involving a temporary auxiliary member not forming part of the bonding apparatus

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H01L2224/85001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85001involving a temporary auxiliary member not forming part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming leadless semiconductor packages with plated lead...
- Patent number 11,145,581
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 10,796,931
- Issue date Oct 6, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 9,935,030
- Issue date Apr 3, 2018
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulatd semiconductor device and method of manufacturing...
- Patent number 9,728,478
- Issue date Aug 8, 2017
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 9,673,121
- Issue date Jun 6, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,490,224
- Issue date Nov 8, 2016
- SII SEMICONDUCTOR CORPORATION
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed in a resin section and method for manuf...
- Patent number 9,443,827
- Issue date Sep 13, 2016
- Cypress Semiconductor Corporation
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, electric power converting device, semiconductor apparat...
- Patent number 9,406,593
- Issue date Aug 2, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,397,072
- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire tail connector for a semiconductor device
- Patent number 9,362,244
- Issue date Jun 7, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a multiplicity of optoelectronic semiconductor...
- Patent number 9,318,357
- Issue date Apr 19, 2016
- Osram Opto Semiconductors GmbH
- Martin Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,320,153
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 9,224,641
- Issue date Dec 29, 2015
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with locking terminal
- Patent number 9,177,898
- Issue date Nov 3, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,177,936
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead frame land grid array
- Patent number 9,099,317
- Issue date Aug 4, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of substrate for a semiconductor package, manu...
- Patent number 9,054,116
- Issue date Jun 9, 2015
- SH MATERIALS CO., LTD.
- Yoichiro Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making circuit board
- Patent number 8,987,060
- Issue date Mar 24, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 8,975,734
- Issue date Mar 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for protection circuit module of secondary bat...
- Patent number 8,966,749
- Issue date Mar 3, 2015
- Samsung SDI Co., Ltd.
- Bong Young Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,935,850
- Issue date Jan 20, 2015
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing chip stacks, and a carrier for carrying out th...
- Patent number 8,932,910
- Issue date Jan 13, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20200126815
- Publication date Apr 23, 2020
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...
- Publication number 20190088579
- Publication date Mar 21, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20170271228
- Publication date Sep 21, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...
- Publication number 20160372440
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20160225738
- Publication date Aug 4, 2016
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20140374925
- Publication date Dec 25, 2014
- Elizabeth A. LOGAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...
- Publication number 20140284788
- Publication date Sep 25, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117544
- Publication date May 1, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20140038358
- Publication date Feb 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE
- Publication number 20140021162
- Publication date Jan 23, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
- Publication number 20140015117
- Publication date Jan 16, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20130337609
- Publication date Dec 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANU...
- Publication number 20130309818
- Publication date Nov 21, 2013
- Sumitomo Metal Mining Co., Ltd.
- Yoichiro Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CIRCUIT BOARD
- Publication number 20130298397
- Publication date Nov 14, 2013
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY
- Publication number 20130234307
- Publication date Sep 12, 2013
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD...
- Publication number 20130237017
- Publication date Sep 12, 2013
- Nitto Denko Corporation
- Hiroyuki KONDO
- B32 - LAYERED PRODUCTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
LEADFRAME BASED MULTI TERMINAL IC PACKAGE
- Publication number 20130210197
- Publication date Aug 15, 2013
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20130161806
- Publication date Jun 27, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Xueren ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130164440
- Publication date Jun 27, 2013
- IBIDEN CO., LTD.
- Masahiro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20130095615
- Publication date Apr 18, 2013
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME DESIGN TO IMPROVE RELIABILITY
- Publication number 20130067743
- Publication date Mar 21, 2013
- LSI Corporation
- Larry Golick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT TH...
- Publication number 20130065360
- Publication date Mar 14, 2013
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

involving a temporary auxiliary member not forming part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming leadless semiconductor packages with plated lead...

Manufacturing method of package structure

Semiconductor device and method of forming PIP with inner known goo...

Resin-encapsulated semiconductor device

Resin-encapsulatd semiconductor device and method of manufacturing...

Substrate less die package having wires with dielectric and metal c...

Carrierless chip package for integrated circuit devices, and method...

Power semiconductor chip with a metallic moulded body for contactin...

Packaged semiconductor devices having ribbon wires

Semiconductor device and manufacturing method thereof

Semiconductor device sealed in a resin section and method for manuf...

Lead frame, electric power converting device, semiconductor apparat...

Method of manufacturing semiconductor device

Wire tail connector for a semiconductor device

Method for producing a multiplicity of optoelectronic semiconductor...

Printed wiring board and method for manufacturing the same

Manufacturing method of forming an etch-back type semiconductor pac...

Core-jacket bonding wire

Processes and structures for IC fabrication

Fabrication method of semiconductor package without chip carrier

Integrated circuit package system with locking terminal

Method of manufacturing semiconductor device

Method for forming lead frame land grid array

Manufacturing method of substrate for a semiconductor package, manu...

Through wire interconnect (TWI) for semiconductor components having...

Method for making circuit board

Semiconductor package without chip carrier and fabrication method t...

Manufacturing method for protection circuit module of secondary bat...

Method of manufacturing printed wiring board

Method for producing chip stacks, and a carrier for carrying out th...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF PACKAGE STRUCTURE

METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE

VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE

LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANU...

METHOD FOR MAKING CIRCUIT BOARD

Through Wire Interconnect (TWI) For Semiconductor Components Having...

LEAD FRAME LAND GRID ARRAY

PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD...

CORE-JACKET BONDING WIRE

LEADFRAME BASED MULTI TERMINAL IC PACKAGE

Processes and structures for IC fabrication

WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF PACKAGE STRUCTURE

LEAD FRAME DESIGN TO IMPROVE RELIABILITY

METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT TH...