TREA

Layered conductor

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  • CPC
  • H05K2201/0338
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0338Layered conductor
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Metal-ceramic substrate and method for producing a metal ceramic su...
    • Publication number 20250048556
    • Publication date Feb 6, 2025
    • Rogers Germany GmbH
    • Andreas Meyer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
    • Publication number 20250040036
    • Publication date Jan 30, 2025
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • LI-CHUN HUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
    • Publication number 20250016919
    • Publication date Jan 9, 2025
    • Mitsubishi Electric Corporation
    • Motoki MASAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250008645
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Youhong WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250008652
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240431031
    • Publication date Dec 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20240414842
    • Publication date Dec 12, 2024
    • LG Innotek Co., Ltd.
    • Jun Young LIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240407086
    • Publication date Dec 5, 2024
    • Sumitomo Electric Industries, Ltd.
    • Yukie TSUDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240389229
    • Publication date Nov 21, 2024
    • InnoLux Corporation
    • Yu-Ting LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD THEREFOR
    • Publication number 20240357739
    • Publication date Oct 24, 2024
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
    • Publication number 20240357740
    • Publication date Oct 24, 2024
    • CO-TECH DEVELOPMENT CORP.
    • Yun-Hsing SUNG
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
    • Publication number 20240352287
    • Publication date Oct 24, 2024
    • Resonac Corporation
    • Masashi OHKOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
    • Publication number 20240349423
    • Publication date Oct 17, 2024
    • GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
    • Meijuan Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240334610
    • Publication date Oct 3, 2024
    • InnoLux Corporation
    • Hsin-Li CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BATTERY PACK AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240332644
    • Publication date Oct 3, 2024
    • Samsung SDI Co., Ltd.
    • Jaepil AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...
    • Publication number 20240292523
    • Publication date Aug 29, 2024
    • Corning Incorporated
    • JOON-SOO KIM
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240284591
    • Publication date Aug 22, 2024
    • MURATA MANUFACTURING CO., LTD.
    • Tsuyoshi TAKAKURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
    • Publication number 20240284596
    • Publication date Aug 22, 2024
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Liang GAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240260179
    • Publication date Aug 1, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240260187
    • Publication date Aug 1, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi YOKOTA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE...
    • Publication number 20240244747
    • Publication date Jul 18, 2024
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Nianqi YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240215158
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Jeong JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
    • Publication number 20240206062
    • Publication date Jun 20, 2024
    • Lotte Energy Materials Corporation
    • Chang Yol YANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
    • Publication number 20240188217
    • Publication date Jun 6, 2024
    • TTM TECHNOLOGIES INC.
    • Matthew Douglas Neely
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...
    • Publication number 20240171839
    • Publication date May 23, 2024
    • LG Innotek Co., Ltd.
    • Hae Sik KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240107685
    • Publication date Mar 28, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTING ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE
    • Publication number 20240089576
    • Publication date Mar 14, 2024
    • TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    • FEI-FAN YU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE