involving the separation of the active layers from a substrate

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H01L21/7806

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7806involving the separation of the active layers from a substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating a semiconductor wafer
- Patent number 12,230,689
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Helmut Brech
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip having strength adjustme...
- Patent number 12,230,603
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device having a second semicond...
- Patent number 12,211,703
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,930
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tse-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method
- Patent number 12,191,213
- Issue date Jan 7, 2025
- Disco Corporation
- Naoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Growth of cubic crystalline phase structure on silicon substrates a...
- Patent number 12,183,852
- Issue date Dec 31, 2024
- Steven R. J. Brueck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, method for manufacturing semiconductor sub...
- Patent number 12,183,636
- Issue date Dec 31, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Incorporating semiconductors on a polycrystalline diamond substrate
- Patent number 12,176,221
- Issue date Dec 24, 2024
- Texas State University
- Raju Ahmed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of obtaining a smooth surface with epitaxial lateral overgrowth
- Patent number 12,146,237
- Issue date Nov 19, 2024
- The Regents of the University of California
- Takeshi Kamikawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device...
- Patent number 12,136,569
- Issue date Nov 5, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device with backside power distribution network and method...
- Patent number 12,131,996
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate
- Patent number 12,112,985
- Issue date Oct 8, 2024
- GlobalWafers Co., Ltd.
- Chih-Yuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for producing at least one modification in a s...
- Patent number 12,107,017
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ralf Rieske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite structure comprising a thin monocr...
- Patent number 12,087,631
- Issue date Sep 10, 2024
- Soitec
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and manufacturing device of edge...
- Patent number 12,040,190
- Issue date Jul 16, 2024
- Kioxia Corporation
- Takashi Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for separating semiconductor elements and method for fabr...
- Patent number 12,033,988
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- In Hyuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature method for transfer and healing of a semiconductor...
- Patent number 12,027,421
- Issue date Jul 2, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting diodes
- Patent number 11,990,565
- Issue date May 21, 2024
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a polymer support...
- Patent number 11,978,671
- Issue date May 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor chip
- Patent number 11,967,529
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for fabricating three-dimensional semiconductor device using...
- Patent number 11,956,958
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor based on graphene nanoribbon and method for...
- Patent number 11,948,793
- Issue date Apr 2, 2024
- Tsinghua University
- Tian-Fu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor manufacturing method
- Patent number 11,915,978
- Issue date Feb 27, 2024
- Nippon Telegraph and Telephone Corporation
- Takuya Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods of fabricating electronic devices using sepa...
- Patent number 11,915,983
- Issue date Feb 27, 2024
- APPLIED NOVEL DEVICES, INC.
- Leo Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing nitride semiconductor substrate, nitride s...
- Patent number 11,908,688
- Issue date Feb 20, 2024
- Sumitomo Chemical Company, Limited
- Takehiro Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating GaN chip and GaN chip
- Patent number 11,908,689
- Issue date Feb 20, 2024
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Fen Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, method for manufacturing semiconductor sub...
- Patent number 11,894,272
- Issue date Feb 6, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FABR...
- Publication number 20240332265
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- In Hyuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
- Publication number 20240321747
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Transistors Occupying Reduced Chip Area and the Methods Fo...
- Publication number 20240312913
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING...
- Publication number 20240268119
- Publication date Aug 8, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER
- Publication number 20240243014
- Publication date Jul 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-JUNCTION BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE...
- Publication number 20240194561
- Publication date Jun 13, 2024
- Nippon Telegraph and Telephone Corporation
- Yuta Shiratori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...
- Publication number 20240120238
- Publication date Apr 11, 2024
- FILNEX INC.
- Mitsuhiko OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20240105512
- Publication date Mar 28, 2024
- GLOBALWAFERS CO., LTD.
- Chih-Yuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSPORT TRANSISTOR DEVICES WITH BACK SIDE INTERCONNECTS
- Publication number 20240079462
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240063297
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES
- Publication number 20240063217
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING III-N MATERIAL-BASED VERTICAL COMPONENTS
- Publication number 20240047201
- Publication date Feb 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Guy FEUILLET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411467
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device Having a Second Semicond...
- Publication number 20230395394
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GAN CHIP AND GAN CHIP
- Publication number 20230395375
- Publication date Dec 7, 2023
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Fen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
- Publication number 20230395419
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
- Publication number 20230395418
- Publication date Dec 7, 2023
- EV GROUP E. THALLNER GMBH
- Boris Povazay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
- Publication number 20230377972
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...
- Publication number 20230369285
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230361184
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Teng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PREPARING TWO-DIMENSIONAL BLACK PHOSPHORUS
- Publication number 20230357953
- Publication date Nov 9, 2023
- The Hong Kong Polytechnic University
- Jianhua HAO
- C30 - CRYSTAL GROWTH
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20230343782
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Seungmin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230335631
- Publication date Oct 19, 2023
- GUANGDONG ZHINENG TECHNOLOGIES, CO. LTD.
- Zilan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE WITH BACKSIDE POWER DISTRIBUTION NETWORK AND METHOD...
- Publication number 20230307364
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FABRICATING ELECTRONIC DEVICES USING SEPA...
- Publication number 20230170263
- Publication date Jun 1, 2023
- APPLIED NOVEL DEVICES, INC.
- LEO MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20230171959
- Publication date Jun 1, 2023
- SK HYNIX INC.
- Nam Kuk KIM
- H01 - BASIC ELECTRIC ELEMENTS

involving the separation of the active layers from a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating a semiconductor wafer

Method of fabricating a semiconductor chip having strength adjustme...

Methods for forming a semiconductor device having a second semicond...

Semiconductor device

Wafer manufacturing method and laminated device chip manufacturing...

Inspection method

Growth of cubic crystalline phase structure on silicon substrates a...

Semiconductor substrate, method for manufacturing semiconductor sub...

Incorporating semiconductors on a polycrystalline diamond substrate

Method of obtaining a smooth surface with epitaxial lateral overgrowth

Semiconductor device manufacturing method and semiconductor device...

Stacked device with backside power distribution network and method...

Method for manufacturing ferromagnetic-dielectric composite material

Semiconductor substrate

Method and apparatus for producing at least one modification in a s...

Method for producing a composite structure comprising a thin monocr...

Semiconductor manufacturing method and manufacturing device of edge...

Apparatus for separating semiconductor elements and method for fabr...

Low-temperature method for transfer and healing of a semiconductor...

Display device using semiconductor light-emitting diodes

Process of forming an electronic device including a polymer support...

Methods of manufacturing semiconductor chip

Method for manufacturing a semiconductor substrate and device by bo...

Method for fabricating three-dimensional semiconductor device using...

Field effect transistor based on graphene nanoribbon and method for...

Transistor manufacturing method

Structures and methods of fabricating electronic devices using sepa...

Method for manufacturing nitride semiconductor substrate, nitride s...

Method for fabricating GaN chip and GaN chip

Semiconductor substrate, method for manufacturing semiconductor sub...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

APPARATUS FOR SEPARATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FABR...

BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS

Vertical Transistors Occupying Reduced Chip Area and the Methods Fo...

METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING...

ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER

HETERO-JUNCTION BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE...

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...

SEMICONDUCTOR SUBSTRATE

VERTICAL TRANSPORT TRANSISTOR DEVICES WITH BACK SIDE INTERCONNECTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES

METHOD FOR PRODUCING III-N MATERIAL-BASED VERTICAL COMPONENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods for Forming a Semiconductor Device Having a Second Semicond...

METHOD FOR FABRICATING GAN CHIP AND GAN CHIP

METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO

METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

METHODS FOR PREPARING TWO-DIMENSIONAL BLACK PHOSPHORUS

INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STACKED DEVICE WITH BACKSIDE POWER DISTRIBUTION NETWORK AND METHOD...

STRUCTURES AND METHODS OF FABRICATING ELECTRONIC DEVICES USING SEPA...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...