Layer connector integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

CPC
H01L2224/29008

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29008Layer connector integrally formed with a redistribution layer on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 11,640,951
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...
- Publication number 20240153859
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20230223374
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230088170
- Publication date Mar 23, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20230025412
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20210066231
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out WLP with package
- Publication number 20160254247
- Publication date Sep 1, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160240450
- Publication date Aug 18, 2016
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

Layer connector integrally formed with a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit device having redistribution pattern

Semiconductor structure having a dielectric layer edge covering cir...

Semiconductor device

Electronic component mounting structure

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

Fan-out WLP with package

SEMICONDUCTOR DEVICE

CHIP AND CHIP ARRANGEMENT

FAN-OUT WLP WITH PACKAGE

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Semiconductor device, circuit board, electro-optic device, electron...