involving a permanent auxiliary member being left in the finished device

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H01L2224/81007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81007involving a permanent auxiliary member being left in the finished device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device interconnection systems and methods
- Patent number 11,916,039
- Issue date Feb 27, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting assembly with raised adhesive layer
- Patent number 11,742,334
- Issue date Aug 29, 2023
- XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Tung-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 11,742,216
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ho Yoon
- G02 - OPTICS
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
3DI solder cup
- Patent number 11,532,578
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-part-reinforcing thermosetting resin composition, semico...
- Patent number 11,495,564
- Issue date Nov 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jin Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 11,476,219
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-heaters in a film structure mounted on a substrate between a...
- Patent number 11,222,833
- Issue date Jan 11, 2022
- Skiileux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,139,282
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic substrate, and method for producing electroni...
- Patent number 11,094,658
- Issue date Aug 17, 2021
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 10,964,654
- Issue date Mar 30, 2021
- Micron Technology Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, electronic substrate, and method for producing electron...
- Patent number 10,833,050
- Issue date Nov 10, 2020
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 10,784,222
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 10,763,129
- Issue date Sep 1, 2020
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating device and method for fabricating semiconductor package...
- Patent number 10,748,855
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Tea-Geon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF TRANSFERRING DIES AND DIE BONDED STRUCTURES
- Publication number 20230307268
- Publication date Sep 28, 2023
- Vanguard International Semiconductor Corporation
- Yung-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TR...
- Publication number 20230268259
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230105710
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyekyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...
- Publication number 20230077857
- Publication date Mar 16, 2023
- TIEN CHIEN CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20220367397
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220302095
- Publication date Sep 22, 2022
- Japan Display Inc.
- Kenichi TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS
- Publication number 20220115354
- Publication date Apr 14, 2022
- FLIR Commercial Systems, Inc.
- Richard E. BORNFREUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-PART-REINFORCING THERMOSETTING RESIN COMPOSITION, SEMICO...
- Publication number 20210202421
- Publication date Jul 1, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Jin JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DI Solder Cup
- Publication number 20210202411
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...
- Publication number 20210134695
- Publication date May 6, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ASSEMBLY
- Publication number 20210066262
- Publication date Mar 4, 2021
- XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- TUNG-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE, CHIP CARRIER ASSEMBLY AND CHIP CARRIER DEVICE
- Publication number 20210043552
- Publication date Feb 11, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...
- Publication number 20210035944
- Publication date Feb 4, 2021
- TIEN CHIEN CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20210005564
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONI...
- Publication number 20200373268
- Publication date Nov 26, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H01 - BASIC ELECTRIC ELEMENTS

involving a permanent auxiliary member being left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost package warpage solution

Light-emitting device and displayer

Method of manufacturing substrate structure with filling material f...

Solderless interconnection structure and method of forming same

Semiconductor device interconnection systems and methods

Semiconductor packages

Low cost package warpage solution

Interconnect structure for semiconductor with ultra-fine pitch and...

Light-emitting assembly with raised adhesive layer

System and method for laser assisted bonding of an electronic device

Bonding interposer and integrated circuit chip, and ultrasound prob...

3DI solder cup

Electronic-part-reinforcing thermosetting resin composition, semico...

Metal-bump sidewall protection

Semiconductor package and method for manufacturing the same

Three dimensional integrated circuit (3DIC) with support structures

Low cost package warpage solution

Manufacturing of flip-chip electronic device with carrier having he...

3D integrated circuit (3DIC) structure

Micro-heaters in a film structure mounted on a substrate between a...

Semiconductor package structure and method for manufacturing the same

Substrate, electronic substrate, and method for producing electroni...

Solderless interconnection structure and method of forming same

3DI solder cup

Flip-chip electronic device with carrier having heat dissipation el...

Interposer, electronic substrate, and method for producing electron...

Metal-bump sidewall protection

Flip-chip method

System and method for laser assisted bonding of an electronic device

Laminating device and method for fabricating semiconductor package...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

LOW COST PACKAGE WARPAGE SOLUTION

STRUCTURES AND METHODS OF TRANSFERRING DIES AND DIE BONDED STRUCTURES

ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH ELEVATED TR...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

Metal-Bump Sidewall Protection

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

LOW COST PACKAGE WARPAGE SOLUTION

Light-Emitting Device and Displayer

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC-PART-REINFORCING THERMOSETTING RESIN COMPOSITION, SEMICO...

3DI Solder Cup

INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...

LIGHT-EMITTING ASSEMBLY

FILM STRUCTURE, CHIP CARRIER ASSEMBLY AND CHIP CARRIER DEVICE

CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD TH...

Metal-Bump Sidewall Protection

SUBSTRATE, ELECTRONIC SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONI...