involving monitoring

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H01L2224/80908

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80908involving monitoring

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,990,444
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 11,721,655
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,621,202
- Issue date Apr 4, 2023
- Western Digital Technologies, Inc.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including first pads on a first chip t...
- Patent number 11,482,514
- Issue date Oct 25, 2022
- Kioxia Corporation
- Hiromitsu Harashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectivity detection for wafer-to-wafer alignment and bonding
- Patent number 11,031,308
- Issue date Jun 8, 2021
- SanDisk Technologies LLC
- Seungpil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
- Patent number 10,639,875
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...
- Publication number 20240363446
- Publication date Oct 31, 2024
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS
- Publication number 20240357839
- Publication date Oct 24, 2024
- Nitin Ashok Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240297143
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240266317
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIO...
- Publication number 20240213210
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING
- Publication number 20240030168
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230402426
- Publication date Dec 14, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...
- Publication number 20230317655
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jooyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING
- Publication number 20230230954
- Publication date Jul 20, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20230223377
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230197672
- Publication date Jun 22, 2023
- KIOXIA Corporation
- Ai MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME
- Publication number 20230089276
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
- Publication number 20230087198
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20230032570
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK AND PLACE METHOD AND APPARATUS THEREOF
- Publication number 20230025157
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING APPARATUS
- Publication number 20230028219
- Publication date Jan 26, 2023
- SEMES CO., LTD.
- Chang Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20220367405
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285233
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS

involving monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding tool and bonding method thereof

Substrate bonding apparatus and method of manufacturing semiconduct...

Bonding alignment marks at bonding interface

Manufacturing apparatus, operation method thereof, and method for m...

Memory device including memory chip and peripheral memory chip and...

Electrical overlay measurement methods and structures for wafer-to-...

Semiconductor storage device including first pads on a first chip t...

Bonding alignment marks at bonding in interface

Connectivity detection for wafer-to-wafer alignment and bonding

Bonding apparatus, bonding system, bonding method and storage medium

Method for bonding wafers and bonding tool

Bonding system

Method for bonding semiconductor chips to a landing wafer

Bonding apparatus, bonding system, bonding method and storage medium

Wafer bonding apparatus and wafer bonding system including the same

Method for bonding substrates together, and substrate bonding device

Bonding apparatus, bonding system, bonding method and storage medium

Hybrid bonding system and cleaning method thereof

Bonding method, storage medium, bonding apparatus and bonding system

Patents Applicationslast 30 patents

Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...

MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

BONDING TOOL AND BONDING METHOD THEREOF

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUS FOR MEASURING AN ADHESION FORCE

SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIO...

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

Integrated process sequence for hybrid bonding applications

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

APPARATUS FOR MEASURING AN ADHESION FORCE

WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND...

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING

WAFER BONDING DEVICE AND WAFER BONDING METHOD

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME

HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

BONDING TOOL AND BONDING METHOD THEREOF

PICK AND PLACE METHOD AND APPARATUS THEREOF

DIE BONDING METHOD AND DIE BONDING APPARATUS

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...