Insulation resistance

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CPC
H05K2201/0761

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0761Insulation resistance

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Case with isolation barriers
- Patent number 11,792,919
- Issue date Oct 17, 2023
- Murata Manufacturing Co., Ltd.
- Lee Francis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive board
- Patent number 11,044,817
- Issue date Jun 22, 2021
- Polytronics Technology Corp.
- Kuo-Hsun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern safety device for preventing interference between patterns
- Patent number 10,285,262
- Issue date May 7, 2019
- G-SMATT CO., LTD.
- Ho Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and power supply device
- Patent number 10,223,996
- Issue date Mar 5, 2019
- Samsung Electronics Co., Ltd.
- Sung Yong Joo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Power semiconductor module system having a high isolation strength...
- Patent number 9,622,341
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displaceable insulation barrier
- Patent number 9,601,850
- Issue date Mar 21, 2017
- Phoenix Contact GmbH & Co. KG
- Frank Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a backlight module for a printed circuit board
- Patent number 9,545,012
- Issue date Jan 10, 2017
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Che-chang Hu
- F21 - LIGHTING
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 9,491,858
- Issue date Nov 8, 2016
- FUJIFILM Corporation
- Yasushi Endo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backlight module, printed circuit board used for backlight module,...
- Patent number 9,084,345
- Issue date Jul 14, 2015
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Che-chang Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CCL and method of manufacturing the same
- Patent number 8,911,848
- Issue date Dec 16, 2014
- Samsung Electronics Co., Ltd.
- Young Kyung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation circuit board, and power semiconductor device or inverte...
- Patent number 8,853,559
- Issue date Oct 7, 2014
- Hitachi, Ltd.
- Hironori Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Early detection of environmental conditions that will lead to creep...
- Patent number 8,823,535
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Levente Klein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board and a printed circ...
- Patent number 8,663,484
- Issue date Mar 4, 2014
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Noise dampening energy efficient circuit board and method for const...
- Patent number 8,569,631
- Issue date Oct 29, 2013
- Tangitek, LLC
- Robert L. Doneker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board and a printed circ...
- Patent number 8,465,656
- Issue date Jun 18, 2013
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device and power converter
- Patent number 8,426,746
- Issue date Apr 23, 2013
- Kabushiki Kaisha Yaskawa Denki
- Yasunori Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board fabrication method
- Patent number 8,402,648
- Issue date Mar 26, 2013
- Fujitsu Limited
- Daita Tsubamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming wiring board and wiring board obtained
- Patent number 8,378,227
- Issue date Feb 19, 2013
- FUJIFILM Corporation
- Seiichi Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and memory card using the same
- Patent number 8,110,434
- Issue date Feb 7, 2012
- Kabushiki Kaisha Toshiba
- Takashi Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern forming method and pattern forming apparatus
- Patent number 8,034,401
- Issue date Oct 11, 2011
- Canon Kabushiki Kaisha
- Seiichi Kamiya
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printed circuit adapted to detecting accidental heating
- Patent number 7,817,052
- Issue date Oct 19, 2010
- Valeo Etudes Electroniques
- Etienne Suzzoni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for enhancing the resolution of a thermally transferred pat...
- Patent number 7,744,717
- Issue date Jun 29, 2010
- E. I. Du Pont de Nemours and Company
- Gerald Donald Andrews
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and memory card using the same
- Patent number 7,679,174
- Issue date Mar 16, 2010
- Kabushiki Kaisha Toshiba
- Takashi Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, its manufacturing method, and circuit device
- Patent number 7,495,177
- Issue date Feb 24, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Tatsuo Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 7,476,328
- Issue date Jan 13, 2009
- Nitto Denko Corporation
- Takashi Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having test coupon and method for evaluating the circ...
- Patent number 7,333,346
- Issue date Feb 19, 2008
- Denso Corporation
- Tomoyuki Miyagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic member, method for making the same, and semiconductor de...
- Patent number 7,312,145
- Issue date Dec 25, 2007
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etchant and replenishment solution therefor, and etching method and...
- Patent number 7,285,229
- Issue date Oct 23, 2007
- MEC Company, Ltd.
- Masayo Kuriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240224409
- Publication date Jul 4, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CASE WITH ISOLATION BARRIERS
- Publication number 20220132657
- Publication date Apr 28, 2022
- Murata Manufacturing Co., Ltd.
- Lee FRANCIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20210059056
- Publication date Feb 25, 2021
- POLYTRONICS TECHNOLOGY CORP.
- Kuo-Hsun CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLORED THIN COVERING FILM AND MANUFACTURING METHOD
- Publication number 20180249572
- Publication date Aug 30, 2018
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
Bus Structure with sealed dielectric interface to semiconductor swi...
- Publication number 20160198562
- Publication date Jul 7, 2016
- SBE INC.
- Michael Brubaker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module System Having a High Isolation Strength...
- Publication number 20160029478
- Publication date Jan 28, 2016
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Backlight Module, Printed Circuit Board Used for Backlight Module,...
- Publication number 20140192514
- Publication date Jul 10, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Che-chang Hu
- G02 - OPTICS
Information Patent Application
Early Detection of Environmental Conditions That Will Lead to Creep...
- Publication number 20140152449
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Levente Klein
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods for Obtaining Large Creepage Isolation on Print...
- Publication number 20130269982
- Publication date Oct 17, 2013
- Dejan Teofilovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CCL AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130136887
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Young Kyung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FIN...
- Publication number 20130058062
- Publication date Mar 7, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenya Tachibana
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSULATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE OR INVERTE...
- Publication number 20120127684
- Publication date May 24, 2012
- Hironori Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND POWER CONVERTER
- Publication number 20110226514
- Publication date Sep 22, 2011
- KABUSHIKI KAISHA YASKAWA DENKI
- Yasunori Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE DAMPENING ENERGY EFFICIENT CIRCUIT BOARD AND METHOD FOR CONST...
- Publication number 20110209909
- Publication date Sep 1, 2011
- MIXZON INCORPORATED
- Robert L. Doneker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...
- Publication number 20110171367
- Publication date Jul 14, 2011
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...
- Publication number 20110051387
- Publication date Mar 3, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenya TACHIBANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...
- Publication number 20100139959
- Publication date Jun 10, 2010
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...
- Publication number 20100126762
- Publication date May 27, 2010
- Sumitomo Metal Mining Co., Ltd.
- Harumi Nagao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MEMORY CARD USING THE SAME
- Publication number 20100120203
- Publication date May 13, 2010
- Kabushiki Kaisha Toshiba
- Takashi OKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming wiring board and wiring board obtained
- Publication number 20100078208
- Publication date Apr 1, 2010
- FUJIFILM CORPORATION
- Seiichi Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELIMINATING ENGRAVING DEFECTS FROM A METAL FILM DEPOSITE...
- Publication number 20090314145
- Publication date Dec 24, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jacqueline Bablet
- B08 - CLEANING
Information Patent Application
PRINTED CIRCUIT BOARD FABRICATION METHOD, PRINTED CIRCUIT BOARD OBT...
- Publication number 20090294169
- Publication date Dec 3, 2009
- FUJITSU LIMITED
- Daita TSUBAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING METAL WIRING BOARD
- Publication number 20090266589
- Publication date Oct 29, 2009
- UBE INDUSTRIES, LTD.
- Hiroto Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING
- Publication number 20090211786
- Publication date Aug 27, 2009
- Keita Bamba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED and the promptly fabricating material structure and the connect...
- Publication number 20090201680
- Publication date Aug 13, 2009
- JOYIN TECHNOLOGY INC.
- Hsien-Ching Chang
- F21 - LIGHTING
Information Patent Application
Molded circuit component and process for producing the same
- Publication number 20090123702
- Publication date May 14, 2009
- Norio Yoshizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ELECTRODES WITH REDUCED RESIDUE
- Publication number 20090120901
- Publication date May 14, 2009
- PixelOptics Inc.
- Lawrence Keith White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Which Can Detect Accidental Heating
- Publication number 20080265669
- Publication date Oct 30, 2008
- VALEO ETUDES ELECTRONIQUES
- Etienne Suzzoni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board, Process For Producing the Same and Semiconduc...
- Publication number 20080236872
- Publication date Oct 2, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tatsuo Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Aqueous Solution and Method for Removing Ionic Contaminants from th...
- Publication number 20080200360
- Publication date Aug 21, 2008
- Atotech Deutschland GmbH
- Thomas Beck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Insulation resistance

