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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/481Internal lead connections

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Patents Grantslast 30 patents

Information Patent Grant
Method of making semiconductor device having self-aligned interconn...
- Patent number 12,266,594
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through vias of semiconductor structure and method of forming thereof
- Patent number 12,266,592
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having at least one via incl...
- Patent number 12,266,593
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,164
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 12,261,181
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside signal routing
- Patent number 12,261,116
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for forming the same
- Patent number 12,261,137
- Issue date Mar 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 12,262,534
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Wooyong Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-based gallium nitride integrated circuits
- Patent number 12,261,134
- Issue date Mar 25, 2025
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including thermal enhanced bonding structure
- Patent number 12,261,142
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test key and semiconductor die including the same
- Patent number 12,255,112
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tse-Pan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver and manufacturing method thereof
- Patent number 12,253,729
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,125
- Issue date Mar 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary design for high-voltage integration on HKMG technology
- Patent number 12,255,207
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable architecture for reduced cycles across SOC
- Patent number 12,255,176
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including substrates bonded to each other and...
- Patent number 12,255,126
- Issue date Mar 18, 2025
- SK hynix Inc.
- Mi Seon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including backside wiring structure with super...
- Patent number 12,249,557
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Seung Ha Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using different types of through-silicon-vias
- Patent number 12,250,807
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jaesan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC AND ELECTRIC STRUCTURES IN TECHNOLOGIES WITH THROUGH-SILIC...
- Publication number 20250112147
- Publication date Apr 3, 2025
- Intel Corporation
- Xi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK
- Publication number 20250111765
- Publication date Apr 3, 2025
- Xilinx, Inc.
- Thomas Paul LEBOEUF
- G08 - SIGNALLING
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...
- Publication number 20250112139
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250112217
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTAC...
- Publication number 20250112037
- Publication date Apr 3, 2025
- Intel Corporation
- Mark KOEPER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer based...
- Publication number 20250112192
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING
- Publication number 20250112120
- Publication date Apr 3, 2025
- Intel Corporation
- Tao CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER GATING
- Publication number 20250112122
- Publication date Apr 3, 2025
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250110291
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES
- Publication number 20250112123
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS
- Publication number 20250112121
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION
- Publication number 20250112153
- Publication date Apr 3, 2025
- Intel Corporation
- Inanc Meric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STAC...
- Publication number 20250112203
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250105174
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Publication number 20250107112
- Publication date Mar 27, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105088
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
- Publication number 20250105207
- Publication date Mar 27, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105231
- Publication date Mar 27, 2025
- Samsung Electronics Co., LTD
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250105184
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Kai-Lun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...
- Publication number 20250105095
- Publication date Mar 27, 2025
- Intel Corporation
- Bozidar Marinkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER DELIVERY FOR SEMICONDUCTOR DEVICES
- Publication number 20250105096
- Publication date Mar 27, 2025
- Avago Technologies International Sales Pte. Limited
- AJ Tufano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...
- Publication number 20250105097
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Yeongseon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20250105099
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Josh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING LOWER INTERCONNECT METAL LAYER...
- Publication number 20250105153
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jintae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20250105183
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyung Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Internal lead connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of making semiconductor device having self-aligned interconn...

Through vias of semiconductor structure and method of forming thereof

Method of forming semiconductor device having at least one via incl...

3D stacked integrated circuits having functional blocks configured...

Semiconductor packages and manufacturing methods thereof

Hermetic package for high CTE mismatch

Integrated circuit packages

Semiconductor package

Semiconductor package including image sensor chip, transparent subs...

Info structure with copper pillar having reversed profile

Semiconductor package having an encapulant comprising conductive fi...

Backside signal routing

Bonding structure and method for forming the same

Semiconductor devices and electronic systems including the same

Molded dies in semiconductor packages and methods of forming same

Aluminum-based gallium nitride integrated circuits

Semiconductor structure including thermal enhanced bonding structure

Thermal management in integrated circuit packages

Test key and semiconductor die including the same

Stacked semiconductor device

Optical transceiver and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Boundary design for high-voltage integration on HKMG technology

Scalable architecture for reduced cycles across SOC

Semiconductor device, semiconductor component and method of fabrica...

Semiconductor devices including substrates bonded to each other and...

Semiconductor device including backside wiring structure with super...

Semiconductor structure and forming method thereof

Semiconductor device using different types of through-silicon-vias

Semiconductor package and method manufacturing the same

Patents Applicationslast 30 patents

MAGNETIC AND ELECTRIC STRUCTURES IN TECHNOLOGIES WITH THROUGH-SILIC...

TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTAC...

3D System and Wafer Reconstitution with Mid-layer Interposer based...

INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING

BACKSIDE POWER GATING

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES

Power, Signaling and Thermal Path Co-optimization

ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS

VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION

DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STAC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...

SYSTEMS AND METHODS FOR POWER DELIVERY FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICES INCLUDING LOWER INTERCONNECT METAL LAYER...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE