May 16, 2024
- HS Elektronik Systeme GmbH
- Josef MAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND USES THEREOF
- Publication number 20240150567
- Publication date May 9, 2024
- TAIWAN UNION TECHNOLOGY CORPORATION
- JEN-CHI CHIANG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240138072
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- SHINYA ONOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
- Publication number 20240130076
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
- Publication number 20240121895
- Publication date Apr 11, 2024
- Nitride Global Inc.
- Jason Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE
- Publication number 20240117119
- Publication date Apr 11, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shintaro Hara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Insulated metal substrate or other insulated electrically conductive substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Disk device

Printed circuit board module

Electronic device including electrostatic discharge path

Heat-dissipating circuit board, heat-dissipating member, and produc...

Method of forming a flexible electronics assembly

Metal clad laminated plate and method for manufacturing metal clad...

Power electronics assemblies having embedded power electronics devices

Pressure-sensitive adhesive sheet-including wiring circuit board an...

Wiring circuit board

Plasma treatments for flexures of hard disk drives

Metal base substrate, electronic component mounting substrate

Manufacturing method for double-sided wiring circuit board and doub...

Wiring circuit board

Circuit board

Manufacturing method of insulated metal substrate

Power electronics device assemblies including dual graphite layers...

Metal-ceramic substrate with a foil formed for direct cooling as su...

Electronic device

Wiring board

Multilayer printed circuit board and electronic device

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Systems and methods for manufacturing thin substrate

Bonded body, insulated circuit board with heat sink, and heat sink

Lighting for underwater use

Circuit board, light emitting device, and manufacturing method thereof

Prepreg, metal-clad laminate, and wiring board

Driver for motors

Method of fabricating a substrate with metal reflection layer

Thermosetting resin composition, prepreg containing same, metal foi...

Method of manufacturing a three-dimensional electronic module havin...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

Isolation Slots for an Antenna and Printed Circuit Board Interface

METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE

STORAGE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

COMPONENT MOUNTING BOARD

SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...

Method for preparing novel material layer structure of circuit boar...

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

PRINTED WIRING BOARD

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

PRINTED WIRING BOARD

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

METHOD OF MANUFACTURING ELECTRONIC DEVICE

WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...

WIRING BOARD

PRINTED CIRCUIT BOARD

LAMINATE FOR WIRING BOARD

LIGHTING FOR UNDERWATER USE

PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...

RESIN COMPOSITION AND USES THEREOF

METHOD OF MANUFACTURING ELECTRONIC DEVICE

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

Electronic Device

POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION

POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE