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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/823475
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Patents Grants
last 30 patents
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Patent Grant
Etch profile control of via opening
Patent number
11,942,371
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sideways vias in isolation areas to contact interior layers in stac...
Patent number
11,942,416
Issue date
Mar 26, 2024
Intel Corporation
Ehren Mannebach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,942,470
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Peng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Dielectric protection layer in middle-of-line interconnect structur...
Patent number
11,942,372
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Da Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing semiconductor devices
Patent number
11,935,835
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Hyo-Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source or drain structures with vertical trenches
Patent number
11,935,887
Issue date
Mar 19, 2024
Intel Corporation
Ryan Keech
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,929,366
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Sunyoung Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming via structure having low interface resistance
Patent number
11,929,321
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Li-Zhen Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deep trench capacitor fuse structure for high voltage breakdown def...
Patent number
11,923,355
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,923,249
Issue date
Mar 5, 2024
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact formation method and related structure
Patent number
11,915,971
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chao-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and fabrication method thereof
Patent number
11,908,906
Issue date
Feb 20, 2024
Semiconductor Manufacturing International (Shanghai) Corporation
Hailong Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,858
Issue date
Feb 20, 2024
Samsung Electronics Co., Ltd.
Sung Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with gate electrode with flat upper surface an...
Patent number
11,901,358
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Myungsoo Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
FinFET devices with a backside power rail and a backside self-align...
Patent number
11,901,456
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shi Ning Ju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure
Patent number
11,901,238
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Chuan Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having fin-type active patterns with shared co...
Patent number
11,901,422
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Deok Han Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
11,901,359
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Seung Soo Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming semiconductor device structures
Patent number
11,901,219
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate-all-around integrated circuit structures fabricated using alte...
Patent number
11,894,368
Issue date
Feb 6, 2024
Intel Corporation
Sudipto Naskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming a semiconductor device
Patent number
11,894,273
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making gate structure of a semiconductor device
Patent number
11,894,443
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit wiring techniques for stacked transistor structures
Patent number
11,894,303
Issue date
Feb 6, 2024
International Business Machines Corporation
Dongbing Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,894,373
Issue date
Feb 6, 2024
United Microelectronics Corp.
Po-Yu Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Implantations for forming source/drain regions of different transis...
Patent number
11,895,819
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Dian-Sheg Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power switch for backside power distribution
Patent number
11,887,978
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jack Liu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Lateral transistors and methods with low-voltage-drop shunt to body...
Patent number
11,888,047
Issue date
Jan 30, 2024
MaxPower Semiconductor, Inc.
Mohamed N. Darwish
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
Patent number
11,887,838
Issue date
Jan 30, 2024
Intel Corporation
Anthony St. Amour
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of fabricating semiconductor device
Patent number
11,882,691
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Seung-Heon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
Patent number
11,881,520
Issue date
Jan 23, 2024
Intel Corporation
Curtis Ward
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240105779
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Yen LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240105555
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Satyabrata DASH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
Publication number
20240105520
Publication date
Mar 28, 2024
Intel Corporation
Anthony ST. AMOUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR BACKSIDE TRANSISTOR INTEGRATION WITH BACKSIDE POWER D...
Publication number
20240105605
Publication date
Mar 28, 2024
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCAL FRONTSIDE POWER RAIL WITH GLOBAL BACKSIDE POWER DELIVERY
Publication number
20240105608
Publication date
Mar 28, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BURIED POWER RAIL DIRECTLY CONTACTING BACKSIDE POWER DELIVERY NETWORK
Publication number
20240105607
Publication date
Mar 28, 2024
International Business Machines Corporation
SOMNATH GHOSH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TR...
Publication number
20240105716
Publication date
Mar 28, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT B...
Publication number
20240096867
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Charles Chew-Yuen YOUNG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING THIN FILM TRANSISTOR AND METHOD FOR...
Publication number
20240096706
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing company Ltd.
YEN-CHUNG HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA RESISTANCE TO BACKSIDE POWER RAIL
Publication number
20240096752
Publication date
Mar 21, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI
Publication number
20240096699
Publication date
Mar 21, 2024
International Business Machines Corporation
Chen Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH DEEP TRENCH LAST FLOW
Publication number
20240096751
Publication date
Mar 21, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20240096791
Publication date
Mar 21, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contacts for Semiconductor Devices and Methods of Forming the Same
Publication number
20240088244
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Meng-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
S-Contact for SOI
Publication number
20240088151
Publication date
Mar 14, 2024
pSemi Corporation
Befruz Tasbas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
Publication number
20240088033
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chao-Kai Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
Publication number
20240087960
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240087959
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
YU-XUAN HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CUT METAL GATE TO ACHIEVE MINIMUM CELL PITCHES, REDUCING ROU...
Publication number
20240088030
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Liang CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
Publication number
20240087949
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Zhen YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...
Publication number
20240088141
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT MARK FOR BACK SIDE POWER CONNECTIONS
Publication number
20240079294
Publication date
Mar 7, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
Publication number
20240079329
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
EUN SUNG KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
Publication number
20240079330
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Wonhyuk Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH VIA WITH GUARD RING STRUCTURE
Publication number
20240071956
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih Hsin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FET SUBSTRATE TRIMMING WITH IMPROVED VIA PLACEMENT
Publication number
20240071925
Publication date
Feb 29, 2024
International Business Machines Corporation
Liqiao Qin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240072117
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Gukhee Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIELD EFFECT TRANSISTOR WITH CONTACT VIA STRUCTURES THAT ARE LATERA...
Publication number
20240063062
Publication date
Feb 22, 2024
SANDISK TECHNOLOGIES LLC
Kouta ONOGI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD...
Publication number
20240063116
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
WEI-ZHONG LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD...
Publication number
20240063115
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
WEI-ZHONG LI
H01 - BASIC ELECTRIC ELEMENTS