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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Patents Grants
last 30 patents
Information
Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
Patent number
12,322,661
Issue date
Jun 3, 2025
Tokyo Electron Limited
Kevin Ryan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure comprising up-narrow and down-wide openings...
Patent number
12,191,271
Issue date
Jan 7, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,165,960
Issue date
Dec 10, 2024
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect structure and method
Patent number
12,154,876
Issue date
Nov 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of semiconductor device
Patent number
12,148,723
Issue date
Nov 19, 2024
United Microelectronics Corp.
Zhirui Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
12,119,321
Issue date
Oct 15, 2024
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,916,031
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal interposer for a semiconductor package
Patent number
11,901,300
Issue date
Feb 13, 2024
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,699,641
Issue date
Jul 11, 2023
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,688,705
Issue date
Jun 27, 2023
Kioxia Corporation
Takashi Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly that includes a bridge
Patent number
11,676,900
Issue date
Jun 13, 2023
Intel Corporation
Eric J. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip package manufacturing process
Patent number
11,587,923
Issue date
Feb 21, 2023
EGALAX_EMPIA TECHNOLOGY INC.
Po-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of semiconductor device and method for bonding two substr...
Patent number
11,557,558
Issue date
Jan 17, 2023
United Microelectronics Corp.
Zhirui Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including semiconductor chip having point sym...
Patent number
11,469,196
Issue date
Oct 11, 2022
SK hynix Inc.
Jun Sik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
11,450,639
Issue date
Sep 20, 2022
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect structure and method
Patent number
11,424,205
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,410,900
Issue date
Aug 9, 2022
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module with sealing resin
Patent number
11,387,400
Issue date
Jul 12, 2022
Murata Manufacturing Co., Ltd.
Junpei Yasuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,335,656
Issue date
May 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor package having mold vias and method for manuf...
Patent number
11,257,801
Issue date
Feb 22, 2022
SK hynix Inc.
Sang-Eun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plurality of lead frames electrically connected to inductor chip
Patent number
11,177,198
Issue date
Nov 16, 2021
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
10,910,335
Issue date
Feb 2, 2021
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-access memory system and a method to manufacture the system
Patent number
10,896,890
Issue date
Jan 19, 2021
Altera Corporation
Hui Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
10,784,219
Issue date
Sep 22, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including multiple semiconductor chips and me...
Patent number
10,784,244
Issue date
Sep 22, 2020
Samsung Electronics Co., Ltd.
Won-Gil Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
10,665,518
Issue date
May 26, 2020
ROHM CO., LTD.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging with reduced cracking defects
Patent number
10,636,719
Issue date
Apr 28, 2020
Semiconductor Manufacturing International (Shanghai) Corporation
Yuan Zi Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing thereof
Patent number
10,622,325
Issue date
Apr 14, 2020
Epistar Corporation
Shih-An Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
Patent number
10,600,762
Issue date
Mar 24, 2020
Micron Technology, Inc.
Dai Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...
Publication number
20250226352
Publication date
Jul 10, 2025
Lumentum Technology (UK) Limited
Angelito Pizarro LAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
Publication number
20250167192
Publication date
May 22, 2025
ADVANCED MICRO DEVICES, INC.
Arsalan ALAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250062199
Publication date
Feb 20, 2025
ROHM CO., LTD.
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Interconnect Structure and Method
Publication number
20240395748
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240234228
Publication date
Jul 11, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIFTED VIA-CHAIN ELECTRICAL-TEST MEASUREMENTS FOR HYBRID BONDING A...
Publication number
20240038599
Publication date
Feb 1, 2024
TOKYO ELECTRON LIMITED
Kevin Ryan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Packaging Heterogeneous Area Array Interconnections
Publication number
20230369267
Publication date
Nov 16, 2023
Avago Technologies International Sales Pte. Limited
Sam Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIVERSAL INTERPOSER FOR A SEMICONDUCTOR PACKAGE
Publication number
20230268280
Publication date
Aug 24, 2023
Xilinx, Inc.
Jaspreet Singh GANDHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
Publication number
20230223369
Publication date
Jul 13, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE OF SEMICONDUCTOR DEVICE
Publication number
20230101900
Publication date
Mar 30, 2023
United Microelectronics Corp.
Zhirui Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP LIGHT EMITTING DIODE (LED) DEVICE
Publication number
20230078225
Publication date
Mar 16, 2023
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Zhanggen XIA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230056222
Publication date
Feb 23, 2023
SK HYNIX INC.
Kang Hun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Interconnect Structure and Method
Publication number
20220359440
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20220336305
Publication date
Oct 20, 2022
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacturing
Publication number
20220278063
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220270993
Publication date
Aug 25, 2022
KIOXIA Corporation
Takashi WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTR...
Publication number
20220005775
Publication date
Jan 6, 2022
United Microelectronics Corp.
Zhirui Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING POINT SYM...
Publication number
20210257323
Publication date
Aug 19, 2021
SK HYNIX INC.
Jun Sik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
Publication number
20210104486
Publication date
Apr 8, 2021
Altera Corporation
Hui LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacturing
Publication number
20210005561
Publication date
Jan 7, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20200251394
Publication date
Aug 6, 2020
ROHM CO., LTD.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20200066619
Publication date
Feb 27, 2020
ROHM CO., LTD.
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Interconnect Structure and Method
Publication number
20200006266
Publication date
Jan 2, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUF...
Publication number
20190355707
Publication date
Nov 21, 2019
SK HYNIX INC.
Sang-Eun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bond Structures and the Methods of Forming the Same
Publication number
20190252335
Publication date
Aug 15, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20190139939
Publication date
May 9, 2019
Samsung Electronics Co., Ltd.
Tae Joo HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
Publication number
20190109111
Publication date
Apr 11, 2019
EPISTAR CORPORATION
Shih-An LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20190051572
Publication date
Feb 14, 2019
ROHM CO., LTD.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS