involving the separation of the active layers from a substrate

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H01L21/7806

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7806involving the separation of the active layers from a substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor chip
- Patent number 11,967,529
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
- Patent number 11,961,765
- Issue date Apr 16, 2024
- Mitsubishi Electric Corporation
- Shuichi Hiza
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for fabricating three-dimensional semiconductor device using...
- Patent number 11,956,958
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor based on graphene nanoribbon and method for...
- Patent number 11,948,793
- Issue date Apr 2, 2024
- Tsinghua University
- Tian-Fu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor manufacturing method
- Patent number 11,915,978
- Issue date Feb 27, 2024
- Nippon Telegraph and Telephone Corporation
- Takuya Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods of fabricating electronic devices using sepa...
- Patent number 11,915,983
- Issue date Feb 27, 2024
- APPLIED NOVEL DEVICES, INC.
- Leo Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing nitride semiconductor substrate, nitride s...
- Patent number 11,908,688
- Issue date Feb 20, 2024
- Sumitomo Chemical Company, Limited
- Takehiro Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating GaN chip and GaN chip
- Patent number 11,908,689
- Issue date Feb 20, 2024
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Fen Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, method for manufacturing semiconductor sub...
- Patent number 11,894,272
- Issue date Feb 6, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of manufacturing the same
- Patent number 11,887,893
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Chih-Yuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing a monolayer or few-layer crystalline black ph...
- Patent number 11,885,039
- Issue date Jan 30, 2024
- The Hong Kong Polytechnic University
- Jianhua Hao
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for transferring a useful layer onto a support substrate
- Patent number 11,881,429
- Issue date Jan 23, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer to a carrier substrate
- Patent number 11,876,015
- Issue date Jan 16, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 11,855,040
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with selective component removal
- Patent number 11,854,855
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate production systems and related methods
- Patent number 11,830,771
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Geometrically shaped components in an assembly for a transfer print...
- Patent number 11,829,074
- Issue date Nov 28, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Ralf Lerner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser conditioning of solid bodies using prior knowledge from previ...
- Patent number 11,822,307
- Issue date Nov 21, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor sub...
- Patent number 11,798,805
- Issue date Oct 24, 2023
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on diamond substrate, precursor for use in preparing...
- Patent number 11,791,157
- Issue date Oct 17, 2023
- THE UNIVERSITY OF BRISTOL
- Martin Hermann Hans Kuball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip having strength adjustme...
- Patent number 11,756,924
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device
- Patent number 11,742,215
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of re-using a silicon carbide substrate
- Patent number 11,735,642
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device having optical black region, method of m...
- Patent number 11,735,620
- Issue date Aug 22, 2023
- Sony Group Corporation
- Kazufumi Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,710,731
- Issue date Jul 25, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,676,956
- Issue date Jun 13, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning solid-body layers provided with components
- Patent number 11,664,277
- Issue date May 30, 2023
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...
- Publication number 20240120238
- Publication date Apr 11, 2024
- FILNEX INC.
- Mitsuhiko OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20240105512
- Publication date Mar 28, 2024
- GLOBALWAFERS CO., LTD.
- Chih-Yuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSPORT TRANSISTOR DEVICES WITH BACK SIDE INTERCONNECTS
- Publication number 20240079462
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240063297
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES
- Publication number 20240063217
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING III-N MATERIAL-BASED VERTICAL COMPONENTS
- Publication number 20240047201
- Publication date Feb 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Guy FEUILLET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411467
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device Having a Second Semicond...
- Publication number 20230395394
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GAN CHIP AND GAN CHIP
- Publication number 20230395375
- Publication date Dec 7, 2023
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Fen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
- Publication number 20230395419
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
- Publication number 20230395418
- Publication date Dec 7, 2023
- EV GROUP E. THALLNER GMBH
- Boris Povazay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO
- Publication number 20230377972
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...
- Publication number 20230369285
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230361184
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Teng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PREPARING TWO-DIMENSIONAL BLACK PHOSPHORUS
- Publication number 20230357953
- Publication date Nov 9, 2023
- The Hong Kong Polytechnic University
- Jianhua HAO
- C30 - CRYSTAL GROWTH
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20230343782
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Seungmin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230335631
- Publication date Oct 19, 2023
- GUANGDONG ZHINENG TECHNOLOGIES, CO. LTD.
- Zilan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE WITH BACKSIDE POWER DISTRIBUTION NETWORK AND METHOD...
- Publication number 20230307364
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FABRICATING ELECTRONIC DEVICES USING SEPA...
- Publication number 20230170263
- Publication date Jun 1, 2023
- APPLIED NOVEL DEVICES, INC.
- LEO MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20230171959
- Publication date Jun 1, 2023
- SK HYNIX INC.
- Nam Kuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230163014
- Publication date May 25, 2023
- MITSUI CHEMICALS TOHCELLO, INC.
- Toru MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER
- Publication number 20230160104
- Publication date May 25, 2023
- DENSO CORPORATION
- Junji OHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS...
- Publication number 20230154755
- Publication date May 18, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François-Xavier Darras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING SAME
- Publication number 20230139758
- Publication date May 4, 2023
- GUANGDONG ZHINENG TECHNOLOGIES, CO. LTD.
- Zilan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...
- Publication number 20230130979
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
- Publication number 20230127556
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTINUOUS ARRAY LAYER
- Publication number 20230101190
- Publication date Mar 30, 2023
- Chen-Fu CHU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20230093945
- Publication date Mar 30, 2023
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS

involving the separation of the active layers from a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing semiconductor chip

Method for manufacturing a semiconductor substrate and device by bo...

Method for fabricating three-dimensional semiconductor device using...

Field effect transistor based on graphene nanoribbon and method for...

Transistor manufacturing method

Structures and methods of fabricating electronic devices using sepa...

Method for manufacturing nitride semiconductor substrate, nitride s...

Method for fabricating GaN chip and GaN chip

Semiconductor substrate, method for manufacturing semiconductor sub...

Semiconductor substrate and method of manufacturing the same

Methods for processing a wide band gap semiconductor wafer using a...

Methods for preparing a monolayer or few-layer crystalline black ph...

Method for transferring a useful layer onto a support substrate

Method for transferring a useful layer to a carrier substrate

Ion implantation with annealing for substrate cutting

Micro-transfer printing with selective component removal

Semiconductor substrate production systems and related methods

Geometrically shaped components in an assembly for a transfer print...

Laser conditioning of solid bodies using prior knowledge from previ...

Method for manufacturing semiconductor device and semiconductor sub...

Semiconductor on diamond substrate, precursor for use in preparing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Method of fabricating a semiconductor chip having strength adjustme...

Methods for forming a semiconductor device

Methods of re-using a silicon carbide substrate

Solid-state imaging device having optical black region, method of m...

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Method for thinning solid-body layers provided with components

Patents Applicationslast 30 patents

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUB...

SEMICONDUCTOR SUBSTRATE

VERTICAL TRANSPORT TRANSISTOR DEVICES WITH BACK SIDE INTERCONNECTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES

METHOD FOR PRODUCING III-N MATERIAL-BASED VERTICAL COMPONENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods for Forming a Semiconductor Device Having a Second Semicond...

METHOD FOR FABRICATING GAN CHIP AND GAN CHIP

METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

DIE SEPARATION RING FOR WAFERS HAVING A LARGE DIE ASPECT RATIO

METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

METHODS FOR PREPARING TWO-DIMENSIONAL BLACK PHOSPHORUS

INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STACKED DEVICE WITH BACKSIDE POWER DISTRIBUTION NETWORK AND METHOD...

STRUCTURES AND METHODS OF FABRICATING ELECTRONIC DEVICES USING SEPA...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER

REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS...

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A PLURALITY OF SE...

MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR CONTINUOUS ARRAY LAYER

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...