involving stretching of the auxiliary support post dicing

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CPC
H01L2221/68336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68336involving stretching of the auxiliary support post dicing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and wafer processing method
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- Issue date Feb 13, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation
- Patent number 11,881,434
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Connie Alagadan Esteron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,854,892
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having a semiconductor light emitting source
- Patent number 11,848,316
- Issue date Dec 19, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of processing a substrate
- Patent number 11,842,926
- Issue date Dec 12, 2023
- Disco Corporation
- Kensuke Nagaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor dies
- Patent number 11,837,518
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
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- Issue date Nov 14, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor man...
- Patent number 11,804,471
- Issue date Oct 31, 2023
- Kioxia Corporation
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
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- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of demounting thin semiconductor devices
- Patent number 11,735,464
- Issue date Aug 22, 2023
- American Semiconductor, Inc.
- Douglas R. Hackler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
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- Issue date Jun 13, 2023
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- Ryota Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic segmented LED array architecture
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- Issue date May 16, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of device wafer
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- Issue date May 9, 2023
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- Minoru Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape expanding apparatus
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- Issue date Apr 25, 2023
- Disco Corporation
- Atsushi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
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- Issue date Apr 11, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for automatic film expansion, storage medium, and device
- Patent number 11,594,655
- Issue date Feb 28, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Renjie Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subring for semiconductor dies
- Patent number 11,482,442
- Issue date Oct 25, 2022
- Texas Instruments Incorporated
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dividing method
- Patent number 11,424,162
- Issue date Aug 23, 2022
- Hamamatsu Photonics K.K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,417,640
- Issue date Aug 16, 2022
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic segmented LED array architecture
- Patent number 11,355,548
- Issue date Jun 7, 2022
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,322,405
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,322,406
- Issue date May 3, 2022
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer
- Patent number 11,315,821
- Issue date Apr 26, 2022
- Disco Corporation
- Jinyan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer processing method
- Patent number 11,302,578
- Issue date Apr 12, 2022
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,289,379
- Issue date Mar 29, 2022
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,270,916
- Issue date Mar 8, 2022
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,251,082
- Issue date Feb 15, 2022
- Disco Corporation
- Shigenori Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20240055313
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240038573
- Publication date Feb 1, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PAVED STRUCTURE
- Publication number 20240006231
- Publication date Jan 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre MONTMEAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230387098
- Publication date Nov 30, 2023
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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CHIP BONDING SYSTEM AND CHIP BONDING METHOD
- Publication number 20230307284
- Publication date Sep 28, 2023
- BONDTECH CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...
- Publication number 20230207390
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER EXPANDER FOR UNIFORMLY EXPANDING GAP BETWEEN DIES, AND DIE SU...
- Publication number 20230207352
- Publication date Jun 29, 2023
- SEMES CO., LTD.
- Do Youn LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20230191537
- Publication date Jun 22, 2023
- Disco Corporation
- Yoshinobu SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING PLATE-SHAPED WORKPIECE
- Publication number 20230099416
- Publication date Mar 30, 2023
- Disco Corporation
- Nobuyuki FUKUSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220384406
- Publication date Dec 1, 2022
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220367231
- Publication date Nov 17, 2022
- Disco Corporation
- Jinyan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20220208610
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220157797
- Publication date May 19, 2022
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
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- KULICKE & SOFFA NETHERLANDS B.V.
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Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...
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Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20220068744
- Publication date Mar 3, 2022
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Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
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- Publication date Feb 10, 2022
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- Kensuke NAGAOKA
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20210384076
- Publication date Dec 9, 2021
- Disco Corporation
- Yoshinobu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210348038
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- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
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METHOD FOR AUTOMATIC FILM EXPANSION, STORAGE MEDIUM, AND DEVICE
- Publication number 20210313484
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- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Renjie JIANG
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Information Patent Application
METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE
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- Sascha Moeller
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PROCESSING METHOD OF DEVICE WAFER
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- Minoru Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION
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- TEXAS INSTRUMENTS INCORPORATED
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Information Patent Application
DIE PROCESSING
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- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PRODUCING METHOD, HOLDING FILM, AND HOLDING TOOL FORMING...
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- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji HAYASHISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210189198
- Publication date Jun 24, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210189197
- Publication date Jun 24, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
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- Publication number 20210183683
- Publication date Jun 17, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew John Sherbin
- H01 - BASIC ELECTRIC ELEMENTS

involving stretching of the auxiliary support post dicing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dynamic release tapes for assembly of discrete components

Wafer processing apparatus and wafer processing method

Semiconductor die singulation

Substrate dicing method, method of fabricating semiconductor device...

Display apparatus having a semiconductor light emitting source

Method of processing a substrate

Coated semiconductor dies

Display apparatus and manufacturing method thereof

Method for manufacturing semiconductor device and semiconductor man...

Die processing

Method of demounting thin semiconductor devices

Manufacturing method for semiconductor device

Monolithic segmented LED array architecture

Processing method of device wafer

Tape expanding apparatus

Method of processing a wafer

Method for automatic film expansion, storage medium, and device

Method and apparatus for embedding semiconductor devices

Subring for semiconductor dies

Substrate dividing method

Display apparatus and manufacturing method thereof

Integrated circuit backside metallization

Monolithic segmented LED array architecture

Substrate dicing method, method of fabricating semiconductor device...

Wafer processing method

Processing method for wafer

Wafer processing method

Wafer processing method

Wafer processing method

Wafer processing method

Patents Applicationslast 30 patents

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

COATED SEMICONDUCTOR DIES

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

DIE PROCESSING

METHOD FOR MANUFACTURING A PAVED STRUCTURE

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

CHIP BONDING SYSTEM AND CHIP BONDING METHOD

METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...

WAFER EXPANDER FOR UNIFORMLY EXPANDING GAP BETWEEN DIES, AND DIE SU...

PROCESSING METHOD OF WORKPIECE

METHOD OF PROCESSING PLATE-SHAPED WORKPIECE

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

WAFER PROCESSING METHOD

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

COATED SEMICONDUCTOR DIES

METHOD OF PROCESSING A SUBSTRATE

WAFER PROCESSING METHOD AND MACHINE

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

METHOD FOR AUTOMATIC FILM EXPANSION, STORAGE MEDIUM, AND DEVICE

METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE

PROCESSING METHOD OF DEVICE WAFER

SEMICONDUCTOR DIE SINGULATION

DIE PROCESSING

COMPONENT PRODUCING METHOD, HOLDING FILM, AND HOLDING TOOL FORMING...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

SUBRING FOR SEMICONDUCTOR DIES