Layer connectors having different shapes

Industry

CPC
H01L2224/33051

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33051Layer connectors having different shapes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,705,423
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,387,209
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing 3DIC structure
- Patent number 10,797,015
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC structure and method of manufacturing the same
- Patent number 10,475,762
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,354,939
- Issue date Jul 16, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board element and method for producing a printed ci...
- Patent number 10,121,737
- Issue date Nov 6, 2018
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,773,527
- Issue date Sep 26, 2017
- TOSHIBA MEMORY CORPORATION
- Itaru Yamaguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voidlessly encapsulated semiconductor die package
- Patent number 9,153,516
- Issue date Oct 6, 2015
- Microsemi Corporation
- Cecil Kent Walters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a flip chip package for dram with two underf...
- Patent number 8,951,845
- Issue date Feb 10, 2015
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill layers
- Patent number 8,816,509
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 8,787,033
- Issue date Jul 22, 2014
- Aisin Aw Co., Ltd.
- Hitoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package for DRAM with two underfill materials
- Patent number 8,637,992
- Issue date Jan 28, 2014
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit connector apparatus and method therefor
- Patent number 8,508,035
- Issue date Aug 13, 2013
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 8,399,975
- Issue date Mar 19, 2013
- SK Hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055413
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055398
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230307410
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20220352130
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- JEONG HYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220310576
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220302070
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LAYER THERMAL INTERFACE MATERIAL
- Publication number 20200411411
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200402947
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING 3DIC STRUCTURE
- Publication number 20200013746
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190355692
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND ELECTRONIC DEVICE
- Publication number 20180233429
- Publication date Aug 16, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board element and method for producing a printed ci...
- Publication number 20180005935
- Publication date Jan 4, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOIDLESSLY ENCAPSULATED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140319541
- Publication date Oct 30, 2014
- MICROSEMI CORPORATION
- Cecil Kent Walters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
- Publication number 20140141568
- Publication date May 22, 2014
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130193588
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit connector apparatus and method therefor
- Publication number 20130140705
- Publication date Jun 6, 2013
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
- Publication number 20130134602
- Publication date May 30, 2013
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors having different shapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with multiple types of underfill and method forming the same

Package

Electronic device

Package structure

Semiconductor package structure and methods of manufacturing the same

Package structure

Multi layer thermal interface material

Die stack assembly using an edge separation structure for connectiv...

Method of manufacturing 3DIC structure

Die stack assembly using an edge separation structure for connectiv...

3DIC structure and method of manufacturing the same

Multilayer board and electronic device

Printed circuit board element and method for producing a printed ci...

Semiconductor device

Solder fatigue arrest for wafer level package

Voidlessly encapsulated semiconductor die package

Methods of fabricating a flip chip package for dram with two underf...

Semiconductor package including underfill layers

Electronic component and electronic device

Flip chip package for DRAM with two underfill materials

Circuit connector apparatus and method therefor

Stacked semiconductor package

Method for mounting electronic components

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE

SEMICONDUCTOR PACKAGE

Packages With Multiple Types of Underfill and Method Forming The Same

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

Chip Package on Package Structure, Packaging Method Thereof, and El...

MULTI LAYER THERMAL INTERFACE MATERIAL

PACKAGE STRUCTURE

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

METHOD OF MANUFACTURING 3DIC STRUCTURE

3DIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER BOARD AND ELECTRONIC DEVICE

Printed circuit board element and method for producing a printed ci...

VOIDLESSLY ENCAPSULATED SEMICONDUCTOR DIE PACKAGE

FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

SEMICONDUCTOR PACKAGE

Circuit connector apparatus and method therefor

FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS