Layered conductor

Industry

CPC
H05K2201/0338

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0338Layered conductor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-roughened electrodeposited copper foil and copper clad laminate
- Patent number 12,120,816
- Issue date Oct 15, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal circuit structure based on FPC and method of making the same
- Patent number 12,089,331
- Issue date Sep 10, 2024
- APLUS SEMICONDUCTOR TECHNOLOGIES CO., LTD.
- Cheng-Neng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad structure
- Patent number 12,075,566
- Issue date Aug 27, 2024
- Innolux Corporation
- Yu-Ting Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, communications device, and manufacturing method
- Patent number 12,058,808
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,041,722
- Issue date Jul 16, 2024
- Innolux Corporation
- Hsin-Li Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Production method for copper/ceramic joined body, production method...
- Patent number 11,939,270
- Issue date Mar 26, 2024
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, an image sensor module, a lens driving device, and a...
- Patent number 11,936,968
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,917,755
- Issue date Feb 27, 2024
- Lotte Energy Materials Corporation
- Won Jin Beom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 11,871,525
- Issue date Jan 9, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive substrate, electronic device and display device
- Patent number 11,869,834
- Issue date Jan 9, 2024
- TDK Corporation
- Takashi Daitoku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite and copper clad laminate made therefrom
- Patent number 11,839,024
- Issue date Dec 5, 2023
- DUPONT ELECTRONICS, INC.
- Yu-Cheng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, metal laminate and printed circuit board using s...
- Patent number 11,820,885
- Issue date Nov 21, 2023
- Doosan Corporation
- Jinsoo Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 11,798,875
- Issue date Oct 24, 2023
- Innolux Corporation
- Chung-Chun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,792,926
- Issue date Oct 17, 2023
- Samsung Display Co., Ltd.
- Kyungmo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable electronic device
- Patent number 11,751,329
- Issue date Sep 5, 2023
- AUO Corporation
- Tsung-Ying Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board
- Patent number 11,744,014
- Issue date Aug 29, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate and substrate structure inc...
- Patent number 11,737,211
- Issue date Aug 22, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong Min
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module
- Patent number 11,736,785
- Issue date Aug 22, 2023
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Ming-Hsun Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 11,706,870
- Issue date Jul 18, 2023
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,700,686
- Issue date Jul 11, 2023
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240389229
- Publication date Nov 21, 2024
- InnoLux Corporation
- Yu-Ting LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20240357740
- Publication date Oct 24, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240334610
- Publication date Oct 3, 2024
- InnoLux Corporation
- Hsin-Li CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332644
- Publication date Oct 3, 2024
- Samsung SDI Co., Ltd.
- Jaepil AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...
- Publication number 20240292523
- Publication date Aug 29, 2024
- Corning Incorporated
- JOON-SOO KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT MODULE
- Publication number 20240284591
- Publication date Aug 22, 2024
- MURATA MANUFACTURING CO., LTD.
- Tsuyoshi TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240260179
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240244747
- Publication date Jul 18, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Nianqi YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
- Publication number 20240188217
- Publication date Jun 6, 2024
- TTM TECHNOLOGIES INC.
- Matthew Douglas Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...
- Publication number 20240171839
- Publication date May 23, 2024
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE
- Publication number 20240089576
- Publication date Mar 14, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- FEI-FAN YU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...
- Publication number 20240074031
- Publication date Feb 29, 2024
- CreeLED, Inc.
- Everett Bradford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230371175
- Publication date Nov 16, 2023
- TDK Corporation
- Yu FUKAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE
- Publication number 20230371187
- Publication date Nov 16, 2023
- AMAZING COOL TECHNOLOGY CORPORATION
- Shiann-Tsong TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230301048
- Publication date Sep 21, 2023
- Samsung Display Co.,
- MYONG-SOO OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20230292445
- Publication date Sep 14, 2023
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL...
- Publication number 20230269873
- Publication date Aug 24, 2023
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230262888
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Hiromichi TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Layered conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Micro-roughened electrodeposited copper foil and copper clad laminate

Flexible circuit board

Metal-coated liquid-crystal polymer film

Metal circuit structure based on FPC and method of making the same

Flexible circuit board

Bonding pad structure

Printed circuit board, communications device, and manufacturing method

Electronic device

Ceramic electronic component

Production method for copper/ceramic joined body, production method...

Circuit board, an image sensor module, a lens driving device, and a...

Carrier-foil-attached ultra-thin copper foil

Application of electrical conductors of a solar cell

Wiring board and manufacturing method for same

Electroconductive substrate, electronic device and display device

Composite and copper clad laminate made therefrom

Solder composition for use in solder joints of printed circuit boards

Application of electrical conductors to an electrically insulating...

Resin composition, metal laminate and printed circuit board using s...

Electronic device and manufacturing method thereof

Display apparatus

Stretchable electronic device

Method for applying a pattern to a substrate

Flexible circuit board

Connection structure embedded substrate and substrate structure inc...

Camera module

Printed circuit board and method of fabricating the same

Providing one or more carbon layers to a copper conductive material...

Method for manufacturing wiring board

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATE

WIRING SUBSTRATE

ELECTRONIC DEVICE

BATTERY PACK AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND...

CIRCUIT MODULE

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

PRINTED WIRING BOARD

WIRING BOARD

WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...

CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...

PRINTED WIRING BOARD

CONNECTING ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE

TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

ELECTRONIC COMPONENT

PACKAGE SUBSTRATE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL...

MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME