Internal lead connections

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/481Internal lead connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost embedded integrated circuit dies
- Patent number 12,368,089
- Issue date Jul 22, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,368,104
- Issue date Jul 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor apparatus and semiconductor appa...
- Patent number 12,368,107
- Issue date Jul 22, 2025
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with dielectric spacers and field plate and method of fa...
- Patent number 12,369,380
- Issue date Jul 22, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having thermoelectric cooler
- Patent number 12,368,086
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and method thereof
- Patent number 12,369,365
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with connection paths
- Patent number 12,362,330
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming a semiconductor stru...
- Patent number 12,362,241
- Issue date Jul 15, 2025
- Intel Corporation
- Richard Geiger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through die via
- Patent number 12,362,262
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 12,364,048
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,362,263
- Issue date Jul 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor body with a trench, semiconduct...
- Patent number 12,362,230
- Issue date Jul 15, 2025
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper sensor for 3-dimensional die stack
- Patent number 12,361,808
- Issue date Jul 15, 2025
- Xilinx, Inc.
- Thomas Paul Leboeuf
- G08 - SIGNALLING
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including TSVs of different lengths...
- Patent number 12,362,243
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,354,961
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 12,355,006
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239572
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES
- Publication number 20250239488
- Publication date Jul 24, 2025
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Alfons Dehé
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Different Via Configurations for Different Via Interface Requirements
- Publication number 20250239527
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERPOSER
- Publication number 20250233109
- Publication date Jul 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233110
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juhong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...
- Publication number 20250233066
- Publication date Jul 17, 2025
- NVIDIA Corp.
- Mahmut Ersin Sinangil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233063
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTI...
- Publication number 20250234654
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Jen-Hao HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20250233045
- Publication date Jul 17, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...
- Publication number 20250234562
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Siwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20250234589
- Publication date Jul 17, 2025
- Zinite Corporation
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE INTEGRATED SELECTABLE GATE RESISTANCE
- Publication number 20250234609
- Publication date Jul 17, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Perry Schugart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250233035
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226360
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...
- Publication number 20250226268
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE
- Publication number 20250226291
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...
- Publication number 20250226327
- Publication date Jul 10, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250226292
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
- Publication number 20250227968
- Publication date Jul 10, 2025
- Intel Corporation
- Marni NABORS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226366
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS

Internal lead connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost embedded integrated circuit dies

Microelectronic devices with through-substrate interconnects and as...

Electronic package

Method for producing semiconductor apparatus and semiconductor appa...

3D semiconductor device and structure with metal layers

Transistor with dielectric spacers and field plate and method of fa...

Package structure having thermoelectric cooler

Semiconductor devices with backside power rail and method thereof

Double side integration semiconductor package and method of forming...

3D semiconductor device and structure with connection paths

Semiconductor structure and method for forming a semiconductor stru...

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor device including through die via

Semiconductor structure and manufacturing method thereof

Conductive contact for ion through-substrate via

Semiconductor device and method of manufacture

Electronic package and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Method of producing a semiconductor body with a trench, semiconduct...

Package structure and method of forming the same

Tamper sensor for 3-dimensional die stack

3D semiconductor memory device and structure

Semiconductor device assemblies including TSVs of different lengths...

Stack type semiconductor device and method of testing the stack typ...

Chip package structure and storage system

Semiconductor structure and manufacturing method thereof

Guard ring structure

Semiconductor packages and methods of manufacturing thereof

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES

Different Via Configurations for Different Via Interface Requirements

Through Via Power Delivery Structure for Stacked Chips

PACKAGE ARCHITECTURE WITH INTERPOSER

SEMICONDUCTOR PACKAGE

Semiconductor Packages and Methods of Forming Same

THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

THROUGH-SILICON VIA STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTI...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE AND ELECTRONIC SYST...

THIN FILM SEMICONDUCTOR SWITCHING DEVICE

POWER SEMICONDUCTOR DEVICE INTEGRATED SELECTABLE GATE RESISTANCE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...

BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE

CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY

SEMICONDUCTOR PACKAGE