This application claims the priority benefit of Italian Application for Patent No. 10,202,3000005940 filed on Mar. 28, 2023, the content of which is hereby incorporated by reference in its entirety to the maximum extent allowable by law.
This disclosure relates to a method for manufacturing a MEMS (Micro-Electro-Mechanical System) device, in particular an electroacoustic transducer device, and relates to a MEMS device. In particular, the method enables manufacture of an electroacoustic MEMS device with thin membrane and exposed surface of the membrane that is uniformly planar or flat, without any cavities or depressions or mechanical-reinforcement structures.
As is known, there are today available numerous ultrasonic sensors, which are designed to transmit and receive acoustic waves with frequencies higher than 20 kHz. Typically, an ultrasonic sensor comprises, in addition to a transducer of an electro-acoustic type, a circuitry designed to drive the transducer, as well as to amplify the electrical signals generated by the transducer itself following upon reception of acoustic echo signals. The transducer thus functions both as acoustic emitter and as acoustic receiver, in different time periods.
If by “acoustic stimulation signals” and “acoustic response signals” the acoustic signals (or beams) transmitted by the transducer and the acoustic signals (or beams) that impinge upon the transducer are respectively meant, for example following upon reflection of the acoustic stimulation signals by an obstacle, it is known that there is the desire, for example in the sonographic field, to be able to focus the acoustic stimulation signals. In order to control emission in space of the acoustic stimulation signals, a technique is known that envisages having available a plurality of transducers, each of which emits spherical acoustic waves, and governing said transducers with driving signals appropriately staggered with respect to one another so that the sum of the acoustic stimulation signals generated by the transducers will form an acoustic beam having the desired spatial distribution.
This having been said, in order to increase the performance, in particular regarding amplification of the echo, it is desired for the transducers, typically formed by corresponding MEMS devices arranged in a matrix array, to be located as close as possible to the electronic circuitry, and in particular to the part of electronic circuitry entrusted with amplifying the electrical signals generated by the transducers. However, this conflicts with the high number of transducers (in the region of one thousand) typically used.
In practice, since each transducer is coupled to a respective ASIC (Application-Specific Integrated Circuit), which forms the driving circuit and the receiver associated to the transducer, the thousands of connections present between the transducers and the ASICs connected thereto are to be managed, such management including controlling the delays introduced by the various channels (each channel being understood as being formed by a transducer, the corresponding driving circuit, and the corresponding receiver), as well as the jitter present between the different channels.
This having been said, currently known are manufacturing methods that envisage manufacture of a semiconductor wafer so as to form, in the first wafer, a plurality of transducers, and a second structure manufactured according to a technology known as FOWLP (Fan-Out Wafer-Level Package) so as to integrate, in said second structure, a plurality of ASICs. Next, the first wafer and the FOWLP structure are coupled together so that the transducers are operatively coupled to the corresponding ASICs. This method, however, is characterized by a reduced flexibility, since it envisages adopting a single technology both for the driving circuits and for the receiving circuits. Further, this manufacturing method enables testing of the ASICs only when it is completed. Furthermore, this manufacturing method involves the pitch between the electrical connection pads being the same in the semiconductor wafer and in the FOWLP structure.
United States Patent Application Publication No. 2023/0028024 (incorporated herein by reference) describes a method for manufacturing a device comprising a plurality of electroacoustic modules (transducers). This solution, however, envisages the formation of a plurality of cavities in the membrane, in a position corresponding to each electroacoustic module. During use, when, for example, the device is used for emission of acoustic waves for biomedical applications, these cavities are be filled with an appropriate material, such as a silicone gel to improve the coupling between the body of the patient and the electroacoustic modules. The presence of the cavities may render this operation problematical or, if this operation is not carried out properly, unsatisfactory from the standpoint of complete filling of the cavities.
There is a need in the art for a method for manufacturing a MEMS device, and a corresponding MEMS device, that are designed to overcome at least in part the drawbacks of the prior art.
Embodiments herein concern a method for manufacturing a MEMS device and the corresponding MEMS device.
Indeed, disclosed herein is a method for manufacturing a microelectromechanical systems (MEMS) device. The method includes: forming a first solid body that forms a layered structure on a substrate, wherein the layered structure has a first surface that is planar throughout an extension thereof and that faces the substrate; forming a plurality of transducer devices on a second surface of the layered structure that is opposite to the first surface in a direction; coupling the first solid body to a supporting structure; and completely removing the substrate to expose said first surface.
The layered structure may form a membrane, and the plurality of transducer devices may be arranged on the membrane.
The supporting structure may be a TSV (Trough-Silicon Via) wafer.
Forming the first solid body may include forming the supporting structure as a wafer manufactured using FOWLP (Fan-Out Wafer-Level Package) technology having a first side coupled to the first solid body and a second side, opposite to the first side in said direction, coupled to a supporting adhesive tape.
The supporting structure may be formed to include a plurality of integrated circuit dice manufactured using FOWLP technology, each die having a first side coupled to the first solid body and a second side, opposite to the first side in said direction, coupled to a supporting adhesive tape.
The supporting structure may be formed to include a second solid body that includes application specific integrated circuit (ASIC) dice and a redistribution structure. The redistribution structure may be formed to have a first side coupled to the first solid body and a second side, opposite to the first side in said direction, facing the ASIC dice, and wherein conductive paths extend between the first and second sides in electrical connection with the ASIC dice. The supporting structure may be further formed to include a supporting adhesive tape coupled to the second solid body in a position corresponding to said ASIC dice.
The method may further include forming mechanical and electrical coupling structures between the first solid body and the supporting structure.
The method may further include electrically coupling respective coupling structures of said plurality of coupling structures to respective transducer devices of the plurality of transducer devices.
The method may further include forming a stiffening structure around each transducer device of said plurality of transducer devices.
The method may further include forming a stiffening structure around each transducer device, and the coupling structures may be formed to have a respective cross-section, along a cutting plane orthogonal to said direction, having a shape such as to maximize overlap with the stiffening structure around the respective transducer device.
The mechanical and electrical coupling structures may be formed to have a cross-section with a shape chosen from among the group consisting of: hypocycloidal with a number of cusps equal to or greater than three; triangular; and quadrangular.
The method may include removing the supporting adhesive tape after completely removing the substrate.
The method may include, after completely removing the substrate, coupling a second solid body manufactured using FOWLP technology to the TSV wafer.
The second solid body may be formed to comprise ASIC dice and a redistribution structure, the redistribution structure having a first side coupled to the second solid body and a second side, opposite to the first side in said direction, facing the ASIC dice, and with the conductive paths being formed to extend between the first and second sides of the redistribution structure.
The layered structure may have a thickness of a value ranging between 2 and 50 μm.
Also disclosed herein is a microelectromechanical systems (MEMS) device, including: a first solid body including signal-processing circuitry; a second solid body including a membrane having a first side and a second side opposite to one another in a direction, the first side of the membrane facing the first solid body, the first and second solid bodies being fixed with respect to one another; a plurality of transducer devices which extend on the first side of the membrane; and a plurality of coupling elements which extend between the first and second solid bodies and are configured to electrically couple each transducer device to the signal-processing circuitry; wherein said membrane has a thickness that is uniform in said direction; and wherein the second side of the membrane is planar throughout its extension.
The plurality of transducer devices may share a same membrane.
The first and second solid bodies may be coupled together by a through silicon via (TSV) wafer that extends between the first and second solid bodies, and the first solid body may be a wafer manufactured using fan out wafer level packaging (FOWLP) technology.
The MEMS device may be an ultrasonic transducer device.
The MEMS device may be a piezoelectric micromachined ultrasonic transducer (PMUT).
The thickness of the membrane may have a value ranging between 2 and 50 μm.
For a better understanding, embodiments are now described, purely by way of non-limiting example, with reference to the attached drawings, wherein:
Elements in common between
With joint reference to
In each of the first and second integrated circuits 6, 8, the corresponding transmitting and receiving circuits are electrically connected to a corresponding plurality of metal bumps, designated, respectively, by 18 and 20 and also known as microbumps. The bumps metal 18, 20 are electrically connected to metallizations of the corresponding dice 2, 4, for example via respective electrical contact pads.
The first solid body B1 further comprises a coating region 22, which is made, for example, of an epoxy resin and englobes the first and second dice 2, 4.
The first solid body B1 further comprises a redistribution structure 26, which includes a dielectric region 28 that houses a plurality of conductive paths 30 (represented schematically). The redistribution structure 26 is delimited by a first side 26a and a second side 26b, opposite to one another along the axis Z. The conductive paths 30 extend between the first and second sides, reaching the first and second sides. On the sides 26a, 26b are conductive pads 31 (on the side 26a) and conductive pads 33 (on the side 26b). The conductive paths 30 are electrically connected to the conductive pads 31, 33 to form a vertical-connection path (along Z, between the side 26a and the side 26b).
The dielectric region 28 is made, for example, of polyimide (or else, for example, polyamide or a glass-fiber resin). The conductive paths 30 are typically made of metal material, such as copper.
The electroacoustic device 1 further comprises a second solid body B2.
The second solid body B2 comprises a transduction module or structure 38, electrically coupled to the redistribution structure 26. The coupling between the first and second solid bodies B1, B2 is obtained by a third solid body B3, arranged between the first and second solid bodies B1, B2.
The third solid body B3 is, for example, a wafer of semiconductor material that has a plurality of conductive through vias, also known as TSVs (Through Silicon Vias) 32, formed therein. The third solid body B3 has a first surface 34a opposite to a second surface 34b along the axis Z. The conductive through vias 32 extend between the first surface 34a and the second surface 34b and are in electrical connection with respective pads 37, 39 present on the first surface 34a and the second surface 34b, respectively.
The physical and electrical connection between the first solid body B1 and the third solid body B3 is obtained by a plurality of pillars 36a of metal material (for example, gold, copper, tin, or some other metal material), each of which is electrically and physically coupled to a respective pad 33 and to a respective pad 37. The physical and electrical connection between the second solid body B2 and the third solid body B3 is obtained by a further plurality of pillars 36b of metal material (for example gold, or else copper, or else tin, or some other metal material), each of which is electrically and physically coupled to a respective pad 39 and, as described below, to conductive paths of the transduction structure 38, to carry and acquire the actuation and transduced signals to/from the transduction structure 38. Optionally, and as illustrated in the figure, present between the pillars 36b and the pads 39 are further respective pillars 36c, of conductive material, for example metal material.
The transduction structure 38 comprises a structural body 41 having a first surface 41a opposite to a second surface 41b along the axis Z. Extending over the first surface 41a of the structural body 41 is a layer of insulating material 58.
The structural body 41 and the insulating layer 58 have the function of a membrane designed to deflect, and consequently below the layered structure formed by the body 41 and by the layer 58 will be referred to as a “membrane”, designated in the figure by the reference 42. The membrane 42 extends with a thickness t1 along the axis Z between a top surface 58a, coinciding with the exposed surface of the insulating layer 58, and a bottom surface 41b, coinciding with the bottom surface of the structural body 41. The structural body 41 is made, in particular, and as described more fully hereinafter, of semiconductor material such as silicon. The insulating layer 58 is made, for example, of silicon oxide (SiO2). In particular, the membrane 42 has, in an area corresponding to the second surface 41b of the structural body 41, a surface that is uniformly flat or planar, i.e., that lies in the plane XY, without any protuberances or depressions or recesses (except for a possible surface roughness deriving from the manufacturing process). In other words, the membrane 42 has a uniform thickness, along the axis Z, having a value t1 comprised between approximately 2 and 50 μm, in particular between 2 and 20 μm, even more in particular between 2 and 10 μm, for example 4 μm. The extremes of the aforementioned ranges of thicknesses are included.
The pillars 36b protrude from the membrane along the axis Z in an area corresponding to the surface 58a.
The second solid body B2 further comprises a plurality of transducers 56 (one of which is illustrated in
The membrane 42 and the actuators 56 together form a transducer device, configured to transduce an electrical signal received (control signal) into a mechanical movement of the membrane and, consequently, into an acoustic wave emitted by the electroacoustic device 1. As has been said, the opposite transduction is possible, in addition or as an alternative, according to the conditions of use of the electroacoustic device 1.
In greater detail, each actuator 56 comprises a stack 60, including a respective piezoelectric region (e.g., of PZT-lead-zirconate-titanate) and a pair of driving electrodes configured to bias the piezoelectric region in order to generate a corresponding deformation of the piezoelectric region, in a per se known manner.
Each actuator 56 is surrounded (partially or completely, in respective embodiments) by a stiffening structure 113, on which the pillars 36b extend. In one embodiment, the stiffening structure 113 is formed by the same stack 60 as the actuator 56, in order to simplify the process steps. However, it is evident that the stiffening structure 113 may be made of other materials, for example semiconductor or insulating materials, or a stack including such materials. The stiffening structure 113 has a thickness, along the axis Z, comprised, for example, between 1 μm and 50 μm.
Each actuator 56 is electrically coupled, via respective conductive paths 81, 83, to the pillars 36b. Since, in the case of a piezoelectric actuator, two actuation electrodes are provided (an upper electrode and a lower electrode with respect to the PZT layer),
Via the conductive paths 81, 83 and the pillars 36b, each actuator 56 is electrically coupled to the conductive paths 32 of the third solid body B3 and, consequently, to the redistribution structure 26. In turn, the redistribution structure 26 forms an electrical connection with corresponding bumps 18, 20 of the first and second dice 2, 4, as described previously. In this way, each actuator 56 is designed to receive electrical control signals from the dice 2, 4, which cause corresponding deformations of the membrane 42 mechanically coupled to said actuators 56, with consequent generation of an acoustic wave. Further, the deformation of the membrane 42, due (for example) to an acoustic echo signal impinging thereon, causes a corresponding deformation of the actuator 56, which generates an electrical response signal, which is then sent and is received by the receiving circuit of the dice 2, 4, which may process it (and then may supply a corresponding output signal to an external processor/controller).
In one embodiment, each actuator 56 is connected both to the transmitting circuit and to the receiving circuit of the corresponding die 2, 4.
In a further embodiment, the transmitting and receiving circuits of a die 2, 4 may manage a number of transducers 56.
Further, in each die 2, 4 mechanisms for protection of the receiving circuit may be implemented during the transmission step.
In an embodiment, each pillar 36b has a section (in the plane XY) having one of the following shapes: the shape of a hypocycloid with three cusps (
With reference to
With reference to
With reference to
Each pillar 36b is consequently a solid having a cross-section that is uniform throughout its extension along the axis Z, and has a shape chosen in the design stage from among the shapes listed previously (
In general, the function of the pillars 36b is to increase the stiffness of the structure 38, in particular of the membrane 42. Consequently, the greater the spatial extension of the overlapping portions (in top view in the plane XY) between the pillars 36b and the membrane 42 (with the intermediate presence of the stiffening structure 113), the greater the effect of increase in stiffness. Thus, in general the shape of the pillars 36b may be chosen such as to maximize said portions of overlapping between the pillars 36b and the stiffening structure 113 around each actuator 56.
In an embodiment, each actuator 56 is associated to just two pillars 36b (to carry the respective biasing signals of the two, upper and lower, electrodes). In this case, one of said pillars 36b may have a shape chosen from among the shapes mentioned above (
In the case where more than two pillars are present for each actuator 56, as in the examples illustrated and described in the sequel (e.g.,
In one embodiment, one of the driving electrodes of the actuator 56 (e.g., the lower electrode) is common to all the actuators 56; i.e., it extends with structural and electrical continuity throughout the membrane 42, in contact with all the piezoelectric elements of all the actuators 56 (and electrically insulated from further conductive structures that are present). In this case, it is possible to envisage a single biasing path for said common electrode, said biasing path including a single pillar 36b located in any region of the membrane 42 (not necessarily in the proximity of a specific actuator 56). Alternatively, it is possible to envisage a plurality of conductive paths designed to bias the common electrode at the same time.
In a different embodiment, each actuator 56 is provided with own upper and lower electrodes that are not shared with other actuators 56. In this case, for each actuator 56 at least two respective pillars 36b are provided to carry the biasing signal to the upper and lower electrodes.
In a further embodiment (
Even though in
In an embodiment, each actuator 56 has a circular shape, in top plan view (in the plane XY). The diameter of each actuator 56 is comprised between 7 μm and 150 μm.
As may be noted, for example, from
The topology of shapes proposed for the pillars 36b enables increase of the clamping area and shifting in the undesired bending modes outside the operating bandwidth.
The electroacoustic device 1 may be manufactured on the basis of the method described in what follows.
The method described refers to production of an electroacoustic device comprising a single transducer. However, it is evident that the teaching applies to the production of any plurality of transducers and respective membrane portions 40.
With reference to
Then (
Next (
In the case where the epitaxial growth of the layer 110 were to lead to formation of a layer 110 thicker than desired, it is possible to thin it out by a CMP (Chemical-Mechanical-Planarization) step, until a desired final thickness of the structural layer 110 is reached.
Then (
Next, a step of formation of the actuator 56 and of the stiffening structure is carried out.
In an embodiment (exemplified in
As has been said, the stiffening structure 113 extends (in cross-sectional view) alongside the stack 60 and (in top plan view) and surrounds at least in part (completely, in the embodiment represented) the actuator 56 and the membrane 40.
The stiffening structure 113 is, in one embodiment, formed by the same stack 60 as described previously in order to optimize the manufacturing steps.
However, it is evident that the manufacturing process may envisage a stiffening structure of some other material, a stack of semiconductor and insulating material.
Then (
Next (
As an alternative to what is represented in
Then (
Next (
For this purpose, the wafer 100 is machined to remove, by a CMP step, the semiconductor material on the back side 100b, without reaching the etch stop layer 102; then, thinning is completed by chemical etching to remove completely the semiconductor material on the back side 100b until the etch stop layer 102 is reached. Since the etching chemistry selectively removes the semiconductor material but not the material of the layer 102, etching stops automatically at the layer 102. There is thus formed the membrane 42 (as well as the membrane portions 40). The first solid body B1 also comprises, in this example, the etch stop layer 102. However, it is evident that the etch stop layer 102 may be removed by wet etching.
As an alternative to what has been described, other thinning methodologies may be used (for example, a series of chemical etches without a prior CMP step; or else a CMP step in the absence of a further chemical etch; or others still).
There is thus formed the membrane 42, having the surface 41b without projections or depressions/cavities. In this context, the surface 41b may be the exposed surface of the etch stop layer 102 (if present), or else the surface of the structural layer 110 in the case where the etch stop layer 102 is removed.
Next, as illustrated in
The steps for manufacturing the ASIC wafer 300 (including the redistribution structure 26 and the dice 2, 4) need not be described herein. It may likewise be noted that both the TSV wafer 200 and the ASIC wafer 300 may be obtained in an already manufactured form.
Without this implying any loss of generality, manufacture of the ASIC wafer 300 may be obtained, as has been said with reference to
Simulation steps may then be carried out, in a way not illustrated in detail (e.g., using the plasma-dicing technique).
The first, second, and third solid bodies B1-B3 are thus formed, operatively coupled together, as illustrated in
A packaging step (not described) may be carried out.
Elements in common between
In each of the first and second integrated circuits 6, 8, the corresponding transmitting and receiving circuits are electrically connected to a corresponding plurality of metal bumps, designated, respectively, by 18 and 20 and also known as microbumps. Once again, the bumps 18, 20 are electrically connected to metallizations of the corresponding dice 2, 4, for example via respective electrical contact pads.
The first solid body B1 further comprises a coating region 22, which is made, for example, of an epoxy resin and englobes the first and second dice 2, 4.
The first solid body B1 further comprises the redistribution structure 26, which comprises the dielectric region 28, which houses the plurality of conductive paths 30 (illustrated schematically). The redistribution structure 26 is delimited by a first side 26a and a second side 26b, opposite to one another along the axis Z; the conductive paths 30 extend between the first and second sides, reaching the first and second sides. Present on the sides 26a, 26b are conductive pads 31 (on the side 26a) and conductive pads 33 (on the side 26b); the conductive paths 30 are electrically connected to the conductive pads 31, 33 to form a vertical-connection path (along Z, between the side 26a and the side 26b). The dielectric region 28 is made, for example, of polyimide (or else, for example, polyamide or a glass-fiber resin). The conductive paths 30 are typically made of metal material, such as copper.
The electroacoustic device 1′ further comprises, as has been said, the second solid body B2. The second solid body B2 comprises the transduction module or structure 38, electrically coupled to the redistribution structure 26 by pillars 36′.
The transduction structure 38 comprises the structural body 41 having the first surface 41a opposite, along the axis Z, to the second surface 41b, and the insulating layer 58 on the structural layer 41, which form together the membrane 42. As already noted previously in the respective embodiment, the membrane 42 has, in an area corresponding to the second surface 41b, a surface that is uniformly flat or planar, i.e., lying in the plane XY, without protuberances or depressions or recesses (except for a possible surface roughness deriving from the manufacturing process). In other words, the membrane 42 has a thickness, along the axis Z, that is uniform, having a value t1.
The pillars 36′ protrude from the membrane 42 along the axis Z in a region corresponding to the surface 58a.
The second solid body B2 further comprises the transducers 56 (just one of which is illustrated in
The membrane 42 and the actuators 56 together form a transducer device, configured to transduce an electrical signal received (actuation signal) into a mechanical movement of the membrane and, consequently, into an acoustic wave emitted by the electroacoustic device 1′. The opposite transduction is, as has been said, possible, in addition or as an alternative, according to the conditions of use of the electroacoustic device 1′.
In greater detail, each actuator 56 comprises the stack 60, already described with reference to
Each actuator 56 is surrounded (partially or completely, in respective embodiments) by the stiffening structure 113, on which the pillars 36′ extend. The stiffening structure 113 has been described previously, and this description applies also to
Each actuator 56 is electrically coupled, via respective conductive paths 81, 83, to the pillars 36′. Since in the case of a piezoelectric actuator two actuation electrodes are provided (an upper electrode and a lower electrode with respect to the PZT layer),
Via the conductive paths 81, 83 and the pillars 36′, each actuator 56 is electrically coupled to the pads 33 and, by the latter, to the conductive paths 30 of the redistribution structure 26, which carry the signals from and to the corresponding bumps 18, 20 associated to the first and second dice 2, 4.
In an embodiment, each actuator 56 is connected both to the transmitting circuit and to the receiving circuit of the corresponding dice 2, 4. In a further embodiment, the transmitting and receiving circuits of a die 2, 4 may manage a number of transducers 56. Further, in each die 2, 4 there may be implemented mechanisms of protection of the receiving circuit, during the transmission step.
With reference to
Then (
Next (
Next (
Then (
The stiffening structure 113 is, in any embodiment, formed by the same stack 60 as described previously in order to optimize the manufacturing steps.
However, it is evident that the manufacturing process may envisage a stiffening structure of some other material, such as a stack of semiconductor and insulating material.
Next (
Then (
As an alternative to what is represented in
Then (
Unlike what has been described with reference to
The coupling between the wafer 1100 and the FOWLP 300′ dice is obtained via the pillars 36′. The FOWLP dice 300′ are then arranged on top, along the axis Z, of the wafer 1100 (in particular, on the front side 1100a) and coupled to the pillars 36′ by techniques per se known of welding or bonding.
Then (
Then (
The membrane 42 is thus formed, having the surface 41b without projections or depressions/cavities. In this context, as has been said, the surface 41b may be the exposed surface of the etch stop layer 1102 (if present), or else the surface of the structural layer 1110 in the case where the etch stop layer 1102 is removed.
Singulation steps may then be carried out, in a way not illustrated (e.g., by plasma-dicing technique).
Then, the tape 1200 is removed to obtain the electroacoustic device 1′ of
It is clear that modifications and variations may be made to what has been described and illustrated herein, without thereby departing from the scope of the present invention, as defined in the annexed claims.
For instance, as illustrated in
The alternative embodiment of
Further, as illustrated in
According to a further embodiment (illustrated in
As an alternative (
The conductive through vias 360, irrespective of whether the embodiment of
According to further variants with respect to what has been described previously, each electroacoustic device may comprise a number of dice different from what is illustrated, in which case the manufacturing method is modified accordingly. The transmitting and receiving circuits may be formed in different dice; in this case, the transmitting and receiving circuits may be formed using different technologies.
In general, the actuators may be of a type different from what has been described. For instance, the actuators may implement an actuation mechanism of an electrostatic, instead of piezoelectric, type. Likewise, also the arrangement of the actuators with respect to the corresponding membranes may be different from what has been described.
Furthermore, instead of the bumps 18, 20, other conductive connection elements may be used, such as corresponding pillars. More in general, all the conductive connection elements described herein are provided merely by way of example.
Further, each pillar 36b may, in general, be a hypocycloid having a number of cusps equal to or greater than three (e.g., five).
Furthermore, the shape of each pillar 36b may be different for pillars 36b that are different from one another.
Number | Date | Country | Kind |
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102023000005940 | Mar 2023 | IT | national |