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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80908
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding alignment marks at bonding interface
Patent number
11,876,049
Issue date
Jan 16, 2024
Yangtze Memory Technologies Co., Ltd.
Meng Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
Patent number
11,791,305
Issue date
Oct 17, 2023
Kioxia Corporation
Sho Kawadahara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device including memory chip and peripheral memory chip and...
Patent number
11,721,655
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Jooyong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
Patent number
11,621,202
Issue date
Apr 4, 2023
Western Digital Technologies, Inc.
Liang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor storage device including first pads on a first chip t...
Patent number
11,482,514
Issue date
Oct 25, 2022
Kioxia Corporation
Hiromitsu Harashima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding alignment marks at bonding in interface
Patent number
11,289,422
Issue date
Mar 29, 2022
Yangtze Memory Technologies Co., Ltd.
Meng Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connectivity detection for wafer-to-wafer alignment and bonding
Patent number
11,031,308
Issue date
Jun 8, 2021
SanDisk Technologies LLC
Seungpil Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,985,132
Issue date
Apr 20, 2021
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for bonding wafers and bonding tool
Patent number
10,872,873
Issue date
Dec 22, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chien-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding system
Patent number
10,840,213
Issue date
Nov 17, 2020
Tokyo Electron Limited
Masataka Matsunaga
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for bonding semiconductor chips to a landing wafer
Patent number
10,797,016
Issue date
Oct 6, 2020
Imec VZW
Vikas Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,756,046
Issue date
Aug 25, 2020
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Information
Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
Patent number
10,639,875
Issue date
May 5, 2020
Samsung Electronics Co., Ltd.
Tae-yeong Kim
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for bonding substrates together, and substrate bonding device
Patent number
10,580,752
Issue date
Mar 3, 2020
BONDTECH CO., LTD.
Akira Yamauchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
Patent number
10,438,920
Issue date
Oct 8, 2019
Tokyo Electron Limited
Yoshitaka Otsuka
B32 - LAYERED PRODUCTS
Information
Patent Grant
Hybrid bonding system and cleaning method thereof
Patent number
9,917,069
Issue date
Mar 13, 2018
Taiwan Semiconductor Manufacturing Company Ltd.
Ping-Yin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
Patent number
9,741,595
Issue date
Aug 22, 2017
Tokyo Electron Limited
Kenji Sugakawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
Publication number
20240136231
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Donggap SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING
Publication number
20240030168
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20230402426
Publication date
Dec 14, 2023
Powerchip Semiconductor Manufacturing Corporation
Shih-Ping Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
Publication number
20230343743
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...
Publication number
20230317655
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
Jooyong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
Publication number
20230275062
Publication date
Aug 31, 2023
TOKYO ELECTRON LIMITED
Toshifumi Inamasu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING
Publication number
20230230954
Publication date
Jul 20, 2023
Board of Regents, The University of Texas System
Sidlgata V. Sreenivasan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
Publication number
20230223377
Publication date
Jul 13, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
CHIH-WEI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
Publication number
20230207513
Publication date
Jun 29, 2023
EV GROUP E. THALLNER GMBH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
Publication number
20230197672
Publication date
Jun 22, 2023
KIOXIA Corporation
Ai MORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
Publication number
20230163094
Publication date
May 25, 2023
Samsung Electronics Co., Ltd.
Euisun Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
Publication number
20230087198
Publication date
Mar 23, 2023
HANWHA PRECISION MACHINERY CO., LTD.
Tae Woo KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME
Publication number
20230089276
Publication date
Mar 23, 2023
HANWHA PRECISION MACHINERY CO., LTD.
Tae Woo Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
Publication number
20230030272
Publication date
Feb 2, 2023
BONDTECH CO., LTD.
Akira YAMAUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
Publication number
20230032570
Publication date
Feb 2, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHIH-YUAN CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PICK AND PLACE METHOD AND APPARATUS THEREOF
Publication number
20230025157
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDING METHOD AND DIE BONDING APPARATUS
Publication number
20230028219
Publication date
Jan 26, 2023
SEMES CO., LTD.
Chang Jin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
Publication number
20220367405
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hong-Ta Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
Publication number
20220285233
Publication date
Sep 8, 2022
WESTERN DIGITAL TECHNOLOGIES, INC.,
Liang LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
Publication number
20220262764
Publication date
Aug 18, 2022
KIOXIA Corporation
Sho KAWADAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
Publication number
20220173038
Publication date
Jun 2, 2022
Yangtze Memory Technologies Co., Ltd.
Meng Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...
Publication number
20220157754
Publication date
May 19, 2022
Samsung Electronics Co., Ltd.
Jooyong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE
Publication number
20210082896
Publication date
Mar 18, 2021
KIOXIA Corporation
Hiromitsu HARASHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
Publication number
20210072653
Publication date
Mar 11, 2021
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Meng Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20210057373
Publication date
Feb 25, 2021
SAMSUNG ELECTRONICS CO,. LTD.
TAEYEONG KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTIVITY DETECTION FOR WAFER-TO-WAFER ALIGNMENT AND BONDING
Publication number
20200381316
Publication date
Dec 3, 2020
SANDISK TECHNOLOGIES LLC
Seungpil Lee
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
Publication number
20190148333
Publication date
May 16, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
Publication number
20150155210
Publication date
Jun 4, 2015
Samsung Electronics Co., Ltd.
Byung Joon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING MISALIGNMENT REDUCTION
Publication number
20140356981
Publication date
Dec 4, 2014
International Business Machines Corporation
Alex R. HUBBARD
H01 - BASIC ELECTRIC ELEMENTS