involving a permanent auxiliary member being left in the finished device

Industry

CPC
H01L2224/80007

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80007involving a permanent auxiliary member being left in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched wafer and bonding support structure to improve wafer stacking
- Patent number 11,682,652
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally isolated silicon-based display
- Patent number 11,682,663
- Issue date Jun 20, 2023
- Meta Platforms Technologies, LLC
- Young Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned interlockin...
- Patent number 10,381,322
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Yasunobu Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 10,136,520
- Issue date Nov 20, 2018
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated electrical assembly
- Patent number 9,992,875
- Issue date Jun 5, 2018
- Semblant Limited
- Elizabeth Williams-Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 9,717,148
- Issue date Jul 25, 2017
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a chip in a flexible substrate
- Patent number 9,179,586
- Issue date Nov 3, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct bonding process using a compressible porous layer
- Patent number 9,034,728
- Issue date May 19, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Patrick Leduc
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE TO REINFORCE STACKED SEMICONDUCTOR WAFERS
- Publication number 20230352438
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
- Publication number 20230275064
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RING, STACKED STRUCTURE, AND METHOD FOR MANUFACTURING SEALI...
- Publication number 20230140743
- Publication date May 4, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...
- Publication number 20230139919
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20230013420
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Yi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
- Publication number 20220293556
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ISOLATED SILICON-BASED DISPLAY
- Publication number 20220157798
- Publication date May 19, 2022
- Facebook Technologies, LLC
- Young Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220093555
- Publication date Mar 24, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND A...
- Publication number 20200075533
- Publication date Mar 5, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST CMP PROCESSING FOR HYBRID BONDING
- Publication number 20200035641
- Publication date Jan 30, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...
- Publication number 20170311451
- Publication date Oct 26, 2017
- QUARTZDYNE, INC.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20150348935
- Publication date Dec 3, 2015
- Shawn O'Rourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20150287694
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING PROCESS USING A COMPRESSIBLE POROUS LAYER
- Publication number 20130252399
- Publication date Sep 26, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Patrick LEDUC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE
- Publication number 20130074331
- Publication date Mar 28, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20100297829
- Publication date Nov 25, 2010
- The Arizona Board of Regents, a body corporate acting for and on behalf of Ar...
- Shawn O'Rourke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

involving a permanent auxiliary member being left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond enhancement structure in microelectronics for trapping contami...

Semiconductor device and method of manufacturing the same

Notched wafer and bonding support structure to improve wafer stacking

Thermally isolated silicon-based display

Bond enhancement structure in microelectronics for trapping contami...

Three-dimensional memory device containing self-aligned interlockin...

Hybrid bonding systems and methods for semiconductor wafers

Methods of forming a microelectronic device structure, and related...

Hybrid bonding systems and methods for semiconductor wafers

Coated electrical assembly

Hybrid bonding systems and methods for semiconductor wafers

Methods of forming a microelectronic device structure, and related...

Method for aligning micro-electronic components

Method for assembling a chip in a flexible substrate

Direct bonding process using a compressible porous layer

Patents Applicationslast 30 patents

Adding Sealing Material to Wafer edge for Wafer Bonding

SUPPORT STRUCTURE TO REINFORCE STACKED SEMICONDUCTOR WAFERS

WAFER SHAPE CONTROL FOR W2W BONDING

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

SEALING RING, STACKED STRUCTURE, AND METHOD FOR MANUFACTURING SEALI...

Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

THERMALLY ISOLATED SILICON-BASED DISPLAY

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND A...

POST CMP PROCESSING FOR HYBRID BONDING

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...

Method of Temporarily Attaching a Rigid Carrier to a Substrate

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Hybrid Bonding Systems and Methods for Semiconductor Wafers

DIRECT BONDING PROCESS USING A COMPRESSIBLE POROUS LAYER

METHOD FOR ASSEMBLING A CHIP IN A FLEXIBLE SUBSTRATE

Method of Temporarily Attaching a Rigid Carrier to a Substrate