involving bonding one or several substrates on a non-temporary support

Industry

CPC
B81C1/00357

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00357involving bonding one or several substrates on a non-temporary support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,667,524
- Issue date Jun 6, 2023
- HYUNDAI KEFICO CORPORATION
- Jun Hwan Choi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for preparing the remainder of a donor substrate, substrate...
- Patent number 11,542,155
- Issue date Jan 3, 2023
- Soitec
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive micromachined ultrasonic transducer (CMUT) devices and m...
- Patent number 11,440,051
- Issue date Sep 13, 2022
- General Electric Company
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for uniform target erosion magnetic assemblies
- Patent number 11,390,520
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fang Chung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-volume millimeter scale manufacturing
- Patent number 11,325,828
- Issue date May 10, 2022
- Vibrant Composites Inc.
- Pratheev S. Sreetharan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and manufacturing method thereof
- Patent number 11,312,624
- Issue date Apr 26, 2022
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Li-Tien Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 11,305,980
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,274,037
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding apparatus, substrate pairing apparatus, and semic...
- Patent number 11,148,938
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Sho Kawadahara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microarray for delivery of therapeutic agent and methods of use
- Patent number 11,052,231
- Issue date Jul 6, 2021
- Corium, Inc.
- Zhongli Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 11,046,577
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for fabricating 3D soft microstructures
- Patent number 11,014,804
- Issue date May 25, 2021
- President and Fellows of Harvard College
- Nicholas W. Bartlett
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 10,968,097
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding of at least three substrates
- Patent number 10,954,122
- Issue date Mar 23, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing doubly re-entrant microstructures
- Patent number 10,927,005
- Issue date Feb 23, 2021
- The Regents of the University of California
- Muchen Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for the material-saving production of wafers and processing...
- Patent number 10,843,380
- Issue date Nov 24, 2020
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromechanical sensor
- Patent number 10,830,590
- Issue date Nov 10, 2020
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing low contact resistance semiconductor struc...
- Patent number 10,815,120
- Issue date Oct 27, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low contact resistance semiconductor structure and method for manuf...
- Patent number 10,689,246
- Issue date Jun 23, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication process for a symmetrical MEMS accelerometer
- Patent number 10,647,570
- Issue date May 12, 2020
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 10,611,630
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 10,513,432
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer, stress-isolation platform for a MEMS die
- Patent number 10,457,547
- Issue date Oct 29, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication process for a symmetrical MEMS accelerometer
- Patent number 10,392,247
- Issue date Aug 27, 2019
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 10,351,418
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS
- Publication number 20240025735
- Publication date Jan 25, 2024
- NATIONAL CENTRE FOR SCIENTIFIC RESEARCH "DEMOKRITOS"
- Evangelos GOGOLIDES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATOMIC-SMOOTH DEVICE WITH MICROSTRUCTURE, AND METHOD FOR PREPARING...
- Publication number 20230271825
- Publication date Aug 31, 2023
- RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
- Quanshui ZHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...
- Publication number 20230073003
- Publication date Mar 9, 2023
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016416
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MI...
- Publication number 20220315418
- Publication date Oct 6, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori OGAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-VOLUME MILLIMETER SCALE MANUFACTURING
- Publication number 20220259038
- Publication date Aug 18, 2022
- Vibrant Composites Inc.
- Pratheev S. SREETHARAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20220242724
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co.,Ltd
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220194783
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR TRANSFERRING A SURFACE LAYER TO CAVITIES
- Publication number 20220073343
- Publication date Mar 10, 2022
- SOITEC
- Bruno Ghyselen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
- Publication number 20220033249
- Publication date Feb 3, 2022
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND M...
- Publication number 20210260622
- Publication date Aug 26, 2021
- GENERAL ELECTRIC COMPANY
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
- Publication number 20210238030
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20210188628
- Publication date Jun 24, 2021
- HYUNDAI KEFICO CORPORATION
- Jun Hwan Choi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Treating a Solid Layer Bonded to a Carrier Substrate
- Publication number 20210039279
- Publication date Feb 11, 2021
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE,SUBSTRATE P...
- Publication number 20200385265
- Publication date Dec 10, 2020
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...
- Publication number 20200198963
- Publication date Jun 25, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20200123003
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200115226
- Publication date Apr 16, 2020
- MiraMEMS Sensing Technology Co., Ltd.
- LI-TIEN TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING 3D SOFT MICROSTRUCTURES
- Publication number 20200079643
- Publication date Mar 12, 2020
- President and Fellows of Harvard College
- Nicholas W. Bartlett
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING OF AT LEAST THREE SUBSTRATES
- Publication number 20200055729
- Publication date Feb 20, 2020
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION PROCESS FOR A SYMMETRICAL MEMS ACCELEROMETER
- Publication number 20190382264
- Publication date Dec 19, 2019
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Lianzhong YU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING LOW CONTACT RESISTANCE SEMICONDUCTOR STRUC...
- Publication number 20190345025
- Publication date Nov 14, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chao ZHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-VOLUME MILLIMETER SCALE MANUFACTURING
- Publication number 20190256353
- Publication date Aug 22, 2019
- VIBRANT COMPOSITES, INC.
- Pratheev S. SREETHARAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE
- Publication number 20190233280
- Publication date Aug 1, 2019
- Shenyang Silicon Technology Co., Ltd.
- Xiang LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER, STRESS-ISOLATION PLATFORM FOR A MEMS DIE
- Publication number 20180319654
- Publication date Nov 8, 2018
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bond Rings in Semiconductor Devices and Methods of Forming Same
- Publication number 20180230003
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

involving bonding one or several substrates on a non-temporary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Support structure for MEMS device with particle filter

Method of room temperature covalent bonding

Device and method for bonding substrates

Method for fabricating semiconductor device

Method for preparing the remainder of a donor substrate, substrate...

Method of treating a solid layer bonded to a carrier substrate

Capacitive micromachined ultrasonic transducer (CMUT) devices and m...

Systems and methods for uniform target erosion magnetic assemblies

High-volume millimeter scale manufacturing

MEMS device and manufacturing method thereof

Anti-stiction process for MEMS device

Dual micro-electro mechanical system and manufacturing method thereof

Substrate bonding apparatus, substrate pairing apparatus, and semic...

Microarray for delivery of therapeutic agent and methods of use

Method for processing a monocrystalline substrate and micromechanic...

Systems and methods for fabricating 3D soft microstructures

Support structure for MEMS device with particle filter

Method for bonding of at least three substrates

Method for manufacturing doubly re-entrant microstructures

Method for the material-saving production of wafers and processing...

Micromechanical sensor

Method for manufacturing low contact resistance semiconductor struc...

Low contact resistance semiconductor structure and method for manuf...

Fabrication process for a symmetrical MEMS accelerometer

Method for processing a monocrystalline substrate and micromechanic...

Anti-stiction process for MEMS device

Multi-layer, stress-isolation platform for a MEMS die

Method of room temperature covalent bonding

Fabrication process for a symmetrical MEMS accelerometer

Bond rings in semiconductor devices and methods of forming same

Patents Applicationslast 30 patents

METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS

DEVICE AND METHOD FOR BONDING SUBSTRATES

ATOMIC-SMOOTH DEVICE WITH MICROSTRUCTURE, AND METHOD FOR PREPARING...

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MI...

HIGH-VOLUME MILLIMETER SCALE MANUFACTURING

ANTI-STICTION PROCESS FOR MEMS DEVICE

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

METHOD FOR TRANSFERRING A SURFACE LAYER TO CAVITIES

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

DEVICE AND METHOD FOR BONDING SUBSTRATES

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DEVICES AND M...

SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Method of Treating a Solid Layer Bonded to a Carrier Substrate

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE,SUBSTRATE P...

METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...

ANTI-STICTION PROCESS FOR MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR FABRICATING 3D SOFT MICROSTRUCTURES

METHOD FOR BONDING OF AT LEAST THREE SUBSTRATES

FABRICATION PROCESS FOR A SYMMETRICAL MEMS ACCELEROMETER

METHOD FOR MANUFACTURING LOW CONTACT RESISTANCE SEMICONDUCTOR STRUC...

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

HIGH-VOLUME MILLIMETER SCALE MANUFACTURING

METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE

MULTI-LAYER, STRESS-ISOLATION PLATFORM FOR A MEMS DIE

Bond Rings in Semiconductor Devices and Methods of Forming Same