involving a mechanical process

Industry

CPC
H01L2224/2784

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2784involving a mechanical process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Joint connection of corner non-critical to function (NCTF) ball for...
- Patent number 11,990,395
- Issue date May 21, 2024
- Intel Corporation
- Xiaoying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,908,829
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor apparatus and semiconductor...
- Patent number 11,769,754
- Issue date Sep 26, 2023
- Canon Kabushiki Kaisha
- Tatsuya Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connection structure and method for fabri...
- Patent number 11,631,655
- Issue date Apr 18, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with connection structure and method for fabri...
- Patent number 11,393,792
- Issue date Jul 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
- Patent number 11,373,925
- Issue date Jun 28, 2022
- LIGHT-MED (USA), INC.
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that uses bonding layer to join semiconductor...
- Patent number 11,088,131
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of device chip
- Patent number 11,024,542
- Issue date Jun 1, 2021
- Disco Corporation
- Heidi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler particle position and density manipulation with applications...
- Patent number 10,903,184
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die encapsulation in oxide bonded wafer stack
- Patent number 10,784,234
- Issue date Sep 22, 2020
- Raytheon Company
- John J. Drab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device that uses bonding laye...
- Patent number 10,727,217
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250239561
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...
- Publication number 20250226359
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250210571
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250201646
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...
- Publication number 20250183237
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20250157986
- Publication date May 15, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240266316
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240213197
- Publication date Jun 27, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Haohua MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS
- Publication number 20240153862
- Publication date May 9, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145430
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105664
- Publication date Mar 28, 2024
- Chipbond Technology Corporation
- Yu-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240038711
- Publication date Feb 1, 2024
- DENSO CORPORATION
- TERUAKI KUMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS

involving a mechanical process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die on die bonding structure

Atomic layer deposition bonding layer for joining two semiconductor...

Fingerprint sensor and manufacturing method thereof

Joint connection of corner non-critical to function (NCTF) ball for...

Integrated circuit package and method of forming same

Semiconductor structure having silver-indium transient liquid phase...

Seal ring structures and methods of forming same

Manufacturing method for semiconductor apparatus and semiconductor...

Wafer on wafer bonding structure

Thermocompression bond tips and related apparatus and methods

Semiconductor device with connection structure and method for fabri...

Semiconductor wafer and method of manufacturing the same

Back side metallization

Jointing material, fabrication method for semiconductor device usin...

Sintering materials and attachment methods using same

Fingerprint sensor and manufacturing method thereof

Semiconductor device with connection structure and method for fabri...

Silver-indium transient liquid phase method of bonding semiconducto...

Seal ring structures and methods of forming same

Wafer level integration including design/co-design, structure proce...

Semiconductor device that uses bonding layer to join semiconductor...

Manufacturing method of device chip

Thermocompression bond tips and related apparatus and methods

Inkjet adhesive, manufacturing method for semiconductor device, and...

Back side metallization

Filler particle position and density manipulation with applications...

Bonding material and bonding method using same

Die encapsulation in oxide bonded wafer stack

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Method of manufacturing semiconductor device that uses bonding laye...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...

DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR

ELECTRONIC COMPONENT

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

Manufacturing method of a system in package having several layers a...

Reducing warpage in a package of stacked integrated circuit dies

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

DIE ON DIE BONDING STRUCTURE

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SINTERING FILM FRAMES AND RELATED METHODS

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

ELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE