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last 30 patents
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Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,973,027
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure having air gap and method for formin...
Patent number
11,972,975
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
Patent number
11,967,522
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jyh-Nan Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Methods of manufacturing semiconductor chip
Patent number
11,967,529
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Byung-moon Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple-stack three-dimensional memory device and fabrication meth...
Patent number
11,968,832
Issue date
Apr 23, 2024
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating pattern collapse
Patent number
11,961,761
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chih-Yuan Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
Patent number
11,961,803
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for interlevel dielectric layer with regions o...
Patent number
11,955,421
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photosensitive resin composition, photosensitive resin sheet, cured...
Patent number
11,953,830
Issue date
Apr 9, 2024
Toray Industries, Inc.
Yusuke Komori
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor memory structure
Patent number
11,956,946
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yexiao Yu
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device structure and methods of forming the same
Patent number
11,948,879
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Lin-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,948,888
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Hongsik Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via patterning for integrated circuits
Patent number
11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface modification layer for conductive feature formation
Patent number
11,942,362
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jian-Jou Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch stop layer in integrated circuits
Patent number
11,942,419
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shiu-Ko JangJian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and method of making thereof using...
Patent number
11,942,429
Issue date
Mar 26, 2024
SanDisk Technologies LLC
Tatsuya Hinoue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of the same
Patent number
11,935,844
Issue date
Mar 19, 2024
Texas Instruments Incorporated
Enis Tuncer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming integrated semiconductor device with 2D material...
Patent number
11,935,890
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition for integrated circuit interconnect structures
Patent number
11,935,783
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with underfill containment barrier
Patent number
11,935,805
Issue date
Mar 19, 2024
Intel Corporation
Rahul Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure with backside dielectric layer having...
Patent number
11,935,781
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
Patent number
11,929,281
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia Cheng Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Damascene process using cap layer
Patent number
11,929,329
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Cheng Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electro-migration barrier for interconnect
Patent number
11,923,304
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Jen Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming apparatuses having tungsten-containing structures
Patent number
11,923,305
Issue date
Mar 5, 2024
Micron Technology, Inc.
Luca Fumagalli
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Publication number
20240145384
Publication date
May 2, 2024
Micron Technology, Inc.
Akira Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
Publication number
20240145391
Publication date
May 2, 2024
Tahoe Research, Ltd.
Christopher J. JEZEWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
Publication number
20240147729
Publication date
May 2, 2024
Lodestar Licensing Group LLC
Haitao Liu
G11 - INFORMATION STORAGE
Information
Patent Application
Substrate with Differing Dielectric Constants
Publication number
20240145392
Publication date
May 2, 2024
Avago Technologies International Sales Pte. Limited
Dharmendra Saraswat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Publication number
20240136221
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shao-Kuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-STRESS PASSIVATION LAYER
Publication number
20240136291
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiang-Ku SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
Publication number
20240128191
Publication date
Apr 18, 2024
International Business Machines Corporation
Tsung-Sheng Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20240128180
Publication date
Apr 18, 2024
Hyundai Motor Company
Myung Ill You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
Publication number
20240113024
Publication date
Apr 4, 2024
International Business Machines Corporation
Ching-Tzu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
Publication number
20240113042
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
Publication number
20240113012
Publication date
Apr 4, 2024
Micron Technology, Inc.
Collin Howder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRON...
Publication number
20240105600
Publication date
Mar 28, 2024
Kyocera Corporation
Yoshiki KAWAZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR F...
Publication number
20240105621
Publication date
Mar 28, 2024
Intel Corporation
Robert Alan MAY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS
Publication number
20240105635
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED FET CONTACT FORMATION
Publication number
20240105590
Publication date
Mar 28, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP
Publication number
20240105620
Publication date
Mar 28, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTI-FUSE ELEMENT AND LIGHT-EMITTING DEVICE
Publication number
20240105594
Publication date
Mar 28, 2024
Nichia Corporation.
Hisashi KASAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240096642
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240096796
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Yongjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240096797
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
MINJAE KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER LINE STRUCTURE
Publication number
20240088040
Publication date
Mar 14, 2024
DAI NIPPON PRINTING CO., LTD.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
Publication number
20240088042
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
SHU-WEI LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICO...
Publication number
20240090194
Publication date
Mar 14, 2024
Semiconductor Energy Laboratory Co., Ltd.
Yuichi SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...
Publication number
20240087980
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
Publication number
20240087949
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Zhen YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...
Publication number
20240088022
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Teng Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
Publication number
20240088025
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE
Publication number
20240079267
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Cheng SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
Publication number
20240079266
Publication date
Mar 7, 2024
TESSERA LLC
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS