Internal lead connections

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/481Internal lead connections

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Patents Grantslast 30 patents

Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device including hard macro
- Patent number 12,293,958
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jong Doo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit comprising master chip with first...
- Patent number 12,293,990
- Issue date May 6, 2025
- SK hynix Inc.
- Yun Gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 12,293,999
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor array with reduced warpage
- Patent number 12,294,033
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffered top thin film resistor, MIM capacitor, and method of formi...
- Patent number 12,289,919
- Issue date Apr 29, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Venkata Mangathayaru Bollam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,288,717
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,780
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Ju-Youn Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared well structure manufacturing method
- Patent number 12,288,786
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,288,728
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,734
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing through-electrodes, repair device performing th...
- Patent number 12,283,529
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for forming the same
- Patent number 12,283,311
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via test structure
- Patent number 12,278,149
- Issue date Apr 15, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,278,154
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Se Man Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE-LESS NANOSHEET FETS WITH DIRECT BACKSIDE CONTACT
- Publication number 20250151345
- Publication date May 8, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149505
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250149408
- Publication date May 8, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149423
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149430
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149444
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICES
- Publication number 20250149511
- Publication date May 8, 2025
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED INTEGRATED CIRCUITS HAVING FUNCTIONAL BLOCKS CONFIGURED...
- Publication number 20250149531
- Publication date May 8, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149460
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149479
- Publication date May 8, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Haksun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250151378
- Publication date May 8, 2025
- Sumitomo Electric Industries, Ltd.
- Hayato SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149504
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149520
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250149476
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149480
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE...
- Publication number 20250151411
- Publication date May 8, 2025
- Myeong-Eun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149398
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- DAWOON JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149455
- Publication date May 8, 2025
- Intel Corporation
- Nicholas Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149516
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERPOSER STRUCTURES, AND RELATED METHODS
- Publication number 20250149530
- Publication date May 8, 2025
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS

Internal lead connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gold through silicon mask plating

Semiconductor device including hard macro

Semiconductor integrated circuit comprising master chip with first...

3D semiconductor package including memory array

Method for forming chip packages and a chip package

Semiconductor package

Semiconductor packages and methods of forming same

Deep trench capacitor array with reduced warpage

Through-circuit Vias in interconnect structures

Semiconductor package including heat dissipation structure

Buffered top thin film resistor, MIM capacitor, and method of formi...

Metal based hydrogen barrier

Semiconductor package

Semiconductor package

Shared well structure manufacturing method

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device

Through via structure

3D inductor design using bundle substrate vias

Method of repairing through-electrodes, repair device performing th...

Semiconductor package and method of fabricating same

Stacked semiconductor device test circuits and methods of use

Semiconductor structure and manufacturing method thereof

Memory device and method for forming the same

Integrated voltage regulator and passive components

High bandwidth package structure

Semiconductor die including through substrate via barrier structure...

Method of fabricating semiconductor package including sub-interpose...

Through-substrate via test structure

Semiconductor device and a method of manufacturing a semiconductor...

Patents Applicationslast 30 patents

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

MODULE-LESS NANOSHEET FETS WITH DIRECT BACKSIDE CONTACT

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

ELECTRONIC DEVICE

COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

NON-VOLATILE MEMORY DEVICES

3D STACKED INTEGRATED CIRCUITS HAVING FUNCTIONAL BLOCKS CONFIGURED...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

SEMICONDUCTOR PACKAGE

STACKED INTERPOSER STRUCTURES, AND RELATED METHODS