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H01L2224/48095

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48095Kinked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 12,115,023
- Issue date Oct 15, 2024
- Teratech Corporation
- Alice M. Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,901,329
- Issue date Feb 13, 2024
- Kaijo Corporation
- Mami Kushima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,783,879
- Issue date Oct 10, 2023
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of inspecting the same
- Patent number 11,715,701
- Issue date Aug 1, 2023
- Kioxia Corporation
- Yuusuke Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,692,677
- Issue date Jul 4, 2023
- Nichia Corporation
- Yuichiro Tanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,495,570
- Issue date Nov 8, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 11,421,829
- Issue date Aug 23, 2022
- Nichia Corporation
- Yuichiro Tanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 11,289,448
- Issue date Mar 29, 2022
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,276,666
- Issue date Mar 15, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,211,105
- Issue date Dec 28, 2021
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Light emitting device
- Patent number 11,187,385
- Issue date Nov 30, 2021
- Nichia Corporation
- Yuichiro Tanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing or eliminating nanopipe defects in III-nitride structures
- Patent number 11,152,539
- Issue date Oct 19, 2021
- Lumileds LLC
- Isaac Harshman Wildeson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,094,864
- Issue date Aug 17, 2021
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method of forming t...
- Patent number 11,056,474
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method of manufacturing the same
- Patent number 10,916,520
- Issue date Feb 9, 2021
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-access memory system and a method to manufacture the system
- Patent number 10,896,890
- Issue date Jan 19, 2021
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated gesture sensor module
- Patent number 10,884,551
- Issue date Jan 5, 2021
- Analog Devices, Inc.
- Dipak Sengupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,801,676
- Issue date Oct 13, 2020
- Nichia Corporation
- Yuichiro Tanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device, and electronic device
- Patent number 10,777,475
- Issue date Sep 15, 2020
- Renesas Electronics Corporation
- Kazuhiro Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 10,770,124
- Issue date Sep 8, 2020
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Compensation device for transistors
- Patent number 10,763,228
- Issue date Sep 1, 2020
- Infineon Technologies AG
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV epoxy resin instillation molding method and application thereof
- Patent number 10,711,089
- Issue date Jul 14, 2020
- CollTech (Dongguan) Bonding Technology Co., Ltd.
- Zongtao Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 10,714,526
- Issue date Jul 14, 2020
- Sony Corporation
- Yosuke Ogata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 10,667,790
- Issue date Jun 2, 2020
- Teratech Corporation
- Alice M. Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 10,672,735
- Issue date Jun 2, 2020
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER CHIP PACKAGING STRUCTURE
- Publication number 20240282727
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chung-Hsiao Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
- Publication number 20240014188
- Publication date Jan 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20230260960
- Publication date Aug 17, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230058480
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230014834
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220199567
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- JUNGSEOK RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20220172760
- Publication date Jun 2, 2022
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20210351155
- Publication date Nov 11, 2021
- KAIJO CORPORATION
- Mami KUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE
- Publication number 20210202439
- Publication date Jul 1, 2021
- Industrial Technology Research Institute
- CHIH-CHIANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
- Publication number 20210104486
- Publication date Apr 8, 2021
- Altera Corporation
- Hui LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20210050043
- Publication date Feb 18, 2021
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20200251444
- Publication date Aug 6, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Or Eliminating Nanopipe Defects In III-Nitride Structures
- Publication number 20200235263
- Publication date Jul 23, 2020
- Lumileds LLC
- Isaac Wildeson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20190305203
- Publication date Oct 3, 2019
- Nichia Corporation.
- Hiroaki UKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...
- Publication number 20190295983
- Publication date Sep 26, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20190259730
- Publication date Aug 22, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20190206458
- Publication date Jul 4, 2019
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20190198551
- Publication date Jun 27, 2019
- SONY CORPORATION
- Yosuke Ogata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20190109077
- Publication date Apr 11, 2019
- Mitsubishi Electric Corporation
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Device and Method of Forming t...
- Publication number 20190088635
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device comprising programmable command-and-address and/or da...

Tablet ultrasound system

Wire bonding method and wire bonding apparatus

Memory device comprising programmable command-and-address and/or da...

Semiconductor device and method of inspecting the same

Light emitting device

Systems and methods for optimizing looping parameters and looping t...

Light emitting device

Methods for generating wire loop profiles for wire loops, and metho...

Systems and methods for optimizing looping parameters and looping t...

Memory device comprising programmable command-and-address and/or da...

Light emitting device

Reducing or eliminating nanopipe defects in III-nitride structures

Light emitting device

Semiconductor package, semiconductor device and method of forming t...

Wafer-level chip-scale package including power semiconductor and ma...

Solid-state image pickup device and electronic apparatus to increas...

Semiconductor device, and method of manufacturing the same

Multi-access memory system and a method to manufacture the system

Integrated gesture sensor module

Semiconductor integrated circuit device

Light emitting device

Semiconductor chip, semiconductor device, and electronic device

Memory device comprising programmable command-and-address and/or da...

Compensation device for transistors

UV epoxy resin instillation molding method and application thereof

Solid-state imaging device, manufacturing method thereof, and elect...

Method of manufacturing multi-chip package

Tablet ultrasound system

Methods for generating wire loop profiles for wire loops, and metho...

Patents Applicationslast 30 patents

POWER CHIP PACKAGING STRUCTURE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

WIRE BONDING METHOD AND WIRE BONDING APPARATUS

HIGH POWER MODULE

MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Reducing Or Eliminating Nanopipe Defects In III-Nitride Structures

LIGHT EMITTING DEVICE

SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

SEMICONDUCTOR APPARATUS

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

Semiconductor Package, Semiconductor Device and Method of Forming t...