Layer connectors having different sizes

Industry

CPC
H01L2224/3003

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3003Layer connectors having different sizes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,080,692
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Keisuke Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, manufacturing method thereof, and display device
- Patent number 11,404,448
- Issue date Aug 2, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Bo Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Silicon carbide semiconductor device, silicon carbide semiconductor...
- Patent number 11,183,476
- Issue date Nov 23, 2021
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with twinned copper
- Patent number 11,114,405
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,685,932
- Issue date Jun 16, 2020
- Mitsubishi Electric Corporation
- Sho Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,658,324
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 10,515,919
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure with twinned cop...
- Patent number 10,515,923
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with bumps
- Patent number 10,014,218
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in electronic devices with yielding substrates
- Patent number 9,583,691
- Issue date Feb 28, 2017
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for stackable packaging
- Patent number 9,508,632
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,462,736
- Issue date Oct 4, 2016
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304537
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame, Packaging Structure and Packaging Method
- Publication number 20240234259
- Publication date Jul 11, 2024
- DIODES INCORPORATED
- MeiDan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES
- Publication number 20230387372
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYOUT STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE
- Publication number 20230326811
- Publication date Oct 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiangyu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220336429
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Keisuke EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220005779
- Publication date Jan 6, 2022
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE, SILICON CARBIDE SEMICONDUCTOR...
- Publication number 20200152594
- Publication date May 14, 2020
- Fuji Electric Co., Ltd.
- Makoto UTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200144215
- Publication date May 7, 2020
- Mitsubishi Electric Corporation
- Sho SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20200126939
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20190096842
- Publication date Mar 28, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180358319
- Publication date Dec 13, 2018
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH CONDUCTIVE LINE AND METHOD FOR...
- Publication number 20180350765
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20170133341
- Publication date May 11, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170103960
- Publication date Apr 13, 2017
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Electronic device and manufacturing method of electronic device

Semiconductor device and manufacturing method thereof

Bump-on-trace design for enlarge bump-to-trace distance

Chemical mechanical polishing for hybrid bonding

Display substrate, manufacturing method thereof, and display device

Silicon carbide semiconductor device, silicon carbide semiconductor...

Semiconductor package structure with twinned copper

Semiconductor packages with an intermetallic layer

Chemical mechanical polishing for hybrid bonding

Semiconductor devices with underfill control features, and associat...

Semiconductor device

Semiconductor device

Multiple-chip package with multiple thermal interface materials

Bump-on-trace design for enlarge bump-to-trace distance

Method for forming semiconductor package structure with twinned cop...

Semiconductor devices with underfill control features, and associat...

Paste material, wiring member formed from the paste material, and e...

Micro-pillar assisted semiconductor bonding

Method for forming semiconductor device structure with bumps

Method for the diffusion soldering of an electronic component to a...

Method for producing structured sintered connection layers, and sem...

Wafer stack protection seal

Thermal management in electronic devices with yielding substrates

Apparatus and methods for stackable packaging

Mounting method

Composition and methods of forming solder bump and flip chip using...

Wafer stack protection seal

Bump package and methods of formation thereof

Patents Applicationslast 30 patents

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

ELECTRONIC DEVICE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

Lead Frame, Packaging Structure and Packaging Method

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES

SEMICONDUCTOR LAYOUT STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SILICON CARBIDE SEMICONDUCTOR DEVICE, SILICON CARBIDE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE WITH CONDUCTIVE LINE AND METHOD FOR...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR DEVICE