Layer and wire connectors

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CPC
H01L2224/73215

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73215Layer and wire connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,125,813
- Issue date Oct 22, 2024
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,108,517
- Issue date Oct 1, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,009,342
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centralized placement of command and address swapping in memory dev...
- Patent number 11,961,585
- Issue date Apr 16, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die over mold stacked semiconductor package
- Patent number 11,948,917
- Issue date Apr 2, 2024
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,608
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, and semiconductor package including the package...
- Patent number 11,823,995
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Keunho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 11,798,854
- Issue date Oct 24, 2023
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages
- Patent number 11,791,314
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,749,731
- Issue date Sep 5, 2023
- Denso Corporation
- Susumu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 11,721,686
- Issue date Aug 8, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS
- Publication number 20240420747
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- KAZUHIRO YOSHIDA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240404981
- Publication date Dec 5, 2024
- DENSO CORPORATION
- Hiroki YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240371720
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- OhYoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICES AND MEMORY SYSTEMS
- Publication number 20240363588
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240347648
- Publication date Oct 17, 2024
- JCET Group Co. Ltd.
- Xianfang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Upside-Down DRAM Package Structure
- Publication number 20240315054
- Publication date Sep 19, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240300807
- Publication date Sep 12, 2024
- ROBERT BOSCH GmbH
- Jan Stiedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304564
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240258267
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250066
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243096
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240213165
- Publication date Jun 27, 2024
- PowerX Semiconductor Corporation
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213123
- Publication date Jun 27, 2024
- DENSO CORPORATION
- SACHIO KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE
- Publication number 20240213179
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaewoo Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Layer and wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D chip package based on vertical-through-via connector

Semiconductor package

Fluidic flow channel over active surface of a die

System and method for integration of biological chips

Semiconductor device and method for manufacturing same

Sensor lens assembly having non-soldering configuration

Command and address interface regions, and associated devices and s...

Film in substrate for releasing z stack-up constraint

Semiconductor packages

Sensor package and manufacturing method thereof

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Centralized placement of command and address swapping in memory dev...

Semiconductor package including stacked chip structure

Semiconductor package including a dummy pad

Die over mold stacked semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device having laterally offset stacked semiconductor...

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package

Bonded semiconductor devices having processor and NAND flash memory...

Protective elements for bonded structures

Semiconductor device and manufacturing method thereof

Package-on-package assembly with wire bonds to encapsulation surface

Package substrate, and semiconductor package including the package...

Fluidic flow channel over active surface of a die

Semiconductor packages

Stacking structure, package structure and method of fabricating the...

Semiconductor device

Semiconductor package structure and packaging method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH A REINFORCING LAYER

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

CHIP PACKAGE DEVICES AND MEMORY SYSTEMS

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

PACKAGE STRUCTURE AND PACKAGING METHOD

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

Upside-Down DRAM Package Structure

MICROMECHANICAL COMPONENT

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

POWER MODULE

POWER MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING REINFORCING STRUCTURE