Layer and wire connectors

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H01L2224/73215

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73215Layer and wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire, semiconductor package including the same, and wire bo...
- Patent number 12,243,846
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Keun-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 12,205,940
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with recessed molding region disposed below h...
- Patent number 12,191,290
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- In-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,108,517
- Issue date Oct 1, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,009,342
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centralized placement of command and address swapping in memory dev...
- Patent number 11,961,585
- Issue date Apr 16, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,608
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A BONDING WIRE
- Publication number 20250105201
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Younghun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE
- Publication number 20250096050
- Publication date Mar 20, 2025
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087636
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Inhee YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079370
- Publication date Mar 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Shuichi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250070039
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038061
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015005
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- KEUNYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS
- Publication number 20240420747
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- KAZUHIRO YOSHIDA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240404981
- Publication date Dec 5, 2024
- DENSO CORPORATION
- Hiroki YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240371720
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- OhYoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICES AND MEMORY SYSTEMS
- Publication number 20240363588
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240347648
- Publication date Oct 17, 2024
- JCET Group Co. Ltd.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS

Layer and wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire, semiconductor package including the same, and wire bo...

Display substrate, tiled display panel and display device

Integrated circuit package having wirebonded multi-die stack

Method for manufacturing semiconductor device and semiconductor device

Fault tolerant memory systems and components with interconnected an...

Reliable semiconductor packages

Semiconductor package structure and packaging method thereof

Semiconductor packages

Semiconductor package with recessed molding region disposed below h...

Integrated voltage regulator (IVR) package including inductor and c...

3D chip package based on vertical-through-via connector

Semiconductor package

Fluidic flow channel over active surface of a die

System and method for integration of biological chips

Semiconductor device and method for manufacturing same

Sensor lens assembly having non-soldering configuration

Command and address interface regions, and associated devices and s...

Film in substrate for releasing z stack-up constraint

Semiconductor packages

Sensor package and manufacturing method thereof

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Centralized placement of command and address swapping in memory dev...

Semiconductor package including stacked chip structure

Semiconductor package including a dummy pad

Die over mold stacked semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device having laterally offset stacked semiconductor...

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A BONDING WIRE

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

Three-dimensional Stack Package Structure And Method Making The Same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH A REINFORCING LAYER

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

CHIP PACKAGE DEVICES AND MEMORY SYSTEMS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

PACKAGE STRUCTURE AND PACKAGING METHOD

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...