Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure

Industry

CPC
B81C1/00238

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00238Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Digital microphone with over-voltage protection
- Patent number 11,897,762
- Issue date Feb 13, 2024
- Knowles Electronics, LLC
- Deepak Bharadwaj
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Root mean square sensor device
- Patent number 11,884,538
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Marco Corsi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for wafer bonding
- Patent number 11,851,325
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,542,154
- Issue date Jan 3, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked semiconductor structure and method of forming the same
- Patent number 11,498,832
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 11,342,298
- Issue date May 24, 2022
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure for MEMS device
- Patent number 11,312,623
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated packaging devices and methods with backside interconnect...
- Patent number 11,282,760
- Issue date Mar 22, 2022
- OBSIDIAN SENSORS, INC.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,263,424
- Issue date Mar 1, 2022
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integration with through-chip via process
- Patent number 11,235,969
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,174,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 11,167,982
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Root mean square sensor device
- Patent number 11,155,460
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Marco Corsi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 11,148,936
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
HF-VHF quartz MEMS resonator
- Patent number 11,101,786
- Issue date Aug 24, 2021
- HRL Laboratories, LLC
- Randall L. Kubena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via (TSV) formation in integrated circuits
- Patent number 11,097,942
- Issue date Aug 24, 2021
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...
- Publication number 20240142490
- Publication date May 2, 2024
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...
- Publication number 20230406697
- Publication date Dec 21, 2023
- ROBERT BOSCH GmbH
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20230166967
- Publication date Jun 1, 2023
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20230100960
- Publication date Mar 30, 2023
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Transferring a Layer to a Substrate
- Publication number 20220396067
- Publication date Dec 15, 2022
- IMEC vzw
- Boshen Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Semiconductor Structure and Method of Forming the Same
- Publication number 20220380208
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.,
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIGITAL MICROPHONE WITH OVER-VOLTAGE PROTECTION
- Publication number 20220348458
- Publication date Nov 3, 2022
- Knowles Electronics, LLC
- Deepak Bharadwaj
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20220298009
- Publication date Sep 22, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Arrangement and Method for Fabricating A Sensor Arrangement
- Publication number 20220260446
- Publication date Aug 18, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20220223554
- Publication date Jul 14, 2022
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER
- Publication number 20220177296
- Publication date Jun 9, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...
- Publication number 20220172506
- Publication date Jun 2, 2022
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...
- Publication number 20220162062
- Publication date May 26, 2022
- Meridian Innovation Pte Ltd
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20220017363
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOT MEAN SQUARE SENSOR DEVICE
- Publication number 20220009767
- Publication date Jan 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- MARCO CORSI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20210340008
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCER HAVING INDIVIDUAL CELLS WITH...
- Publication number 20210291228
- Publication date Sep 23, 2021
- Butterfly Network, Inc.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A WAFER CONNECTION
- Publication number 20210292160
- Publication date Sep 23, 2021
- ROBERT BOSCH GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOT MEAN SQUARE SENSOR DEVICE
- Publication number 20210163281
- Publication date Jun 3, 2021
- TEXAS INSTRUMENTS INCORPORATED
- MARCO CORSI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...
- Publication number 20210147222
- Publication date May 20, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...
- Publication number 20210107785
- Publication date Apr 15, 2021
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...
- Publication number 20210005568
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS device having a metallization structure embedded in a dielectr...

Sensor with dimple features and improved out-of-plane stiction

Digital microphone with over-voltage protection

Root mean square sensor device

Methods for wafer bonding

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Microfabricated ultrasonic transducers and related apparatus and me...

Bonding process for forming semiconductor device structure

Packaging method and associated packaging structure

MEMS packages and methods of manufacture thereof

Microfabricated ultrasonic transducer having individual cells with...

Sensor with dimple features and improved out-of-plane stiction

Stacked semiconductor structure and method of forming the same

Inter-poly connection for parasitic capacitor and die size improvement

Die stack arrangement comprising a die-attach-film tape and method...

Semiconductor structure for MEMS device

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Integrated packaging devices and methods with backside interconnect...

Fence structure to prevent stiction in a MEMS motion sensor

Integrated piezoelectric microelectromechanical ultrasound transduc...

CMOS-MEMS integration with through-chip via process

MEMS package with roughend interface

Bonding process for forming semiconductor device structure

Semiconductor arrangement and formation thereof

Root mean square sensor device

CMOS-MEMS structure and method of forming the same

Integrated package structure for MEMS element and ASIC chip and met...

HF-VHF quartz MEMS resonator

Through silicon via (TSV) formation in integrated circuits

Patents Applicationslast 30 patents

MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

MEMS Packages and Methods of Manufacture Thereof

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

Method for Transferring a Layer to a Substrate

Stacked Semiconductor Structure and Method of Forming the Same

DIGITAL MICROPHONE WITH OVER-VOLTAGE PROTECTION

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

Sensor Arrangement and Method for Fabricating A Sensor Arrangement

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...

HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

ROOT MEAN SQUARE SENSOR DEVICE

MEMS Packages and Methods of Manufacture Thereof

MICROFABRICATED ULTRASONIC TRANSDUCER HAVING INDIVIDUAL CELLS WITH...

METHOD FOR PRODUCING A WAFER CONNECTION

ROOT MEAN SQUARE SENSOR DEVICE

SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...

SELECTIVE SELF-ASSEMBLED MONOLAYER PATTERNING WITH SACRIFICIAL LAYE...

Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...