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B81B2207/07

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

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B81B2207/07Interconnects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor substrate, method for manufa...
- Patent number 12,187,607
- Issue date Jan 7, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection scheme for dielectric element sensor
- Patent number 12,168,601
- Issue date Dec 17, 2024
- Knowles Electronics, LLC
- Michael Pedersen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,091,310
- Issue date Sep 17, 2024
- Apogee Semiconductor, Inc.
- David A. Grant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for lithography process
- Patent number 12,066,756
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hung Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device structure with movable membrane
- Patent number 12,043,538
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical actuator on insulating substrate
- Patent number 12,030,771
- Issue date Jul 9, 2024
- MICROGLASS LLC
- John Wasserbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,017,908
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device
- Patent number 12,022,272
- Issue date Jun 25, 2024
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Euan James Boyd
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolated device package and method of manufacture
- Patent number 12,012,328
- Issue date Jun 18, 2024
- NXP USA, INC.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Damascene interconnect structure, actuator device, and method of ma...
- Patent number 11,987,493
- Issue date May 21, 2024
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gas sensor MEMS structures and methods of fabrication thereof
- Patent number 11,988,600
- Issue date May 21, 2024
- National University of Singapore
- Enrico Macrelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device and method for manufacturing actuator device
- Patent number 11,970,389
- Issue date Apr 30, 2024
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device
- Patent number 11,952,265
- Issue date Apr 9, 2024
- Hamamatsu Photonics K.K.
- Sadaharu Takimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer and method of fabric...
- Patent number 11,944,998
- Issue date Apr 2, 2024
- Korea Institute of Science and Technology
- Byung Chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a connection portion formed of a eutectic alloy
- Patent number 11,909,379
- Issue date Feb 20, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihisa Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE
- Publication number 20250011164
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
- Publication number 20250011160
- Publication date Jan 9, 2025
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Suspension for Resonators and MEMS Devices
- Publication number 20250011162
- Publication date Jan 9, 2025
- SiTime Corporation
- Nicholas MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20250011159
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING
- Publication number 20240425362
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Benjamin Biasi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...
- Publication number 20240417241
- Publication date Dec 19, 2024
- Connaught Electronics Ltd.
- Gerard Conway
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PROBE MODULE STRUCTURE
- Publication number 20240377434
- Publication date Nov 14, 2024
- TAIWAN MASK CORPORATION
- SHANG-KUANG WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20240381034
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTION LINE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240351859
- Publication date Oct 24, 2024
- WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD.
- Li HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE
- Publication number 20240351861
- Publication date Oct 24, 2024
- Japan Science and Technology Agency
- Osamu ISHITANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND SCANNING DEVICE
- Publication number 20240343556
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Helmut Grutzeck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE
- Publication number 20240343551
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD FOR MEMS DEVICE
- Publication number 20240308841
- Publication date Sep 19, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240286889
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ULTRASONIC TRANSDUCER
- Publication number 20240284121
- Publication date Aug 22, 2024
- Murata Manufacturing Co., Ltd.
- Shinsuke IKEUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...
- Publication number 20240279051
- Publication date Aug 22, 2024
- HAMAMATSU PHOTONICS K. K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR DEVICE AND METHOD FOR MANUFACTURING ACTUATOR DEVICE
- Publication number 20240246810
- Publication date Jul 25, 2024
- HAMAMATSU PHOTONICS K. K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...
- Publication number 20240207845
- Publication date Jun 27, 2024
- IMEC vzw
- Lei ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...
- Publication number 20240199415
- Publication date Jun 20, 2024
- STMicroelectronics International N.V.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC SENSING ASSEMBLY WITH THERMAL PLATFORM
- Publication number 20240189814
- Publication date Jun 13, 2024
- Analog Devices, Inc.
- David Frank Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro electro mechanical system (MEMs) device having metal sealing...

Method for manufacturing semiconductor substrate, method for manufa...

Sensor package and method of producing the sensor package

Method and system for fabricating a MEMS device

Interconnection scheme for dielectric element sensor

Microelectromechanical systems device having a mechanically robust...

Conductive bond structure to increase membrane sensitivity in MEMS...

Sensor devices with gas-permeable cover and associated production m...

Microelectronics H-frame device

Integrated circuit packages having stress-relieving features

Wafer level packaging of MEMS

Method for lithography process

SOC PMUT suitable for high-density system integration, array chip,...

Semiconductor device structure with movable membrane

Microelectromechanical actuator on insulating substrate

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Semiconductor structure and method for forming the same

MEMS device

Method of manufacturing electronic devices and corresponding electr...

Stress isolated device package and method of manufacture

MEMS resonator system

Damascene interconnect structure, actuator device, and method of ma...

Gas sensor MEMS structures and methods of fabrication thereof

Actuator device and method for manufacturing actuator device

Actuator device

Integrated digital force sensors and related methods of manufacture

Capacitive micromachined ultrasonic transducer and method of fabric...

MEMS device having a metallization structure embedded in a dielectr...

MEMS device having a connection portion formed of a eutectic alloy

Patents Applicationslast 30 patents

STACKED-DIE MEMS RESONATOR

SENSOR DEVICE

METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE

Suspension for Resonators and MEMS Devices

ACCELERATION SENSOR

MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS PROBE MODULE STRUCTURE

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

CONNECTION LINE STRUCTURE AND FORMING METHOD THEREOF

ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE

MICROMECHANICAL COMPONENT AND SCANNING DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE

MEMS DIES EMBEDDED IN GLASS CORES

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD FOR MEMS DEVICE

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

ULTRASONIC TRANSDUCER

DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

ACTUATOR DEVICE AND METHOD FOR MANUFACTURING ACTUATOR DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...

EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CA...

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

FLUIDIC SENSING ASSEMBLY WITH THERMAL PLATFORM