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B81B2207/07

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/07Interconnects

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device for protecting FEOL element and BEOL element
- Patent number 12,297,103
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Chun Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 12,269,061
- Issue date Apr 8, 2025
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having microelectromechanical systems devices...
- Patent number 12,257,602
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,258,266
- Issue date Mar 25, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top notch slit profile for MEMS device
- Patent number 12,238,478
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,227,410
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator device and method for manufacturing actuator device
- Patent number 12,221,338
- Issue date Feb 11, 2025
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Phase shifter in which at least some of first sub-electrodes are sh...
- Patent number 12,218,395
- Issue date Feb 4, 2025
- BOE Technology Group Co., Ltd.
- Jingwen Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 12,215,016
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 12,209,009
- Issue date Jan 28, 2025
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor substrate, method for manufa...
- Patent number 12,187,607
- Issue date Jan 7, 2025
- Hamamatsu Photonics K.K.
- Nao Inoue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection scheme for dielectric element sensor
- Patent number 12,168,601
- Issue date Dec 17, 2024
- Knowles Electronics, LLC
- Michael Pedersen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,091,310
- Issue date Sep 17, 2024
- Apogee Semiconductor, Inc.
- David A. Grant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for lithography process
- Patent number 12,066,756
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hung Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
SOC PMUT suitable for high-density system integration, array chip,...
- Patent number 12,060,264
- Issue date Aug 13, 2024
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device structure with movable membrane
- Patent number 12,043,538
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical actuator on insulating substrate
- Patent number 12,030,771
- Issue date Jul 9, 2024
- MICROGLASS LLC
- John Wasserbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,017,908
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device
- Patent number 12,022,272
- Issue date Jun 25, 2024
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Euan James Boyd
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250145454
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250145456
- Publication date May 8, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250145452
- Publication date May 8, 2025
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTEC...
- Publication number 20250145453
- Publication date May 8, 2025
- STMicroelectronics International N.V.
- Lorenzo CORSO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...
- Publication number 20250128936
- Publication date Apr 24, 2025
- Connaught Electronics Ltd.
- Maurice DORE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20250122071
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROSCALE FLEXIBLE STRAIN SENSOR
- Publication number 20250122073
- Publication date Apr 17, 2025
- Carnegie Mellon University
- Jay Reddy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED SENSOR DEVICE
- Publication number 20250109011
- Publication date Apr 3, 2025
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...
- Publication number 20250109015
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Jeanette LINDROOS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND SENSING MODULE THEREOF
- Publication number 20250109972
- Publication date Apr 3, 2025
- LITE-ON SINGAPORE PTE. LTD.
- GUANG-LI SONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE FOR NANOSCALE THERMAL MEASUREMENTS AND ASSOCIATED METHOD FOR...
- Publication number 20250093212
- Publication date Mar 20, 2025
- Centre National de la Recherche Scientifique
- Olivier BOURGEOIS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20250074764
- Publication date Mar 6, 2025
- Beijing BOE Technology Development Co., Ltd.
- Wenbo LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY SENSOR
- Publication number 20250074765
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR
- Publication number 20250066186
- Publication date Feb 27, 2025
- ROBERT BOSCH GmbH
- David Slogsnat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...
- Publication number 20250059023
- Publication date Feb 20, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION
- Publication number 20250058353
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Array Structures for Gyroscopes with High Resonant Frequencies
- Publication number 20250026629
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Jun Tang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
- Publication number 20250030998
- Publication date Jan 23, 2025
- Vibrant Microsystems Inc.
- Joseph Doll
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE
- Publication number 20250011164
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
- Publication number 20250011160
- Publication date Jan 9, 2025
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Suspension for Resonators and MEMS Devices
- Publication number 20250011162
- Publication date Jan 9, 2025
- SiTime Corporation
- Nicholas MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20250011159
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING
- Publication number 20240425362
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Benjamin Biasi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...
- Publication number 20240417241
- Publication date Dec 19, 2024
- Connaught Electronics Ltd.
- Gerard Conway
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PROBE MODULE STRUCTURE
- Publication number 20240377434
- Publication date Nov 14, 2024
- TAIWAN MASK CORPORATION
- SHANG-KUANG WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20240381034
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for protecting FEOL element and BEOL element

Bottom electrode via structures for micromachined ultrasonic transd...

Semiconductor device having microelectromechanical systems devices...

Method and system for fabricating a MEMS device

Top notch slit profile for MEMS device

Semiconductor device and method for forming the same

Actuator device and method for manufacturing actuator device

Phase shifter in which at least some of first sub-electrodes are sh...

Piezoelectric anti-stiction structure for microelectromechanical sy...

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

MEMS device built using the BEOL metal layers of a solid state semi...

Micro electro mechanical system (MEMs) device having metal sealing...

Method for manufacturing semiconductor substrate, method for manufa...

Sensor package and method of producing the sensor package

Method and system for fabricating a MEMS device

Interconnection scheme for dielectric element sensor

Microelectromechanical systems device having a mechanically robust...

Conductive bond structure to increase membrane sensitivity in MEMS...

Sensor devices with gas-permeable cover and associated production m...

Microelectronics H-frame device

Integrated circuit packages having stress-relieving features

Wafer level packaging of MEMS

Method for lithography process

SOC PMUT suitable for high-density system integration, array chip,...

Semiconductor device structure with movable membrane

Microelectromechanical actuator on insulating substrate

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Semiconductor structure and method for forming the same

MEMS device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTEC...

MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

MICROSCALE FLEXIBLE STRAIN SENSOR

INTEGRATED SENSOR DEVICE

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...

SENSOR PACKAGE AND SENSING MODULE THEREOF

DEVICE FOR NANOSCALE THERMAL MEASUREMENTS AND ASSOCIATED METHOD FOR...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

HIGH RELIABILITY SENSOR

ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR

FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO...

SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION

MEMS Array Structures for Gyroscopes with High Resonant Frequencies

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

STACKED-DIE MEMS RESONATOR

SENSOR DEVICE

METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE

Suspension for Resonators and MEMS Devices

ACCELERATION SENSOR

MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS PROBE MODULE STRUCTURE

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE