involving stretching of the auxiliary support post dicing

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CPC
H01L2221/68336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68336involving stretching of the auxiliary support post dicing

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Tape expanding apparatus
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- Issue date Apr 25, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
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- Issue date Apr 11, 2023
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Information Patent Grant
Method for automatic film expansion, storage medium, and device
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Method and apparatus for embedding semiconductor devices
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Information Patent Grant
Display apparatus and manufacturing method thereof
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Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
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Information Patent Grant
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- Issue date May 3, 2022
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Information Patent Grant
Processing method for wafer
- Patent number 11,315,821
- Issue date Apr 26, 2022
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- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS

involving stretching of the auxiliary support post dicing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of separating electronic devices having a back layer and app...

Dynamic release tapes for assembly of discrete components

Wafer processing method and machine

Component producing method, holding film, and holding tool forming...

Dynamic release tapes for assembly of discrete components

Wafer processing apparatus and wafer processing method

Semiconductor die singulation

Substrate dicing method, method of fabricating semiconductor device...

Display apparatus having a semiconductor light emitting source

Method of processing a substrate

Coated semiconductor dies

Display apparatus and manufacturing method thereof

Method for manufacturing semiconductor device and semiconductor man...

Die processing

Method of demounting thin semiconductor devices

Manufacturing method for semiconductor device

Monolithic segmented LED array architecture

Processing method of device wafer

Tape expanding apparatus

Method of processing a wafer

Method for automatic film expansion, storage medium, and device

Method and apparatus for embedding semiconductor devices

Subring for semiconductor dies

Substrate dividing method

Display apparatus and manufacturing method thereof

Integrated circuit backside metallization

Monolithic segmented LED array architecture

Substrate dicing method, method of fabricating semiconductor device...

Wafer processing method

Processing method for wafer

Patents Applicationslast 30 patents

EXPANSION RETAINING RING

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

COATED SEMICONDUCTOR DIES

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

DIE PROCESSING

METHOD FOR MANUFACTURING A PAVED STRUCTURE

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

CHIP BONDING SYSTEM AND CHIP BONDING METHOD

METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...

WAFER EXPANDER FOR UNIFORMLY EXPANDING GAP BETWEEN DIES, AND DIE SU...

PROCESSING METHOD OF WORKPIECE

METHOD OF PROCESSING PLATE-SHAPED WORKPIECE

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

WAFER PROCESSING METHOD

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MAN...

COATED SEMICONDUCTOR DIES

METHOD OF PROCESSING A SUBSTRATE

WAFER PROCESSING METHOD AND MACHINE

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

METHOD FOR AUTOMATIC FILM EXPANSION, STORAGE MEDIUM, AND DEVICE

METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE

PROCESSING METHOD OF DEVICE WAFER

SEMICONDUCTOR DIE SINGULATION

DIE PROCESSING

COMPONENT PRODUCING METHOD, HOLDING FILM, AND HOLDING TOOL FORMING...