larger or equal to 500 microns less than 600 microns

Industry

CPC
H01L2924/20645

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20645larger or equal to 500 microns less than 600 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with conductive line crack prevention design
- Patent number 11,854,956
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip structure and methods of manufacture
- Patent number 10,340,241
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,262,970
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for environmental parameter sensors and method for manufact...
- Patent number 10,192,842
- Issue date Jan 29, 2019
- AMS International AG
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,062,639
- Issue date Aug 28, 2018
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 10,020,286
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with optimized thermal characteristics
- Patent number 9,929,115
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,911,705
- Issue date Mar 6, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,860,996
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting
- Patent number 9,659,894
- Issue date May 23, 2017
- Qualcomm Technologies International, Ltd.
- Simon Jonathan Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,653,390
- Issue date May 16, 2017
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly bonding
- Patent number 9,488,853
- Issue date Nov 8, 2016
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-chip module with stacked face-down connected dies
- Patent number 9,484,333
- Issue date Nov 1, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,449,944
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,431,366
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having extended depression for electrical connection a...
- Patent number 9,406,578
- Issue date Aug 2, 2016
- Xintec Inc.
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced wafer level fan-out POP package
- Patent number 9,318,474
- Issue date Apr 19, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D bond and assembly process for severely bowed interposer die
- Patent number 9,224,712
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Marcus E. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20240096778
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20180084649
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170229410
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- Hao-Cheng HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20160365328
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...
- Publication number 20160172273
- Publication date Jun 16, 2016
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160133593
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Mounting
- Publication number 20160086907
- Publication date Mar 24, 2016
- QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Simon Jonathan Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20160064355
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20160035709
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE STACK FOR A STACKED DEVICE
- Publication number 20150371938
- Publication date Dec 24, 2015
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150255358
- Publication date Sep 10, 2015
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20150235986
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150235925
- Publication date Aug 20, 2015
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES
- Publication number 20150236002
- Publication date Aug 20, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
- Publication number 20150228614
- Publication date Aug 13, 2015
- International Business Machines Corporation
- MARCUS E INTERRANTE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150228619
- Publication date Aug 13, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20150221582
- Publication date Aug 6, 2015
- Kabushiki Kaisha Toshiba
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ASSEMBLY BONDING
- Publication number 20150212340
- Publication date Jul 30, 2015
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
Thermally Enhanced Wafer Level Fan-Out POP Package
- Publication number 20150171063
- Publication date Jun 18, 2015
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD
- Publication number 20150171042
- Publication date Jun 18, 2015
- NXP B.V.
- Hendrik Bouman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
- Publication number 20150171052
- Publication date Jun 18, 2015
- CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
- Yang-Kuao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150108663
- Publication date Apr 23, 2015
- Min Gi HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20140256090
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140085599
- Publication date Mar 27, 2014
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140084489
- Publication date Mar 27, 2014
- James Etzkorn
- G02 - OPTICS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20140021605
- Publication date Jan 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

larger or equal to 500 microns less than 600 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die package with conductive line crack prevention design

Selective area heating for 3D chip stack

Method of manufacturing chip-on-chip structure comprising sinterted...

Integrated circuit device with plating on lead interconnection poin...

Chip package and a wafer level package

Chip-on-chip structure and methods of manufacture

Selective area heating for 3D chip stack

Package for environmental parameter sensors and method for manufact...

Integrated circuit device with plating on lead interconnection poin...

Package on package devices and methods of packaging semiconductor dies

Device with optimized thermal characteristics

Chip package and a wafer level package

Semiconductor device and semiconductor device manufacturing method

Selective area heating for 3D chip stack

Chip mounting

Semiconductor device and semiconductor device manufacturing method

Assembly bonding

Multi-chip module with stacked face-down connected dies

Electronic component package and method for manufacturing same

Selective area heating for 3D chip stack

Chip package having extended depression for electrical connection a...

Thermally enhanced wafer level fan-out POP package

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

3D bond and assembly process for severely bowed interposer die

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

Integrated Circuit Device with Plating on Lead Interconnection Poin...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

Chip Mounting

CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF

Package on Package Devices and Methods of Packaging Semiconductor Dies

BACK-END-OF-LINE STACK FOR A STACKED DEVICE

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SELECTIVE AREA HEATING FOR 3D CHIP STACK

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES

3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME

CONNECTOR FRAME AND SEMICONDUCTOR DEVICE

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

ASSEMBLY BONDING

Thermally Enhanced Wafer Level Fan-Out POP Package

SENSOR PACKAGE AND MANUFACTURING METHOD

SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SELECTIVE AREA HEATING FOR 3D CHIP STACK

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

Package on Package Devices and Methods of Packaging Semiconductor Dies