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  • H05K2201/09527
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09527Inverse blind vias
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250212324
    • Publication date Jun 26, 2025
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stamping Surface Profile in Design Layer and Filling an Indentation...
    • Publication number 20250142736
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126718
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Ho Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250048557
    • Publication date Feb 6, 2025
    • LG Innotek Co., Ltd.
    • Soo Min LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
    • Publication number 20250048533
    • Publication date Feb 6, 2025
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240314932
    • Publication date Sep 19, 2024
    • Unimicron Technology Corp.
    • Chen-An TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE...
    • Publication number 20240055744
    • Publication date Feb 15, 2024
    • Murata Manufacturing Co., Ltd.
    • Nobuo IKEMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND WIRE ARRANGEMENT METHOD THEREOF
    • Publication number 20230164916
    • Publication date May 25, 2023
    • Celestica Technology Consultancy (Shanghai) Co. Ltd.
    • Jing LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20200118994
    • Publication date Apr 16, 2020
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20190139953
    • Publication date May 9, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Fibrillated Liquid Crystal Polymer Powder, Method of Producing Fibr...
    • Publication number 20190080817
    • Publication date Mar 14, 2019
    • MURATA MANUFACTURING CO., LTD.
    • Hiroyuki OHATA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    WIRING BOARD
    • Publication number 20140353022
    • Publication date Dec 4, 2014
    • IBIDEN CO., LTD.
    • Haruhiko MORITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20140346681
    • Publication date Nov 27, 2014
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Manufacturing Wiring Substrate
    • Publication number 20140150258
    • Publication date Jun 5, 2014
    • Noriyoshi SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20140103524
    • Publication date Apr 17, 2014
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE MULTILAYER SUBSTRATE
    • Publication number 20140034365
    • Publication date Feb 6, 2014
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20130299219
    • Publication date Nov 14, 2013
    • Shunsuke Chisaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PCB Droplet Actuator Fabrication
    • Publication number 20130264010
    • Publication date Oct 10, 2013
    • Advanced Liquid Logic Inc
    • Vijay Srinivasan
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTIL...
    • Publication number 20130256010
    • Publication date Oct 3, 2013
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Youb JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE SUBSTRATE, MODULE, AND COMPOSITE-SUBSTRATE PRODUCTION METHOD
    • Publication number 20130235535
    • Publication date Sep 12, 2013
    • Murata Manufacturing Co., Ltd.
    • Kazuhiro ISEBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE...
    • Publication number 20130213699
    • Publication date Aug 22, 2013
    • Murata Manufacturing Co., Ltd.
    • Shunsuke CHISAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20130192884
    • Publication date Aug 1, 2013
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20130164440
    • Publication date Jun 27, 2013
    • IBIDEN CO., LTD.
    • Masahiro Kaneko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20130099390
    • Publication date Apr 25, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    • Publication number 20120306608
    • Publication date Dec 6, 2012
    • IBIDEN CO., LTD.
    • Yoshinori TAKENAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
    • Publication number 20120280022
    • Publication date Nov 8, 2012
    • Subtron Technology Co. Ltd.
    • Tzu-Wei Huang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20120205145
    • Publication date Aug 16, 2012
    • Murata Manufacturing Co., Ltd.
    • Norio SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed circuit board and method of manufacturing the same
    • Publication number 20120043128
    • Publication date Feb 23, 2012
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyoung Ro Yoon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR