J-shaped leads

Industry

CPC
H05K7/1046

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/1046J-shaped leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,980,364
- Issue date May 22, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,888,558
- Issue date Feb 6, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,480,142
- Issue date Oct 25, 2016
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection base assembly for an IC testing apparatus
- Patent number 7,955,092
- Issue date Jun 7, 2011
- Yi-Chih Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for burn-in tests
- Patent number 7,775,821
- Issue date Aug 17, 2010
- Hon Hai Precision Ind. Co., Ltd.
- Hsiu-Yuan Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module connector
- Patent number 7,163,407
- Issue date Jan 16, 2007
- Mitsumi Electric Co., Ltd.
- Atsushi Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module connector
- Patent number 7,077,663
- Issue date Jul 18, 2006
- Mitsumi Electric Co., Ltd.
- Atsushi Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnecting device for a semiconductor assembly
- Patent number 6,449,165
- Issue date Sep 10, 2002
- Samsung Electronics Co., Ltd.
- Sang-Don Lee
- G01 - MEASURING TESTING
Information Patent Grant
Carrier socket for receiving a damaged IC
- Patent number 5,910,024
- Issue date Jun 8, 1999
- MCMS, Inc.
- Fred A. Goins
- G01 - MEASURING TESTING
Information Patent Grant
Method of providing electrical contact to component leads
- Patent number 5,874,323
- Issue date Feb 23, 1999
- MCMS, Inc.
- Fred A. Goins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment device for use with a socket connector
- Patent number 5,762,505
- Issue date Jun 9, 1998
- Hon Hai Precision Ind. Co., Ltd.
- Cheng-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect contact system
- Patent number 5,749,738
- Issue date May 12, 1998
- Johnstech International Corporation
- David A. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Method of assembling electronic component
- Patent number 5,647,121
- Issue date Jul 15, 1997
- Dallas Semiconductor Corporation
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect contact system
- Patent number 5,634,801
- Issue date Jun 3, 1997
- Johnstech International Corporation
- David A. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Chip carrier mounting system
- Patent number 5,588,847
- Issue date Dec 31, 1996
- John O. Tate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced low profile sockets and module systems
- Patent number 5,579,206
- Issue date Nov 26, 1996
- Dallas Semiconductor Corporation
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sockets and modules for surface mountable applications
- Patent number 5,528,463
- Issue date Jun 18, 1996
- Dallas Semiconductor Corp.
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect contact system
- Patent number 5,388,996
- Issue date Feb 14, 1995
- David A. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Top-loaded socket for integrated circuit device
- Patent number 5,328,383
- Issue date Jul 12, 1994
- Minnesota Mining and Manufacturing Company
- John A. Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for replacing electronic components on a print...
- Patent number 5,288,236
- Issue date Feb 22, 1994
- Sun Microsystems, Inc.
- James B. McIntyre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for electric part
- Patent number 5,261,832
- Issue date Nov 16, 1993
- Yamaichi Electric Co., Ltd.
- Kazumi Uratsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package connector
- Patent number 5,249,971
- Issue date Oct 5, 1993
- Foxconn International, Inc.
- Vincent Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier socket
- Patent number 5,240,429
- Issue date Aug 31, 1993
- Wells Electronics, Inc.
- Bruce B. Myers
- G01 - MEASURING TESTING
Information Patent Grant
IC socket and contact therein
- Patent number 5,226,824
- Issue date Jul 13, 1993
- Foxconn International, Inc.
- Robert Karlovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect contact system
- Patent number 5,207,584
- Issue date May 4, 1993
- David A. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Chip carrier socket
- Patent number 5,205,756
- Issue date Apr 27, 1993
- Wells Electronics, Inc.
- Bruce B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount electrical connector
- Patent number 5,203,710
- Issue date Apr 20, 1993
- KEL Corporation
- Shuichi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for electric part
- Patent number 5,147,212
- Issue date Sep 15, 1992
- Yamaichi Electric Co., Ltd.
- Kazumi Uratsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount leaded chip connector plug
- Patent number 5,135,402
- Issue date Aug 4, 1992
- Intel Corporation
- Michael F. Sweeney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical edge contact member and a method of manufacturing same
- Patent number 5,116,458
- Issue date May 26, 1992
- AMP Incorporated
- Dimitry G. Grabbe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230068748
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140268581
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140262451
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110299250
- Publication date Dec 8, 2011
- YAZAKI CORPORATION
- Akira HARAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BASE ASSEMBLY FOR AN IC TESTING APPARATUS
- Publication number 20100178782
- Publication date Jul 15, 2010
- Yi-Chih Yang
- G01 - MEASURING TESTING
Information Patent Application
SOCKET FOR BURN-IN TESTS
- Publication number 20100041254
- Publication date Feb 18, 2010
- HON HAI PRECISION INDUSTRY CO., LTD.
- HSIU-YUAN HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module connector
- Publication number 20060246751
- Publication date Nov 2, 2006
- Atsushi Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module connector
- Publication number 20040023528
- Publication date Feb 5, 2004
- Atsushi Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

J-shaped leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and manufacturing method thereof

Wiring substrate and manufacturing method thereof

Wiring substrate and manufacturing method thereof

Connection base assembly for an IC testing apparatus

Socket for burn-in tests

Module connector

Module connector

Electrical interconnecting device for a semiconductor assembly

Carrier socket for receiving a damaged IC

Method of providing electrical contact to component leads

Alignment device for use with a socket connector

Electrical interconnect contact system

Method of assembling electronic component

Electrical interconnect contact system

Chip carrier mounting system

Enhanced low profile sockets and module systems

Low profile sockets and modules for surface mountable applications

Electrical interconnect contact system

Top-loaded socket for integrated circuit device

Method and apparatus for replacing electronic components on a print...

Socket for electric part

IC package connector

Chip carrier socket

IC socket and contact therein

Electrical interconnect contact system

Chip carrier socket

Surface mount electrical connector

Socket for electric part

Surface mount leaded chip connector plug

Electrical edge contact member and a method of manufacturing same

Patents Applicationslast 30 patents

LEADED SEMICONDUCTOR DEVICE PACKAGE

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

CONNECTION BASE ASSEMBLY FOR AN IC TESTING APPARATUS

SOCKET FOR BURN-IN TESTS

Module connector

Module connector