Interconnections between the MEMS and external electrical signals

Industry

CPC
B81B7/007

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/007Interconnections between the MEMS and external electrical signals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiaxis sensing system for detection of airborne molecules and ra...
- Patent number 11,940,576
- Issue date Mar 26, 2024
- National Technology & Engineering Solutions of Sandia, LLC
- Mark D. Allendorf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro hemispherical resonator gyroscope, and an assembly method and...
- Patent number 11,920,932
- Issue date Mar 5, 2024
- NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY
- Xuezhong Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,897,761
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical contacting and method for producing an electrical contac...
- Patent number 11,897,758
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,891,298
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Root mean square sensor device
- Patent number 11,884,538
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Marco Corsi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device
- Patent number 11,885,621
- Issue date Jan 30, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koichiro Nakashima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Parasitic insensitive sampling in sensors
- Patent number 11,867,584
- Issue date Jan 9, 2024
- pSemi Corporation
- Vishnu Srinivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) rectifier and storage element...
- Patent number 11,858,807
- Issue date Jan 2, 2024
- X Development LLC
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor control method
- Patent number 11,834,329
- Issue date Dec 5, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Marc Sansa Perna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS encapsulation employing lower pressure and higher pressure dep...
- Patent number 11,834,331
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond wave optimization method and device
- Patent number 11,834,332
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,833,542
- Issue date Dec 5, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
On-chip signal path with electrical and physical connection
- Patent number 11,802,041
- Issue date Oct 31, 2023
- Invensense, Inc.
- Peter George Hartwell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,784,296
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrating beam accelerometer with pressure damping
- Patent number 11,754,591
- Issue date Sep 12, 2023
- Honeywell International Inc.
- John Reinke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
- Publication number 20240076181
- Publication date Mar 7, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE
- Publication number 20240059554
- Publication date Feb 22, 2024
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE
- Publication number 20240034620
- Publication date Feb 1, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yung-Hsiang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ASSEMBLY AND METHOD OF MAKING A CHIP ASSEMBLY
- Publication number 20230400788
- Publication date Dec 14, 2023
- NPL Management Limited
- Alastair SINCLAIR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230382721
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bond Wave Optimization Method and Device
- Publication number 20230382723
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP MICROMIRROR TECHNOLOGY
- Publication number 20230375822
- Publication date Nov 23, 2023
- Microsoft Technology Licensing, LLC
- Xiao Chuan ONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
- Publication number 20230345184
- Publication date Oct 26, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS
- Publication number 20230308076
- Publication date Sep 28, 2023
- Stathera IP Holdings Inc.
- Vamsy P. Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND SENSOR MODULE
- Publication number 20230257258
- Publication date Aug 17, 2023
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
- Publication number 20230235664
- Publication date Jul 27, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Remi Robutel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Charge Controlled Clamp for MEMS Readout Circuits
- Publication number 20230219807
- Publication date Jul 13, 2023
- INFINEON TECHNOLOGIES AG
- Hong Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE
- Publication number 20230207412
- Publication date Jun 29, 2023
- Intel Corporation
- Ronald SPREITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE-AXIS INERTIAL SENSOR MODULE WITH INTERPOSER
- Publication number 20230133753
- Publication date May 4, 2023
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...
- Publication number 20230138355
- Publication date May 4, 2023
- X Development LLC
- Amit Lal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20230126598
- Publication date Apr 27, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnections between the MEMS and external electrical signals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing the same

Hollow package and method for manufacturing same

Multiaxis sensing system for detection of airborne molecules and ra...

Packaging of microfluidic devices and microfluidic integrated syste...

Micro hemispherical resonator gyroscope, and an assembly method and...

Enclosed cavity structures

Semiconductor device and method of manufacturing semiconductor device

Electrical contacting and method for producing an electrical contac...

Semiconductor device and method for forming the same

Sensing module and manufacturing method thereof

Process for manufacturing microelectromechanical devices, in partic...

Enclosed cavity structures

Root mean square sensor device

Sensor device

Parasitic insensitive sampling in sensors

Microelectromechanical systems (MEMS) rectifier and storage element...

Wafer level stacked structures having integrated passive features

Microelectromechanical system (MEMS) sensor packages and methods fo...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Sensor control method

MEMS encapsulation employing lower pressure and higher pressure dep...

Bond wave optimization method and device

CMOS ultrasonic transducers and related apparatus and methods

Enclosed cavity structures

Microfabricated ultrasonic transducers and related apparatus and me...

On-chip signal path with electrical and physical connection

Semiconductor device package and a method of manufacturing the same

Vibrating beam accelerometer with pressure damping

Sacrificial redistribution layer in microelectronic assemblies havi...

Chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

MEMS MODULE

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

MEMS Structure with Reduced Peeling and Methods Forming the Same

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY

MEMS PRESSURE SENSOR

CHIP ASSEMBLY AND METHOD OF MAKING A CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

STACKED-DIE MEMS RESONATOR

Wafer level package for device

Bond Wave Optimization Method and Device

FLIP CHIP MICROMIRROR TECHNOLOGY

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS

SEMICONDUCTOR DEVICE AND SENSOR MODULE

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

Charge Controlled Clamp for MEMS Readout Circuits

TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE

Semiconductor Device and Method of Making a MEMS Semiconductor Package

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

SINGLE-AXIS INERTIAL SENSOR MODULE WITH INTERPOSER

MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT...

Attachment of Stress Sensitive Integrated Circuit Dies