Lapping pads for working plane surfaces

Industry

CPC
B24B37/20

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/20Lapping pads for working plane surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing apparatus using a magnetically couple...
- Patent number 12,151,336
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Pin Ho
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing single-crystal diamond
- Patent number 12,151,337
- Issue date Nov 26, 2024
- Huaqiao University
- Jing Lu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-layered windows for use in chemical-mechanical planarization...
- Patent number 12,138,735
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, preparation method thereof and method for preparing...
- Patent number 12,138,738
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Jae In Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing head, method for manufacturing wafer polishing head...
- Patent number 12,134,162
- Issue date Nov 5, 2024
- SK SILTRON CO., LTD.
- Jae Chel Sung
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for manufacturing display device
- Patent number 12,090,601
- Issue date Sep 17, 2024
- Samsung Display Co., Ltd.
- Junggun Nam
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,076,831
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,030,159
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Kai Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Fixing device and detection system
- Patent number 12,005,545
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chao Li
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor substrate
- Patent number 11,999,027
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Multifunctional robotic device
- Patent number 11,997,957
- Issue date Jun 4, 2024
- Globe (Jiangsu) Co., Ltd.
- Jin Cao
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System for adjusting pad surface temperature and polishing apparatus
- Patent number 11,992,915
- Issue date May 28, 2024
- Ebara Corporation
- Shuji Uozumi
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus, chemical mechanical polish...
- Patent number 11,986,921
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Myung-Ki Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated abrasive polishing pads and manufacturing methods
- Patent number 11,980,992
- Issue date May 14, 2024
- Applied Materials, Inc.
- Ashavani Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Dressing apparatus and polishing apparatus
- Patent number 11,980,997
- Issue date May 14, 2024
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Takahiko Mitsui
- B24 - GRINDING POLISHING
Information Patent Grant
CMP system and method of use
- Patent number 11,984,323
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad comprising window similar in hardness to polishing layer
- Patent number 11,964,360
- Issue date Apr 23, 2024
- SK ENPULSE CO., LTD.
- Sunghoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioner, chemical mechanical polishing apparatus including the...
- Patent number 11,964,357
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Seungchul Han
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method of forming a polishing article that has a desi...
- Patent number 11,964,359
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Ashwin Chockalingham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP pad construction with composite material properties using addit...
- Patent number 11,958,162
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, method for producing the same and method of fabricat...
- Patent number 11,951,591
- Issue date Apr 9, 2024
- SK ENPULSE CO., LTD.
- Hye Young Heo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing member dressing method
- Patent number 11,945,075
- Issue date Apr 2, 2024
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Pad-temperature regulating apparatus, method of regulating pad-temp...
- Patent number 11,919,124
- Issue date Mar 5, 2024
- Ebara Corporation
- Toru Maruyama
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier wafers and methods of forming carrier wafers
- Patent number 11,919,125
- Issue date Mar 5, 2024
- Corning Incorporated
- Lance Changyong Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with contactless platen edge control
- Patent number 11,919,120
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- David J. Lischka
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus with contact extension or adjustable...
- Patent number 11,904,429
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 11,904,430
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,897,080
- Issue date Feb 13, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,883,922
- Issue date Jan 30, 2024
- Ebara Corporation
- Yuki Watanabe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING HEAD AND SEGMENTATION TYPE HEAD MODULE OF A CHEMICAL MECH...
- Publication number 20240399532
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Choi
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...
- Publication number 20240383095
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...
- Publication number 20240383094
- Publication date Nov 21, 2024
- IV Technologies CO., Ltd.
- Ko-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Application
Perpendicularly Magnetized Ferromagnetic Layers Having an Oxide Int...
- Publication number 20240379270
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Luc Thomas
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240367285
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Masayuki SATAKE
- B24 - GRINDING POLISHING
Information Patent Application
COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING
- Publication number 20240316598
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Clinton P. SAKATA
- B08 - CLEANING
Information Patent Application
POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240300066
- Publication date Sep 12, 2024
- SK enpulse Co., Ltd.
- Chang Gyu IM
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20240278381
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20240278378
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Yoichi SHIOKAWA
- B24 - GRINDING POLISHING
Information Patent Application
CONDITIONING APPARATUS
- Publication number 20240269798
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Hyuntae Lee
- B24 - GRINDING POLISHING
Information Patent Application
CMP System and Method of Use
- Publication number 20240274440
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chien Hou
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT WINDOW
- Publication number 20240253175
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT DETECTION WINDOW
- Publication number 20240253177
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT WINDOW
- Publication number 20240253176
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD
- Publication number 20240189959
- Publication date Jun 13, 2024
- EBARA CORPORATION
- Keisuke NAMIKI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
- Publication number 20240157502
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- B24 - GRINDING POLISHING
Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240100647
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APP...
- Publication number 20240082982
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Toshiki MIYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, AND POLISHING TREATMENT DEVICE
- Publication number 20240082983
- Publication date Mar 14, 2024
- MICRO ENGINEERING, INC.
- Akio KOMURA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY ARM AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING TH...
- Publication number 20240075581
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- B24 - GRINDING POLISHING
Information Patent Application
MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...
- Publication number 20240075582
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
MULTIPLE DISK PAD CONDITIONER
- Publication number 20240051081
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Jay GURUSAMY
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR SUSCEPTOR DEPOSITION MATERIAL REMOVAL
- Publication number 20240033877
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Vijayabhaskara Venkatagiriyappa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY
- Publication number 20240025009
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Aniruddh Jagdish KHANNA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING
- Publication number 20240009801
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen Yen Kung
- B24 - GRINDING POLISHING
Information Patent Application
Endpoint detection window, chemical mechanical polishing pad with w...
- Publication number 20240009797
- Publication date Jan 11, 2024
- InvenTech Materials Co., Ltd.
- Hongqi XIANG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20230381918
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi HUANG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS USING A MAGNETICALLY COUPLE...
- Publication number 20230364731
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Pin HO
- B24 - GRINDING POLISHING
Information Patent Application
Novel CMP Pad Design and Method of Using the Same
- Publication number 20230364734
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Chuan Su
- B24 - GRINDING POLISHING

Lapping pads for working plane surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical mechanical polishing apparatus using a magnetically couple...

Method for polishing single-crystal diamond

Multi-layered windows for use in chemical-mechanical planarization...

Polishing pad, preparation method thereof and method for preparing...

Wafer polishing head, method for manufacturing wafer polishing head...

Apparatus and method for manufacturing display device

Chemical mechanical polishing apparatus and method

Substrate processing apparatus, substrate processing system, and su...

Chemical mechanical planarization tool

Fixing device and detection system

Method for polishing semiconductor substrate

Multifunctional robotic device

System for adjusting pad surface temperature and polishing apparatus

Chemical mechanical polishing apparatus, chemical mechanical polish...

Integrated abrasive polishing pads and manufacturing methods

Dressing apparatus and polishing apparatus

CMP system and method of use

Polishing pad comprising window similar in hardness to polishing layer

Conditioner, chemical mechanical polishing apparatus including the...

Apparatus and method of forming a polishing article that has a desi...

CMP pad construction with composite material properties using addit...

Polishing pad, method for producing the same and method of fabricat...

Polishing apparatus and polishing member dressing method

Pad-temperature regulating apparatus, method of regulating pad-temp...

Carrier wafers and methods of forming carrier wafers

Polishing system with contactless platen edge control

Substrate polishing apparatus with contact extension or adjustable...

Temperature control in chemical mechanical polish

Polishing apparatus

Substrate processing apparatus

Patents Applicationslast 30 patents

POLISHING HEAD AND SEGMENTATION TYPE HEAD MODULE OF A CHEMICAL MECH...

MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...

POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...

Perpendicularly Magnetized Ferromagnetic Layers Having an Oxide Int...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING

POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE

POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...

POLISHING APPARATUS

CONDITIONING APPARATUS

CMP System and Method of Use

POLISHING PAD WITH ENDPOINT WINDOW

POLISHING PAD WITH ENDPOINT DETECTION WINDOW

POLISHING PAD WITH ENDPOINT WINDOW

POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS

Temperature Control in Chemical Mechanical Polish

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APP...

POLISHING HEAD, AND POLISHING TREATMENT DEVICE

SLURRY ARM AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING TH...

MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...

MULTIPLE DISK PAD CONDITIONER

APPARATUS AND METHODS FOR SUSCEPTOR DEPOSITION MATERIAL REMOVAL

POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING

Endpoint detection window, chemical mechanical polishing pad with w...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS USING A MAGNETICALLY COUPLE...

Novel CMP Pad Design and Method of Using the Same