involving forming a eutectic alloy at the bonding interface

Industry

CPC
H01L2224/83805

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83805involving forming a eutectic alloy at the bonding interface

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for wafer bonding and compound semiconductor wafer
- Patent number 12,068,296
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,532,511
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gung-Pei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,502,233
- Issue date Nov 15, 2022
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low drain-source on resistance semiconductor component and method o...
- Patent number 11,387,373
- Issue date Jul 12, 2022
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multi-junction LED with eutectic bonding and method of manufacturin...
- Patent number 11,251,167
- Issue date Feb 15, 2022
- SUNDIODE KOREA
- James Chinmo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semi-flexible eutectic bonder piece arraneg...
- Patent number 11,211,354
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,796,954
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gung-Pei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bond carrier wafer from device wafer
- Patent number 10,741,718
- Issue date Aug 11, 2020
- Lumileds, LLC
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing a device
- Patent number 10,431,715
- Issue date Oct 1, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricated by flux-free soldering
- Patent number 10,325,838
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,230,020
- Issue date Mar 12, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring-frame power package
- Patent number 10,199,313
- Issue date Feb 5, 2019
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount package and manufacturing method thereof
- Patent number 10,163,819
- Issue date Dec 25, 2018
- National Institute of Advanced Industrial Science and Technology
- Shiro Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,157,890
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband radio frequency power amplifiers, and methods of manufact...
- Patent number 10,141,899
- Issue date Nov 27, 2018
- NXP USA, INC.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Bonding Structure
- Publication number 20240312955
- Publication date Sep 19, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Heterogeneous Chip Integration of III-Nitride-based Materials for O...
- Publication number 20220278073
- Publication date Sep 1, 2022
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John Michael Dallesasse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER
- Publication number 20220238501
- Publication date Jul 28, 2022
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210202814
- Publication date Jul 1, 2021
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210090903
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Tatsuo Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20200411372
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- GUNG-PEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-JUNCTION LED WITH EUTECTIC BONDING AND METHOD OF MANUFACTURIN...
- Publication number 20200402964
- Publication date Dec 24, 2020
- SUNDIODE KOREA
- James Chinmo KIM
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200006130
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- GUNG-PEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SEMI-FLEXIBLE EUTECTIC BONDER PIECE ARRANGM...
- Publication number 20190164929
- Publication date May 30, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chih-Hang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM REACTING FORCE WELDING METHOD AND DEVICE THEREOF
- Publication number 20180033717
- Publication date Feb 1, 2018
- GUANGZHOU LEDTEEN OPTOELECTRONICS CO., LTD
- Jiabing SU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATED BY FLUX-FREE SOLDERING
- Publication number 20170365544
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170345798
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170194291
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20170141075
- Publication date May 18, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ken Osawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE
- Publication number 20170025334
- Publication date Jan 26, 2017
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315065
- Publication date Oct 27, 2016
- CHEN-CHUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160300782
- Publication date Oct 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD
- Publication number 20150311178
- Publication date Oct 29, 2015
- InvenSense, Inc.
- Jong Il SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20150262967
- Publication date Sep 17, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFTER
- Publication number 20150228849
- Publication date Aug 13, 2015
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUBSTRATE ASSEMBLY AND METHOD
- Publication number 20150179599
- Publication date Jun 25, 2015
- NXP B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS

involving forming a eutectic alloy at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for wafer bonding and compound semiconductor wafer

Light emitting diode display with redundancy scheme

Light emitting device and fluidic manufacture thereof

Multilayered transient liquid phase bonding

Method for forming semiconductor structure

Electronic device

Low drain-source on resistance semiconductor component and method o...

Light emitting diode display with redundancy scheme

Multi-junction LED with eutectic bonding and method of manufacturin...

Systems and methods for semi-flexible eutectic bonder piece arraneg...

Light emitting diode display with redundancy scheme

Light emitting device and fluidic manufacture thereof

Semiconductor structure and method for forming the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Laser de-bond carrier wafer from device wafer

Wafer level flat no-lead semiconductor packages and methods of manu...

Low-temperature bonding with spaced nanorods and eutectic alloys

Power semiconductor device with small contact footprint and the pre...

Device and method for producing a device

Light emitting diode display with redundancy scheme

Semiconductor device fabricated by flux-free soldering

Wafer level flat no-lead semiconductor packages and methods of manu...

Light emitting die (LED) packages and related methods

Light emitting device and fluidic manufacture thereof

Ring-frame power package

Laser assisted transfer welding process

Surface mount package and manufacturing method thereof

Semiconductor structure and method of manufacturing the same

Broadband radio frequency power amplifiers, and methods of manufact...

Patents Applicationslast 30 patents

Bonding Structure

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

DISPLAY PANEL

LIQUID METAL THERMAL INTERFACE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Heterogeneous Chip Integration of III-Nitride-based Materials for O...

METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

MULTI-JUNCTION LED WITH EUTECTIC BONDING AND METHOD OF MANUFACTURIN...

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Light Emitting Device and Fluidic Manufacture Thereof

SYSTEMS AND METHODS FOR SEMI-FLEXIBLE EUTECTIC BONDER PIECE ARRANGM...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

VACUUM REACTING FORCE WELDING METHOD AND DEVICE THEREOF

SEMICONDUCTOR DEVICE FABRICATED BY FLUX-FREE SOLDERING

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PROCESS OF FORMING SEMICONDUCTOR DEVICE

HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD

HERMETICALLY SEALED WAFER PACKAGES

LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFTER

DIE SUBSTRATE ASSEMBLY AND METHOD