larger or equal to 100 microns less than 200 microns

Industry

CPC
H01L2924/20641

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20641larger or equal to 100 microns less than 200 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,380,609
- Issue date Jul 5, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip testing through micro-C4 interface
- Patent number 11,193,953
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Victor A. Garibay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure for improving die warpage and manuf...
- Patent number 11,031,356
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high thermal conductivity die attach
- Patent number 10,957,635
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 10,937,760
- Issue date Mar 2, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor
- Patent number 10,865,329
- Issue date Dec 15, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Protective film for semiconductors, semiconductor device, and compo...
- Patent number 10,825,790
- Issue date Nov 3, 2020
- Lintec Corporation
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 10,797,012
- Issue date Oct 6, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor, adhesive film for semicondu...
- Patent number 10,759,971
- Issue date Sep 1, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,755,992
- Issue date Aug 25, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,658,259
- Issue date May 19, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device that includes a copper layer disposed on...
- Patent number 10,643,967
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Hiroaki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic product
- Patent number 10,636,755
- Issue date Apr 28, 2020
- Hannstar Display Corporation
- Hsuan-Chen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,622,271
- Issue date Apr 14, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, ultrasound probe, ultrasonic diagnostic system and method
- Patent number 10,586,753
- Issue date Mar 10, 2020
- Koninklijke Philips N.V.
- Egbertus Reinier Jacobs
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,586,747
- Issue date Mar 10, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,573,571
- Issue date Feb 25, 2020
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor logic device and system and method of embedded packag...
- Patent number 10,566,301
- Issue date Feb 18, 2020
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed assemblies of ultrathin, microscale inorganic light emittin...
- Patent number 10,546,841
- Issue date Jan 28, 2020
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20220278038
- Publication date Sep 1, 2022
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
- Publication date Nov 25, 2021
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUF...
- Publication number 20210296263
- Publication date Sep 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20200395325
- Publication date Dec 17, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH
- Publication number 20200303285
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...
- Publication number 20200144145
- Publication date May 7, 2020
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20200105714
- Publication date Apr 2, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
- Publication number 20190355654
- Publication date Nov 21, 2019
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190172812
- Publication date Jun 6, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ISOLATION STRUCTURE
- Publication number 20190157222
- Publication date May 23, 2019
- NXP USA, Inc.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...
- Publication number 20190157227
- Publication date May 23, 2019
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20190067229
- Publication date Feb 28, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...
- Publication number 20190057880
- Publication date Feb 21, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE HAVING REDISTRIBUTION STRUCTURE
- Publication number 20190043819
- Publication date Feb 7, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013255
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Method of Forming the Same
- Publication number 20180330969
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180254254
- Publication date Sep 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- XINGTAO XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUF...
- Publication number 20180204809
- Publication date Jul 19, 2018
- Amkor Technology, Inc.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER
- Publication number 20180182682
- Publication date Jun 28, 2018
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20180084649
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20180047708
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...
- Publication number 20170358510
- Publication date Dec 14, 2017
- Magnachip Semiconductor, Ltd.
- Myung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP TESTING THROUGH MICRO-C4 INTERFACE
- Publication number 20170336440
- Publication date Nov 23, 2017
- International Business Machines Corporation
- Victor A. Garibay
- G01 - MEASURING TESTING

larger or equal to 100 microns less than 200 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Structure and method for semiconductor packaging

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Microelectronic assemblies having conductive structures with differ...

Method of making a pillar structure having a non-metal sidewall pro...

3D chip testing through micro-C4 interface

Semiconductor packaging structure and method

Semiconductor package structure for improving die warpage and manuf...

Wafer-level chip-scale package including power semiconductor and ma...

Multi-chip package with high thermal conductivity die attach

Method for manufacturing a chip package

Selective area heating for 3D chip stack

Adhesive film for semiconductor

Protective film for semiconductors, semiconductor device, and compo...

Protrusion bump pads for bond-on-trace processing

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Adhesive composition for semiconductor, adhesive film for semicondu...

Wafer-level packaging for enhanced performance

Integrated circuit device with plating on lead interconnection poin...

Wafer-level packaging for enhanced performance

Power semiconductor device that includes a copper layer disposed on...

Electronic product

Packaging devices and methods of manufacture thereof

Wafer-level packaging for enhanced performance

IC die, ultrasound probe, ultrasonic diagnostic system and method

Wafer-level packaging for enhanced performance

Wafer-level chip-scale package including power semiconductor and ma...

Semiconductor logic device and system and method of embedded packag...

Printed assemblies of ultrathin, microscale inorganic light emittin...

Chip package and a wafer level package

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

RELIABLE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUF...

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH

WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...

METHOD FOR MANUFACTURING A CHIP PACKAGE

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

PACKAGE WITH ISOLATION STRUCTURE

SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...

ELECTRONIC PACKAGE HAVING REDISTRIBUTION STRUCTURE

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

Integrated Circuit Device with Plating on Lead Interconnection Poin...

Package Structures and Method of Forming the Same

COPPER PILLAR BUMP STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUF...

SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Semiconductor Packaging Structure and Method

WAFER-LEVEL CHIP-SCALE PACKAGE INCLUDING POWER SEMICONDUCTOR AND MA...

3D CHIP TESTING THROUGH MICRO-C4 INTERFACE