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Case with isolation barriers

Colored thin covering film and manufacturing method

Thermally conductive board

Pattern safety device for preventing interference between patterns

Display apparatus and power supply device

Power semiconductor module system having a high isolation strength...

Displaceable insulation barrier

Method of making a backlight module for a printed circuit board

Printed wiring board and method for manufacturing printed wiring board

Circuit board

Backlight module, printed circuit board used for backlight module,...

CCL and method of manufacturing the same

Insulation circuit board, and power semiconductor device or inverte...

Early detection of environmental conditions that will lead to creep...

Method for manufacturing a printed circuit board and a printed circ...

Noise dampening energy efficient circuit board and method for const...

Method for manufacturing a printed circuit board and a printed circ...

Electronic device and power converter

Printed circuit board fabrication method

Method of forming wiring board and wiring board obtained

Semiconductor device and memory card using the same

Pattern forming method and pattern forming apparatus

Printed circuit adapted to detecting accidental heating

Process for enhancing the resolution of a thermally transferred pat...

Semiconductor device and memory card using the same

Printed wiring board, its manufacturing method, and circuit device

Method of manufacturing printed circuit board

Circuit board having test coupon and method for evaluating the circ...

Electronic member, method for making the same, and semiconductor de...

Etchant and replenishment solution therefor, and etching method and...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CASE WITH ISOLATION BARRIERS

THERMALLY CONDUCTIVE BOARD

COLORED THIN COVERING FILM AND MANUFACTURING METHOD

Bus Structure with sealed dielectric interface to semiconductor swi...

Power Semiconductor Module System Having a High Isolation Strength...

Backlight Module, Printed Circuit Board Used for Backlight Module,...

Early Detection of Environmental Conditions That Will Lead to Creep...

Systems and Methods for Obtaining Large Creepage Isolation on Print...

CCL AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FIN...

INSULATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE OR INVERTE...

ELECTRONIC DEVICE AND POWER CONVERTER

NOISE DAMPENING ENERGY EFFICIENT CIRCUIT BOARD AND METHOD FOR CONST...

METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...

METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUC...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRC...

SEMICONDUCTOR DEVICE AND MEMORY CARD USING THE SAME

Method of forming wiring board and wiring board obtained

METHOD FOR ELIMINATING ENGRAVING DEFECTS FROM A METAL FILM DEPOSITE...

PRINTED CIRCUIT BOARD FABRICATION METHOD, PRINTED CIRCUIT BOARD OBT...

PROCESS FOR PRODUCING METAL WIRING BOARD

PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING

LED and the promptly fabricating material structure and the connect...

Molded circuit component and process for producing the same

PATTERNED ELECTRODES WITH REDUCED RESIDUE

Printed Circuit Which Can Detect Accidental Heating

Printed Wiring Board, Process For Producing the Same and Semiconduc...

Aqueous Solution and Method for Removing Ionic Contaminants from th...