involving a mechanical process

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H01L2224/0384

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0384involving a mechanical process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with conductive feature and method of forming same
- Patent number 12,211,809
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a structure for higher integration
- Patent number 12,199,123
- Issue date Jan 14, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with removable probe pads
- Patent number 12,051,631
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Naoki Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 11,830,837
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,742,374
- Issue date Aug 29, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE MANUFACTURING METHOD AND LAMINATE
- Publication number 20250105205
- Publication date Mar 27, 2025
- Resonac Corporation
- Yuki IMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PAD SURFACE LEVELING DEVICE
- Publication number 20250105033
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038141
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014974
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Features For Reducing Non-Bond and Methods of Forming the Same
- Publication number 20250006677
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...
- Publication number 20240413109
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Young Su YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method
- Publication number 20240404968
- Publication date Dec 5, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
- Publication number 20240387427
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Siu Lung Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...
- Publication number 20240363562
- Publication date Oct 31, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE
- Publication number 20240274555
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKA...
- Publication number 20240266307
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS

involving a mechanical process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pads for semiconductor die assemblies and associated methods a...

Method for forming semiconductor structure

Structure with conductive feature and method of forming same

Semiconductor device including a structure for higher integration

Contact pad fabrication process for a semiconductor product

Process flow for fabrication of cap metal over top metal with sinte...

Iterative formation of damascene interconnects

Semiconductor device and method of manufacturing the same

Die on die bonding structure

Method for permanent connection of two metal surfaces

Semiconductor structure and method for forming semiconductor struct...

Stacked semiconductor structure and method

Bonded structures with integrated passive component

Stacked semiconductor device with removable probe pads

Semiconductor structure

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method of forming same

Method of forming brass-coated metals in flip-chip redistribution l...

Semiconductor structure having polygonal bonding pad

Flat metal features for microelectronics applications

Multi-metal contact structure

Semiconductor device and method of manufacturing the same

Semiconductor package with air gap

Semiconductor structure including buffer layer

Bond pads for low temperature hybrid bonding

Method of fabricating integrated circuit device

Method of manufacturing semiconductor structure having polygonal bo...

Semiconductor device, method of manufacturing semiconductor device,...

Wafer on wafer bonding structure

Patents Applicationslast 30 patents

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

LAMINATE MANUFACTURING METHOD AND LAMINATE

Semiconductor structure and alignment method thereof

CHIP PAD SURFACE LEVELING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Grain Structure Engineering for Metal Gapfill Materials

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

SEMICONDUCTOR PACKAGE

Bond Features For Reducing Non-Bond and Methods of Forming the Same

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...

Semiconductor Packaging Method

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

DIE ON DIE BONDING STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...

Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE

COMPENSATION METHOD FOR WAFER BONDING

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

ALLOY FOR METAL UNDERCUT REDUCTION

SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKA...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF