larger or equal to 200 microns less than 300 microns

Industry

CPC
H01L2924/20642

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20642larger or equal to 200 microns less than 300 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high thermal conductivity die attach
- Patent number 10,957,635
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 10,937,760
- Issue date Mar 2, 2021
- COMCHIP TECHNOLOGY CO., LTD.
- Chien-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor
- Patent number 10,865,329
- Issue date Dec 15, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Protective film for semiconductors, semiconductor device, and compo...
- Patent number 10,825,790
- Issue date Nov 3, 2020
- Lintec Corporation
- Naoya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor, adhesive film for semicondu...
- Patent number 10,759,971
- Issue date Sep 1, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,755,992
- Issue date Aug 25, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,658,259
- Issue date May 19, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,622,271
- Issue date Apr 14, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,586,747
- Issue date Mar 10, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-bonding methods and articles for semiconductor and interpos...
- Patent number 10,510,576
- Issue date Dec 17, 2019
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,490,471
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,453,765
- Issue date Oct 22, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with notched main lead
- Patent number 10,431,532
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Kota Ise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,418,297
- Issue date Sep 17, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,262,970
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,062,639
- Issue date Aug 28, 2018
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an improved fine pitch joint
- Patent number 10,062,659
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step processes for high temperature bonding and bonded substr...
- Patent number 10,043,731
- Issue date Aug 7, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 10,020,286
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method for wafer-level packaging
- Patent number 10,008,478
- Issue date Jun 26, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Wanchun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,953,966
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with optimized thermal characteristics
- Patent number 9,929,115
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)
- Publication number 20210028084
- Publication date Jan 28, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH
- Publication number 20200303285
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20200105714
- Publication date Apr 2, 2020
- Comchip Technology Co.,Ltd.
- Chien-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013255
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20180084649
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20180047708
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170229410
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- Hao-Cheng HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD FOR WAFER-LEVEL PACKAGING
- Publication number 20170213810
- Publication date Jul 27, 2017
- Wanchun DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Step Processes For High Temperature Bonding And Bonded Substr...
- Publication number 20170062304
- Publication date Mar 2, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20160343692
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Sheet for Resin Film Formation
- Publication number 20160218077
- Publication date Jul 28, 2016
- LINTEC CORPORATION
- Yuichiro Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...
- Publication number 20160172273
- Publication date Jun 16, 2016
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Fine Pitch Joint
- Publication number 20160148889
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160133593
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20160133618
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Mounting
- Publication number 20160086907
- Publication date Mar 24, 2016
- QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Simon Jonathan Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...
- Publication number 20160071814
- Publication date Mar 10, 2016
- INFINEON TECHNOLOGIES AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20160064355
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20160035709
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE STACK FOR A STACKED DEVICE
- Publication number 20150371938
- Publication date Dec 24, 2015
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM AND DISPLAY APPARATUS
- Publication number 20150348896
- Publication date Dec 3, 2015
- BOE TECHNOLOGY GROUP CO., LTD.
- Shou LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150325504
- Publication date Nov 12, 2015
- ROHM CO., LTD.
- Kota ISE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20150325546
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20150235986
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150235925
- Publication date Aug 20, 2015
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS

larger or equal to 200 microns less than 300 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method for semiconductor packaging

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor packaging structure and method

Multi-chip package with high thermal conductivity die attach

Method for manufacturing a chip package

Selective area heating for 3D chip stack

Adhesive film for semiconductor

Protective film for semiconductors, semiconductor device, and compo...

Adhesive composition for semiconductor, adhesive film for semicondu...

Wafer-level packaging for enhanced performance

Integrated circuit device with plating on lead interconnection poin...

Wafer-level packaging for enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level packaging for enhanced performance

Chip package and a wafer level package

Carrier-bonding methods and articles for semiconductor and interpos...

Wafer-level packaging for enhanced performance

Wafer-level packaging for enhanced performance

Semiconductor device with notched main lead

Wafer-level packaging for enhanced performance

Selective area heating for 3D chip stack

Semiconductor modules with semiconductor dies bonded to a metal foil

Integrated circuit device with plating on lead interconnection poin...

System and method for an improved fine pitch joint

Multi-step processes for high temperature bonding and bonded substr...

Package on package devices and methods of packaging semiconductor dies

Fabricating method for wafer-level packaging

Semiconductor device and method of forming the same

Device with optimized thermal characteristics

Chip package and a wafer level package

Patents Applicationslast 30 patents

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)

MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH

METHOD FOR MANUFACTURING A CHIP PACKAGE

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

Integrated Circuit Device with Plating on Lead Interconnection Poin...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Semiconductor Packaging Structure and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FABRICATING METHOD FOR WAFER-LEVEL PACKAGING

Multi-Step Processes For High Temperature Bonding And Bonded Substr...

Semiconductor Packaging Structure and Method

Composite Sheet for Resin Film Formation

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...

System and Method for an Improved Fine Pitch Joint

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Chip Mounting

PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...

CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF

Package on Package Devices and Methods of Packaging Semiconductor Dies

BACK-END-OF-LINE STACK FOR A STACKED DEVICE

CHIP ON FILM AND DISPLAY APPARATUS

SEMICONDUCTOR DEVICE

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

SELECTIVE AREA HEATING FOR 3D CHIP STACK

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD