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H05K2201/09527

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09527Inverse blind vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fibrillated liquid crystal polymer powder, method of producing fibr...
- Patent number 11,646,127
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Hiroyuki Ohata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 10,158,157
- Issue date Dec 18, 2018
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic device and method of manufacturing same
- Patent number 9,999,129
- Issue date Jun 12, 2018
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated circuit substrate
- Patent number 9,980,383
- Issue date May 22, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,949,372
- Issue date Apr 17, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board
- Patent number 9,888,581
- Issue date Feb 6, 2018
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 9,774,070
- Issue date Sep 26, 2017
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded board and communication terminal device
- Patent number 9,699,908
- Issue date Jul 4, 2017
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,655,254
- Issue date May 16, 2017
- Subtron Technology Co. Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 9,406,602
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with built-in component and method for manufacturing the...
- Patent number 9,408,310
- Issue date Aug 2, 2016
- Murata Manufacturing Co., Ltd.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,380,707
- Issue date Jun 28, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,320,153
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 9,313,904
- Issue date Apr 12, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,204,552
- Issue date Dec 1, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,204,541
- Issue date Dec 1, 2015
- MURATA MANUFACTURING CO., LTD.
- Shunsuke Chisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,155,196
- Issue date Oct 6, 2015
- Ibiden Co., Ltd.
- Haruhiko Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a semiconductor chip mounted on an insu...
- Patent number 9,153,541
- Issue date Oct 6, 2015
- Cypress Semiconductor Corporation
- Junji Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 9,113,569
- Issue date Aug 18, 2015
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible multilayer substrate
- Patent number 9,012,785
- Issue date Apr 21, 2015
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,935,850
- Issue date Jan 20, 2015
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,823,174
- Issue date Sep 2, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,685,796
- Issue date Apr 1, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,633,591
- Issue date Jan 21, 2014
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for semiconductor devices and metho...
- Patent number 8,624,121
- Issue date Jan 7, 2014
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination substrate
- Patent number 8,618,669
- Issue date Dec 31, 2013
- Ibiden Co., Ltd.
- Toru Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
- Publication number 20240055744
- Publication date Feb 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF
- Publication number 20230164916
- Publication date May 25, 2023
- Celestica Technology Consultancy (Shanghai) Co. Ltd.
- Jing LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190139953
- Publication date May 9, 2019
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fibrillated Liquid Crystal Polymer Powder, Method of Producing Fibr...
- Publication number 20190080817
- Publication date Mar 14, 2019
- MURATA MANUFACTURING CO., LTD.
- Hiroyuki OHATA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD
- Publication number 20140353022
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140346681
- Publication date Nov 27, 2014
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20140150258
- Publication date Jun 5, 2014
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140103524
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MULTILAYER SUBSTRATE
- Publication number 20140034365
- Publication date Feb 6, 2014
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130299219
- Publication date Nov 14, 2013
- Shunsuke Chisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB Droplet Actuator Fabrication
- Publication number 20130264010
- Publication date Oct 10, 2013
- Advanced Liquid Logic Inc
- Vijay Srinivasan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...
- Publication number 20130256010
- Publication date Oct 3, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jae Youb JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE, MODULE, AND COMPOSITE-SUBSTRATE PRODUCTION METHOD
- Publication number 20130235535
- Publication date Sep 12, 2013
- Murata Manufacturing Co., Ltd.
- Kazuhiro ISEBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE...
- Publication number 20130213699
- Publication date Aug 22, 2013
- Murata Manufacturing Co., Ltd.
- Shunsuke CHISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130192884
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130164440
- Publication date Jun 27, 2013
- IBIDEN CO., LTD.
- Masahiro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130099390
- Publication date Apr 25, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20120306608
- Publication date Dec 6, 2012
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
- Publication number 20120280022
- Publication date Nov 8, 2012
- Subtron Technology Co. Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120205145
- Publication date Aug 16, 2012
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20120043128
- Publication date Feb 23, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Ro Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board including outmost fin...
- Publication number 20120011716
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110253439
- Publication date Oct 20, 2011
- Subtron Technology Co. Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110220399
- Publication date Sep 15, 2011
- IBIDEN CO., LTD.
- AYAO NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110180307
- Publication date Jul 28, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered Wiring Substrate
- Publication number 20110156272
- Publication date Jun 30, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110155439
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Tomoko Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic device and method of manufacturing same
- Publication number 20110108947
- Publication date May 12, 2011
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Inverse blind vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fibrillated liquid crystal polymer powder, method of producing fibr...

Electronic device

Resin multilayer substrate and method of manufacturing the same

Electronic device

Electronic device

High-frequency signal line and manufacturing method thereof

Microelectronic device and method of manufacturing same

Laminated circuit substrate

Printed wiring board and method for manufacturing the same

Method for manufacturing wiring board

High-frequency signal line and manufacturing method thereof

Component-embedded board and communication terminal device

Manufacturing method of circuit substrate

Electronic device

Substrate with built-in component and method for manufacturing the...

Method of manufacturing wiring substrate

Printed wiring board and method for manufacturing the same

Wiring board and method of manufacturing wiring board

Printed wiring board

Multilayer circuit board and method for manufacturing the same

Wiring board

Semiconductor device having a semiconductor chip mounted on an insu...

Wiring board and method for manufacturing same

Flexible multilayer substrate

Method of manufacturing printed wiring board

Electronic device

Electronic device and method of manufacturing the same

Electronic device

Multilayer printed wiring board for semiconductor devices and metho...

Combination substrate

Patents Applicationslast 30 patents

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...

PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF

ELECTRONIC DEVICE

ELECTRONIC DEVICE

Fibrillated Liquid Crystal Polymer Powder, Method of Producing Fibr...

WIRING BOARD

ELECTRONIC DEVICE

Method of Manufacturing Wiring Substrate

ELECTRONIC DEVICE

FLEXIBLE MULTILAYER SUBSTRATE

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PCB Droplet Actuator Fabrication

METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...

COMPOSITE SUBSTRATE, MODULE, AND COMPOSITE-SUBSTRATE PRODUCTION METHOD

SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE...

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF

Printed circuit board and method of manufacturing the same

Method of manufacturing printed circuit board including outmost fin...

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Multilayered Wiring Substrate

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Microelectronic device and method of manufacturing same