Layer and TAB connectors

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H01L2224/73219

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73219Layer and TAB connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing mounting structure for electronic componen...
- Patent number 11,881,470
- Issue date Jan 23, 2024
- Japan Aviation Electronics Industry, Limited
- Ryosuke Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounting portion on which a sepa...
- Patent number 9,478,483
- Issue date Oct 25, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multiple die face-down stacking for two or more die
- Patent number 9,437,579
- Issue date Sep 6, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,129,979
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die face-down stacking for two or more die
- Patent number 9,013,033
- Issue date Apr 21, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface electrodes
- Patent number 8,963,315
- Issue date Feb 24, 2015
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor switches and method for manufacturing
- Patent number 8,946,767
- Issue date Feb 3, 2015
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-leadframe multi-chip package
- Patent number 8,933,549
- Issue date Jan 13, 2015
- Alpha & Omega Semiconductor, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of mixed semiconductor encapsulation structure with multi...
- Patent number 8,933,550
- Issue date Jan 13, 2015
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-leadframe multi-chip package and method of manufacture
- Patent number 8,709,867
- Issue date Apr 29, 2014
- Alpha and Omega Semiconductor Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive clip for semiconductor device package
- Patent number 8,680,658
- Issue date Mar 25, 2014
- Alpha and Omega Semiconductor Incorporated
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and metal foils
- Patent number 8,680,668
- Issue date Mar 25, 2014
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device on leadframe
- Patent number 8,642,394
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,629,467
- Issue date Jan 14, 2014
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning structures and method for integrated chips
- Patent number 8,592,963
- Issue date Nov 26, 2013
- Intersil Americas Inc.
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,581,378
- Issue date Nov 12, 2013
- Panasonic Corporation
- Toshiyuki Yokoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material
- Patent number 8,513,534
- Issue date Aug 20, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic device and method for connecting a die to a connection t...
- Patent number 8,513,811
- Issue date Aug 20, 2013
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly
- Patent number 8,472,949
- Issue date Jun 25, 2013
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with multiple semiconductor chips
- Patent number 8,410,591
- Issue date Apr 2, 2013
- Infineon Technologies AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device attached to island having protrusion
- Patent number 8,399,970
- Issue date Mar 19, 2013
- ON Semiconductor Trading, Ltd.
- Hiroyoshi Urushihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal packaging of a semiconductor device mounted on die pads
- Patent number 8,395,364
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Yukihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,467
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,378,468
- Issue date Feb 19, 2013
- Panasonic Corporation
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four MOSFET full bridge module
- Patent number 8,367,481
- Issue date Feb 5, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for the production thereof
- Patent number 8,330,252
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,299,600
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Yukihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...
- Publication number 20210193612
- Publication date Jun 24, 2021
- Japan Aviation Electronics Industry, Limited
- Ryosuke MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package
- Publication number 20140103512
- Publication date Apr 17, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130147064
- Publication date Jun 13, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MONOLITHIC SEMICONDUCTOR SWITCHES AND METHOD FOR MANUFACTURING
- Publication number 20130140673
- Publication date Jun 6, 2013
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
- Publication number 20130127062
- Publication date May 23, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS
- Publication number 20130069211
- Publication date Mar 21, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009300
- Publication date Jan 10, 2013
- Renesas Electronics Corporation
- Yuichi Yato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUR MOSFET FULL BRIDGE MODULE
- Publication number 20130005083
- Publication date Jan 3, 2013
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120267682
- Publication date Oct 25, 2012
- Renesas Electronics Corporation
- TAKAMITSU KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120261825
- Publication date Oct 18, 2012
- Nobuya KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
- Publication number 20120264257
- Publication date Oct 18, 2012
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20120199989
- Publication date Aug 9, 2012
- ABB TECHNOLOGY AG
- Nicola Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of Mixed Semiconductor Encapsulation Structure with Multi...
- Publication number 20120193695
- Publication date Aug 2, 2012
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package and Method of Manufacture
- Publication number 20120161304
- Publication date Jun 28, 2012
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUR MOSFET FULL BRIDGE MODULE
- Publication number 20120149149
- Publication date Jun 14, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligning Structures and Method for Integrated Chips
- Publication number 20120032317
- Publication date Feb 9, 2012
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120034742
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120001342
- Publication date Jan 5, 2012
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110316135
- Publication date Dec 29, 2011
- ON SEMICONDUCTOR TRADING, LTD.
- Hiroyoshi URUSHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONNECTING A DIE TO A CONNECTION T...
- Publication number 20110291286
- Publication date Dec 1, 2011
- STMicroelectronics S.r.I.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEMICONDUCTOR SWITCHES AND METHOD FOR MANUFACTURING
- Publication number 20110241170
- Publication date Oct 6, 2011
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package and Method of Manufacture
- Publication number 20110233746
- Publication date Sep 29, 2011
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110237031
- Publication date Sep 29, 2011
- Renesas Electronics Corporation
- Yuichi YATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency Power Supply Module Having High Efficiency and High...
- Publication number 20110210708
- Publication date Sep 1, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Juan A. HERBSOMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186981
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163432
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163431
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110163392
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Chie Fujioka
- H01 - BASIC ELECTRIC ELEMENTS

Layer and TAB connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing mounting structure for electronic componen...

Chip-on film and display device including the same

Discrete flexible interconnects for modules of integrated circuits

Semiconductor arrangement, semiconductor system and method of formi...

Semiconductor device having a chip mounting portion on which a sepa...

Multiple die face-down stacking for two or more die

Semiconductor device

Multiple die face-down stacking for two or more die

Semiconductor device with surface electrodes

Monolithic semiconductor switches and method for manufacturing

Dual-leadframe multi-chip package

Structure of mixed semiconductor encapsulation structure with multi...

Dual-leadframe multi-chip package and method of manufacture

Conductive clip for semiconductor device package

Device including a semiconductor chip and metal foils

Method of manufacturing electronic device on leadframe

Semiconductor device

Self-aligning structures and method for integrated chips

Semiconductor device and method of manufacturing the same

Semiconductor device and bonding material

Electronic device and method for connecting a die to a connection t...

Semiconductor assembly

Semiconductor module with multiple semiconductor chips

Semiconductor device attached to island having protrusion

Internal packaging of a semiconductor device mounted on die pads

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Four MOSFET full bridge module

Integrated circuit device and method for the production thereof

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...

CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

Dual-leadframe Multi-chip Package

Semiconductor Device

SEMICONDUCTOR DEVICE

MONOLITHIC SEMICONDUCTOR SWITCHES AND METHOD FOR MANUFACTURING

MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

FOUR MOSFET FULL BRIDGE MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF

Structure of Mixed Semiconductor Encapsulation Structure with Multi...

Dual-leadframe Multi-chip Package and Method of Manufacture

FOUR MOSFET FULL BRIDGE MODULE

Self-Aligning Structures and Method for Integrated Chips

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD FOR CONNECTING A DIE TO A CONNECTION T...

MONOLITHIC SEMICONDUCTOR SWITCHES AND METHOD FOR MANUFACTURING

Dual-leadframe Multi-chip Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

High Frequency Power Supply Module Having High Efficiency and High...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME