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SEMICONDUCTOR DEVICE
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Publication number 20240136383
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Publication date Apr 25, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Chien Ku
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H01 - BASIC ELECTRIC ELEMENTS
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BOND PAD WITH ENHANCED RELIABILITY
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Publication number 20230369260
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Publication date Nov 16, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Tzu-Hsuan Yeh
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H01 - BASIC ELECTRIC ELEMENTS
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BOND PAD WITH ENHANCED RELIABILITY
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Publication number 20220157751
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Publication date May 19, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Tzu-Hsuan Yeh
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20220077217
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Publication date Mar 10, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Chien Ku
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H01 - BASIC ELECTRIC ELEMENTS
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BOND PAD WITH ENHANCED RELIABILITY
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Publication number 20210351142
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Publication date Nov 11, 2021
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Taiwan Semiconductor Manufacturing Co., LTD
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Tzu-Hsuan Yeh
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H01 - BASIC ELECTRIC ELEMENTS
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Textured Bond Pads
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Publication number 20210320074
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Publication date Oct 14, 2021
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TEXAS INSTRUMENTS INCORPORATED
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Rafael Jose Lizares GUEVARA
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H01 - BASIC ELECTRIC ELEMENTS
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TEXTURED BOND PADS
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Publication number 20210066220
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Publication date Mar 4, 2021
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TEXAS INSTRUMENTS INCORPORATED
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Rafael Jose Lizares GUEVARA
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF FORMING A SOLDER BUMP STRUCTURE
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Publication number 20200152590
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Publication date May 14, 2020
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International Business Machines Corporation
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Toyohiro Aoki
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Solder Ball Protection in Packages
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Publication number 20200118947
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Publication date Apr 16, 2020
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Chun Miao
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H01 - BASIC ELECTRIC ELEMENTS