TREA

Interconnects arranged on the substrate or the lid, and covered by the package seal

Follow

Industry

  • CPC
  • B81B2207/097
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/097Interconnects arranged on the substrate or the lid, and covered by the package seal
Industries