involving a chemical process

Industry

CPC
H01L2224/03831

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03831involving a chemical process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond pad with enhanced reliability
- Patent number 12,165,996
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 12,113,046
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,390
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 11,876,072
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with enhanced reliability
- Patent number 11,824,022
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stacked dies
- Patent number 11,824,047
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 11,764,110
- Issue date Sep 19, 2023
- Semiconductor Components Industries, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through semiconductor via and method for...
- Patent number 11,664,364
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,616,036
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textured bond pads
- Patent number 11,600,583
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structure and method of fabricating the same
- Patent number 11,562,974
- Issue date Jan 24, 2023
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked dies and method for fabricating t...
- Patent number 11,557,572
- Issue date Jan 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 11,444,046
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,296,045
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with enhanced reliability
- Patent number 11,244,914
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recess of interconnects for probing hybrid bond devices
- Patent number 11,189,585
- Issue date Nov 30, 2021
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS sensors and methods of forming the same
- Patent number 11,177,308
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textured bond pads
- Patent number 11,081,456
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating the electronic component, and method for tra...
- Patent number 11,069,638
- Issue date Jul 20, 2021
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20240379594
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240339423
- Publication date Oct 10, 2024
- CXMT Corporation
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
- Publication number 20240203914
- Publication date Jun 20, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136383
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20240063175
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...
- Publication number 20230377974
- Publication date Nov 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20230369260
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260936
- Publication date Aug 17, 2023
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230238343
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230154807
- Publication date May 18, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
- Publication number 20230061312
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220352102
- Publication date Nov 3, 2022
- NANYA TECHNOLOGY CORPORATION
- Po-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH SEMICONDUCTOR VIA AND METHOD FOR...
- Publication number 20220310580
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220216167
- Publication date Jul 7, 2022
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220208706
- Publication date Jun 30, 2022
- Samsung Electronics Co.,Ltd.
- Joohee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20220157751
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077217
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH ENHANCED RELIABILITY
- Publication number 20210351142
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tzu-Hsuan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Textured Bond Pads
- Publication number 20210320074
- Publication date Oct 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210233822
- Publication date Jul 29, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESS OF INTERCONNECTS FOR PROBING HYBRID BOND DEVICES
- Publication number 20210175192
- Publication date Jun 10, 2021
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

involving a chemical process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pad with enhanced reliability

Semiconductor device and method of manufacturing the same

Method for preparing semiconductor device with wire bond

Chip package, method of forming a chip package and method of formin...

Passivation scheme for pad openings and trenches

Flip chip package structure and manufacturing method thereof

Semiconductor device

Method for preparing semiconductor device with wire bond

Bond pad with enhanced reliability

Method for fabricating semiconductor device with stacked dies

Moat coverage with dielectric film for device passivation and singu...

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor device with through semiconductor via and method for...

Adhesive bonding composition and method of use

Semiconductor device and method of manufacturing the same

Textured bond pads

Hybrid bonding structure and method of fabricating the same

Semiconductor device with stacked dies and method for fabricating t...

Passivation scheme for pad openings and trenches

Bonding pad layer system, gas sensor and method for manufacturing a...

Semiconductor device, electronic component and method

IR assisted fan-out wafer level packaging using silicon handler

Semiconductor package and method of fabricating the same

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor device and method of manufacturing the same

Bond pad with enhanced reliability

Selective recess of interconnects for probing hybrid bond devices

CMOS sensors and methods of forming the same

Textured bond pads

Method for fabricating the electronic component, and method for tra...

Patents Applicationslast 30 patents

BOND PAD WITH ENHANCED RELIABILITY

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

ALLOY FOR METAL UNDERCUT REDUCTION

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

Adding Sealing Material to Wafer edge for Wafer Bonding

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

Bonding Structure with Stress Buffer Zone and Method of Forming Same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...

BOND PAD WITH ENHANCED RELIABILITY

FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH THROUGH SEMICONDUCTOR VIA AND METHOD FOR...

HYBRID BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BOND PAD WITH ENHANCED RELIABILITY

SEMICONDUCTOR DEVICE

BOND PAD WITH ENHANCED RELIABILITY

Textured Bond Pads

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

SELECTIVE RECESS OF INTERCONNECTS FOR PROBING HYBRID BOND DEVICES

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...