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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

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B81B2207/07Interconnects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 12,338,120
- Issue date Jun 24, 2025
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection for monolithically integrated stacked devices and m...
- Patent number 12,330,189
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES SINGAPOREPTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded permeable polysilicon layer in MEMS device for multiple ca...
- Patent number 12,330,934
- Issue date Jun 17, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Federico Vercesi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with metal column mold barrier
- Patent number 12,319,563
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS environmental sensor and preparation method therefor
- Patent number 12,319,565
- Issue date Jun 3, 2025
- MultiDimension Technology Co., Ltd.
- Insik Jin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device comprising different types of microelectromech...
- Patent number 12,304,807
- Issue date May 20, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Hsiang-Fu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device
- Patent number 12,304,806
- Issue date May 20, 2025
- Hamamatsu Photonics K.K.
- Sadaharu Takimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 12,304,805
- Issue date May 20, 2025
- United Automotive Electronic Systems Co., Ltd.
- Xibin Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for protecting FEOL element and BEOL element
- Patent number 12,297,103
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Chun Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 12,269,061
- Issue date Apr 8, 2025
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having microelectromechanical systems devices...
- Patent number 12,257,602
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,258,266
- Issue date Mar 25, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top notch slit profile for MEMS device
- Patent number 12,238,478
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,227,410
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device and method for manufacturing actuator device
- Patent number 12,221,338
- Issue date Feb 11, 2025
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Phase shifter in which at least some of first sub-electrodes are sh...
- Patent number 12,218,395
- Issue date Feb 4, 2025
- BOE Technology Group Co., Ltd.
- Jingwen Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 12,215,016
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 12,209,009
- Issue date Jan 28, 2025
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor substrate, method for manufa...
- Patent number 12,187,607
- Issue date Jan 7, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection scheme for dielectric element sensor
- Patent number 12,168,601
- Issue date Dec 17, 2024
- Knowles Electronics, LLC
- Michael Pedersen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,091,310
- Issue date Sep 17, 2024
- Apogee Semiconductor, Inc.
- David A. Grant
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20250236506
- Publication date Jul 24, 2025
- Nanusens SL
- Josep Montanyà i Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertial Sensor And Electronic Component
- Publication number 20250236511
- Publication date Jul 24, 2025
- SEIKO EPSON CORPORATION
- Tomonaga KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250230037
- Publication date Jul 17, 2025
- Vanguard International Semiconductor Corporation
- ROHIT PULIKKAL KIZHAKKEYIL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTISENSOR MEMS INERTIAL SENSOR GUIDANCE FOR AUTOMATIC VEHICLES
- Publication number 20250224729
- Publication date Jul 10, 2025
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ACTUATOR ON INSULATING SUBSTRATE
- Publication number 20250214829
- Publication date Jul 3, 2025
- MICROGLASS LLC
- John WASSERBAUER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20250214108
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NANO ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250206596
- Publication date Jun 26, 2025
- Seoul National University R&DB Foundation
- Woo Young CHOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
- Publication number 20250178887
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Marcus RINKIÖ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES
- Publication number 20250162860
- Publication date May 22, 2025
- The University of British Columbia
- Chang Ge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250145454
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250145456
- Publication date May 8, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250145452
- Publication date May 8, 2025
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTEC...
- Publication number 20250145453
- Publication date May 8, 2025
- STMicroelectronics International N.V.
- Lorenzo CORSO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...
- Publication number 20250128936
- Publication date Apr 24, 2025
- Connaught Electronics Ltd.
- Maurice DORE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20250122071
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROSCALE FLEXIBLE STRAIN SENSOR
- Publication number 20250122073
- Publication date Apr 17, 2025
- Carnegie Mellon University
- Jay Reddy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SENSOR DEVICE
- Publication number 20250109011
- Publication date Apr 3, 2025
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...
- Publication number 20250109015
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Jeanette LINDROOS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND SENSING MODULE THEREOF
- Publication number 20250109972
- Publication date Apr 3, 2025
- LITE-ON SINGAPORE PTE. LTD.
- GUANG-LI SONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE FOR NANOSCALE THERMAL MEASUREMENTS AND ASSOCIATED METHOD FOR...
- Publication number 20250093212
- Publication date Mar 20, 2025
- Centre National de la Recherche Scientifique
- Olivier BOURGEOIS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20250074764
- Publication date Mar 6, 2025
- Beijing BOE Technology Development Co., Ltd.
- Wenbo LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY SENSOR
- Publication number 20250074765
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR
- Publication number 20250066186
- Publication date Feb 27, 2025
- ROBERT BOSCH GmbH
- David Slogsnat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...
- Publication number 20250059023
- Publication date Feb 20, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION
- Publication number 20250058353
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Array Structures for Gyroscopes with High Resonant Frequencies
- Publication number 20250026629
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Jun Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE
- Publication number 20250011164
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS resonator integrated cicruit fabrication

Sensor

Interconnection for monolithically integrated stacked devices and m...

Embedded permeable polysilicon layer in MEMS device for multiple ca...

Semiconductor package with metal column mold barrier

MEMS environmental sensor and preparation method therefor

Semiconductor device comprising different types of microelectromech...

Actuator device

Pressure sensor

Device for protecting FEOL element and BEOL element

Bottom electrode via structures for micromachined ultrasonic transd...

Semiconductor device having microelectromechanical systems devices...

Method and system for fabricating a MEMS device

Top notch slit profile for MEMS device

Semiconductor device and method for forming the same

Actuator device and method for manufacturing actuator device

Phase shifter in which at least some of first sub-electrodes are sh...

Piezoelectric anti-stiction structure for microelectromechanical sy...

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

MEMS device built using the BEOL metal layers of a solid state semi...

Micro electro mechanical system (MEMs) device having metal sealing...

Method for manufacturing semiconductor substrate, method for manufa...

Sensor package and method of producing the sensor package

Method and system for fabricating a MEMS device

Interconnection scheme for dielectric element sensor

Microelectromechanical systems device having a mechanically robust...

Conductive bond structure to increase membrane sensitivity in MEMS...

Sensor devices with gas-permeable cover and associated production m...

Microelectronics H-frame device

Integrated circuit packages having stress-relieving features

Patents Applicationslast 30 patents

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

Inertial Sensor And Electronic Component

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MULTISENSOR MEMS INERTIAL SENSOR GUIDANCE FOR AUTOMATIC VEHICLES

MICROELECTROMECHANICAL ACTUATOR ON INSULATING SUBSTRATE

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...

NANO ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTEC...

MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

MICROSCALE FLEXIBLE STRAIN SENSOR

INTEGRATED SENSOR DEVICE

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...

SENSOR PACKAGE AND SENSING MODULE THEREOF

DEVICE FOR NANOSCALE THERMAL MEASUREMENTS AND ASSOCIATED METHOD FOR...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

HIGH RELIABILITY SENSOR

ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR

FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...

SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION

MEMS Array Structures for Gyroscopes with High Resonant Frequencies

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

STACKED-DIE MEMS RESONATOR

SENSOR DEVICE