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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/481Internal lead connections

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Patents Grantslast 30 patents

Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,328,882
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory IC's with power supply droop circuitry coupled to f...
- Patent number 12,327,581
- Issue date Jun 10, 2025
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor die with primary and ancillary transistor elements
- Patent number 12,327,778
- Issue date Jun 10, 2025
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,327,779
- Issue date Jun 10, 2025
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated design for III-Nitride devices
- Patent number 12,324,180
- Issue date Jun 3, 2025
- Transphorm Technology, Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect for cross coupling
- Patent number 12,322,652
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 12,322,680
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit package having a padding la...
- Patent number 12,322,726
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,315,784
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,315,842
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having heat dissipation structure
- Patent number 12,315,774
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a metal resistor and methods o...
- Patent number 12,317,582
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side signal routing in a circuit with a relay cell
- Patent number 12,315,804
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES
- Publication number 20250191972
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST KEY AND SEMICONDUCTOR DIE INCLUDING THE SAME
- Publication number 20250191981
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tse-Pan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...
- Publication number 20250191995
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR
- Publication number 20250192003
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192018
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Byung Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL CONTACT AND POWER FORMATION FOR STACKED TRANSISTORS
- Publication number 20250194161
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250192108
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250192122
- Publication date Jun 12, 2025
- TXC Corporation
- Shih-Yung Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT EXTENSION FOR ADDITIONAL WIRING PATHS
- Publication number 20250194149
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Liqiao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250192088
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY THROUGH SUBSTRATE CONDUCTIVE STRUCTURES
- Publication number 20250192004
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE
- Publication number 20250192127
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Dong Joo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP, INTEGRATED CIRCUIT ASSEMBLY, AND PROCESSING METHOD...
- Publication number 20250192130
- Publication date Jun 12, 2025
- Alibaba Innovation Private Limited
- Yijin Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL JUMPER STRUCTURE FOR BEOL
- Publication number 20250192037
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL ROUTING
- Publication number 20250192051
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING INDUCTOR DEVICES
- Publication number 20250194255
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Jason GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES
- Publication number 20250183226
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE ARCHITECTURE FOR REDUCED CYCLES ACROSS SOC
- Publication number 20250183228
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES
- Publication number 20250185311
- Publication date Jun 5, 2025
- Xilinx, Inc.
- Jing JING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183241
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183243
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183246
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-VIA DEVICE, LAYOUT, AND METHOD
- Publication number 20250183157
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Hong GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250183206
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Enbin JO
- H01 - BASIC ELECTRIC ELEMENTS

Internal lead connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Architecture for computing system package

Logic drive based on chip scale package comprising standardized com...

Semiconductor device

Semiconductor package structure and manufacturing method thereof

3D system integration

Embedded memory IC's with power supply droop circuitry coupled to f...

Transistor die with primary and ancillary transistor elements

Semiconductor chip including through electrode, and semiconductor p...

Die coupling using a substrate with a glass core

Device and method for UBM/RDL routing

Wafer reconstitution and die-stitching

Integrated design for III-Nitride devices

Semiconductor package having composite seed-barrier layer and metho...

Local interconnect for cross coupling

Semiconductor device having backside interconnect structure on thro...

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor die including through substrate via barrier structure...

Image sensor device

Chip package and method of forming the same

Method of forming an integrated circuit package having a padding la...

Method of manufacturing die stack structure

Semiconductor structure, method for forming same, and wafer on wafe...

Hybrid bonding technology for stacking integrated circuits

Semiconductor package and manufacturing method thereof

Microelectronics package comprising a package-on-package (POP) arch...

Storage layers for wafer bonding

Package structure

Semiconductor structure having heat dissipation structure

Integrated circuit devices including a metal resistor and methods o...

Back side signal routing in a circuit with a relay cell

Patents Applicationslast 30 patents

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES

TEST KEY AND SEMICONDUCTOR DIE INCLUDING THE SAME

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED...

BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

BACKSIDE SIGNAL CONTACT AND POWER FORMATION FOR STACKED TRANSISTORS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE

CONTACT EXTENSION FOR ADDITIONAL WIRING PATHS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE

HIGH DENSITY THROUGH SUBSTRATE CONDUCTIVE STRUCTURES

SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE

SYSTEM-ON-CHIP, INTEGRATED CIRCUIT ASSEMBLY, AND PROCESSING METHOD...

BURIED METAL JUMPER STRUCTURE FOR BEOL

BACKSIDE SIGNAL ROUTING

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

INTERPOSER INCLUDING INDUCTOR DEVICES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

SCALABLE ARCHITECTURE FOR REDUCED CYCLES ACROSS SOC

SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

DUAL-VIA DEVICE, LAYOUT, AND METHOD

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME