Insulating materials

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H01L23/5329

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5329Insulating materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 12,308,287
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,308,288
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for manufacturing the interconnec...
- Patent number 12,308,312
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Khaderbad Mrunal Abhijith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with fluorine-catching layer
- Patent number 12,308,319
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer insulating layer in recess and...
- Patent number 12,300,614
- Issue date May 13, 2025
- Kioxia Corporation
- Kosuke Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 12,300,486
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing tsemiconductor device having bonding structure
- Patent number 12,295,137
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,293,925
- Issue date May 6, 2025
- Renesas Electronics Corporation
- Yuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method for semiconductor structure and semiconductor structure
- Patent number 12,283,519
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuxian Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 12,283,521
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-carbon-concentration dielectrics
- Patent number 12,278,183
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,278,140
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having air gap and method for manufacturi...
- Patent number 12,272,636
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,272,597
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top hat structure for isolation capacitors
- Patent number 12,272,633
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with composite isolation feature and meth...
- Patent number 12,261,118
- Issue date Mar 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with impurity doped o...
- Patent number 12,261,119
- Issue date Mar 25, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi Koezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,255,139
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...
- Publication number 20250157931
- Publication date May 15, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Bernhard KÖNIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
- Publication number 20250157935
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250157933
- Publication date May 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250157537
- Publication date May 15, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157964
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250157934
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Suhyun BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149446
- Publication date May 8, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shoki MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
- Publication number 20250151281
- Publication date May 8, 2025
- Lodestar Licensing Group LLC
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECTION STRUCTURE OF HIGH-DENSITY THREE-DIMENSIONAL (3D)-ST...
- Publication number 20250149445
- Publication date May 8, 2025
- CHENGDU PBM TECHNOLOGY LTD.
- JACK ZEZHONG PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20250149451
- Publication date May 8, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20250151376
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149452
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- JINSUB KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20250140611
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Dielectric Material Treated with Microw...
- Publication number 20250140553
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION
- Publication number 20250140609
- Publication date May 1, 2025
- International Business Machines Corporation
- Nicholas Latham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140683
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Pu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT WITH INTEGRATED ETCH STOP LAYER
- Publication number 20250142949
- Publication date May 1, 2025
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20250140697
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...
- Publication number 20250132301
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY SELF-INSULATED VIA
- Publication number 20250132245
- Publication date Apr 24, 2025
- Intel Corporation
- Tofizur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE STRING DRIVERS HAVING SHARED PILLAR STRUCTURE
- Publication number 20250133740
- Publication date Apr 24, 2025
- Lodestar Licensing Group, LLC
- Akira Goda
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING T...
- Publication number 20250132196
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Yao-Hsiung KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR...
- Publication number 20250125262
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA
- Publication number 20250125192
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Insulating materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit structure with backside dielectric layer having...

Interconnect structure without barrier layer on bottom surface of via

Semiconductor device with composite conductive features and method...

Interconnect structure and method for manufacturing the interconnec...

Semiconductor device structure with fluorine-catching layer

Semiconductor device with self-aligned conductive features

Semiconductor device with multilayer insulating layer in recess and...

Method for forming semiconductor structure

System and method of forming a porous low-k structure

Conformal low temperature hermetic dielectric diffusion barriers

Method for forming semiconductor structure

Die interconnect substrate, an electrical device and a method for f...

Method of manufacturing tsemiconductor device having bonding structure

Semiconductor device and method of manufacturing the same

Semiconductor device structure with silicide portion between conduc...

Forming method for semiconductor structure and semiconductor structure

Methods of forming spacers for semiconductor devices including back...

Semiconductor device with multi-carbon-concentration dielectrics

Semiconductor device with composite conductive features and method...

Interconnection structure having air gap and method for manufacturi...

Semiconductor interconnection structures and methods of forming the...

Top hat structure for isolation capacitors

Semiconductor device and methods of manufacture

Enlarging contact area and process window for a contact via

Integrated chip with an etch-stop layer forming a cavity

Interconnection structure with composite isolation feature and meth...

Method for manufacturing semiconductor device with impurity doped o...

Structure and method for a low-k dielectric with pillar-type air-gaps

Multi-layer line structure

Semiconductor devices

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING CONTACT...

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

Integrated Assemblies and Methods of Forming Integrated Assemblies

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS

INTERCONNECTION STRUCTURE OF HIGH-DENSITY THREE-DIMENSIONAL (3D)-ST...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

SEMICONDUCTOR DEVICE

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

Semiconductor Device Having Dielectric Material Treated with Microw...

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

GATE CUT WITH INTEGRATED ETCH STOP LAYER

INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER

METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRICALLY SELF-INSULATED VIA

INTERCONNECTION STRUCTURE

MULTI-GATE STRING DRIVERS HAVING SHARED PILLAR STRUCTURE

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING T...

IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR...

AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...