Interconnects arranged on the substrate or the lid, and covered by the package seal

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B81B2207/097

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/097Interconnects arranged on the substrate or the lid, and covered by the package seal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device with contact pad
- Patent number 11,897,756
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,383,970
- Issue date Jul 12, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 11,274,036
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low profile transducer module
- Patent number 11,267,698
- Issue date Mar 8, 2022
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nickel lanthanide alloys for MEMS packaging applications
- Patent number 11,091,366
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, physical quantity sensor device, portable...
- Patent number 11,035,875
- Issue date Jun 15, 2021
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging a sealed cavity in an electronic device
- Patent number 10,913,654
- Issue date Feb 9, 2021
- Texas Instruments Incorporated
- Adam Joseph Fruehling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming micro-electro-mechanical system (MEMS) structure
- Patent number 10,865,100
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for connecting at least one nano-object associated with a ch...
- Patent number 10,858,244
- Issue date Dec 8, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Aurelie Thuaire
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with multiple compartments
- Patent number 10,843,918
- Issue date Nov 24, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overmolded lead frame assembly for pressure sensing applications
- Patent number 10,830,656
- Issue date Nov 10, 2020
- Sensata Technologies, Inc.
- Jun H. Bae
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,723,616
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Auxetic interposer for microelectromechanical systems (MEMS) device...
- Patent number 10,696,546
- Issue date Jun 30, 2020
- HRL Laboratories, LLC
- Raviv Perahia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device including a capacitive pressure sensor and manufacturin...
- Patent number 10,689,251
- Issue date Jun 23, 2020
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 10,676,343
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 10,611,629
- Issue date Apr 7, 2020
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging a sealed cavity in an electronic device
- Patent number 10,589,986
- Issue date Mar 17, 2020
- Texas Instruments Incorporated
- Adam Joseph Fruehling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nickel lanthanide alloys for mems packaging applications
- Patent number 10,544,034
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor component having two sensor functions
- Patent number 10,544,035
- Issue date Jan 28, 2020
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device package and method for manufacturing the same
- Patent number 10,472,228
- Issue date Nov 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature self-sealing vacuum packaging
- Patent number 10,407,194
- Issue date Sep 10, 2019
- United States of America as represented by the Secretary of the Navy
- Paul D. Swanson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device including a capacitive pressure sensor and manufacturin...
- Patent number 10,407,301
- Issue date Sep 10, 2019
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device having a bonding wire connected to a terminal at...
- Patent number 10,384,931
- Issue date Aug 20, 2019
- Seiko Epson Corporation
- Teruo Takizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structure including isolatio...
- Patent number 10,343,895
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230382721
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20230034707
- Publication date Feb 2, 2023
- BFLY Operations, Inc
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230002217
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CROSSOVERS FOR VACUUM PACKAGING
- Publication number 20220411261
- Publication date Dec 29, 2022
- Obsidian Sensors, Inc.
- John HONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE WITH CONTACT PAD
- Publication number 20220363532
- Publication date Nov 17, 2022
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210047173
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20210009406
- Publication date Jan 14, 2021
- AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...
- Publication number 20200385263
- Publication date Dec 10, 2020
- SOLID STATE SYSTEM CO., LTD.
- Chien-Hsing Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20200385260
- Publication date Dec 10, 2020
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20200270121
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20200239299
- Publication date Jul 30, 2020
- Butterfly Network, Inc.
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE
- Publication number 20200207611
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Adam Joseph FRUEHLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200165124
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200024130
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS
- Publication number 20190368958
- Publication date Dec 5, 2019
- Sensata Technologies, Inc.
- JUN H. BAE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE
- Publication number 20190315620
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
- Publication number 20190276306
- Publication date Sep 12, 2019
- Amkor Technology, Inc.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
- Publication number 20190238113
- Publication date Aug 1, 2019
- SnapTrack, Inc.
- Roland ROSEZIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20190169019
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20190092622
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE
- Publication number 20190071304
- Publication date Mar 7, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Adam Joseph FRUEHLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190055118
- Publication date Feb 21, 2019
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW PROFILE TRANSDUCER MODULE
- Publication number 20190039882
- Publication date Feb 7, 2019
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE AND METHOD FOR FOR...
- Publication number 20190002275
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects arranged on the substrate or the lid, and covered by the package seal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level packaging of MEMS

Sensing device and method for manufacturing sensing device

Micromechanical device with contact pad

Semiconductor device and method for forming the same

Semiconductor device

Structures for packaging stress-sensitive micro-electro-mechanical...

Semiconductor devices and related methods

Microelectromechanical device with signal routing through a protect...

Low profile transducer module

Nickel lanthanide alloys for MEMS packaging applications

Multi-layer sealing film for high seal yield

Physical quantity sensor, physical quantity sensor device, portable...

Packaging a sealed cavity in an electronic device

Method for forming micro-electro-mechanical system (MEMS) structure

Device for connecting at least one nano-object associated with a ch...

Semiconductor package with multiple compartments

Overmolded lead frame assembly for pressure sensing applications

Structures for packaging stress-sensitive micro-electro-mechanical...

Auxetic interposer for microelectromechanical systems (MEMS) device...

MEMS device including a capacitive pressure sensor and manufacturin...

Multi-layer sealing film for high seal yield

Microelectromechanical device with signal routing through a protect...

Packaging a sealed cavity in an electronic device

Nickel lanthanide alloys for mems packaging applications

Sensor component having two sensor functions

MEMS device package and method for manufacturing the same

Low temperature self-sealing vacuum packaging

MEMS device including a capacitive pressure sensor and manufacturin...

Electronic device having a bonding wire connected to a terminal at...

Micro-electro-mechanical system (MEMS) structure including isolatio...

Patents Applicationslast 30 patents

MEMS DIES EMBEDDED IN GLASS CORES

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

MEMS Structure with Reduced Peeling and Methods Forming the Same

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Wafer level package for device

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

SEMICONDUCTOR DEVICES AND RELATED METHODS

CROSSOVERS FOR VACUUM PACKAGING

MICROMECHANICAL DEVICE WITH CONTACT PAD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND RELATED METHODS

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

OVERMOLDED LEAD FRAME ASSEMBLY FOR PRESSURE SENSING APPLICATIONS

METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE

SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS

COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE

MEMS DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LOW PROFILE TRANSDUCER MODULE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE AND METHOD FOR FOR...