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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0612Layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal interposer for a semiconductor package
- Patent number 11,901,300
- Issue date Feb 13, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,688,705
- Issue date Jun 27, 2023
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of semiconductor device and method for bonding two substr...
- Patent number 11,557,558
- Issue date Jan 17, 2023
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chip having point sym...
- Patent number 11,469,196
- Issue date Oct 11, 2022
- SK hynix Inc.
- Jun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 11,424,205
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,410,900
- Issue date Aug 9, 2022
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with sealing resin
- Patent number 11,387,400
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Junpei Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having mold vias and method for manuf...
- Patent number 11,257,801
- Issue date Feb 22, 2022
- SK hynix Inc.
- Sang-Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-access memory system and a method to manufacture the system
- Patent number 10,896,890
- Issue date Jan 19, 2021
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple semiconductor chips and me...
- Patent number 10,784,244
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 10,665,518
- Issue date May 26, 2020
- ROHM CO., LTD.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with reduced cracking defects
- Patent number 10,636,719
- Issue date Apr 28, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuan Zi Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,600,762
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,553,525
- Issue date Feb 4, 2020
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond structures and the methods of forming the same
- Patent number 10,510,699
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second semiconductor chips conn...
- Patent number 10,497,644
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063179
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFTED VIA-CHAIN ELECTRICAL-TEST MEASUREMENTS FOR HYBRID BONDING A...
- Publication number 20240038599
- Publication date Feb 1, 2024
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL INTERPOSER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230268280
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jaspreet Singh GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230223369
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20230101900
- Publication date Mar 30, 2023
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LIGHT EMITTING DIODE (LED) DEVICE
- Publication number 20230078225
- Publication date Mar 16, 2023
- XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Zhanggen XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230056222
- Publication date Feb 23, 2023
- SK HYNIX INC.
- Kang Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20220359440
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20220336305
- Publication date Oct 20, 2022
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220270993
- Publication date Aug 25, 2022
- KIOXIA Corporation
- Takashi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTR...
- Publication number 20220005775
- Publication date Jan 6, 2022
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING POINT SYM...
- Publication number 20210257323
- Publication date Aug 19, 2021
- SK HYNIX INC.
- Jun Sik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
- Publication number 20210104486
- Publication date Apr 8, 2021
- Altera Corporation
- Hui LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20200251394
- Publication date Aug 6, 2020
- ROHM CO., LTD.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200066619
- Publication date Feb 27, 2020
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20200006266
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUF...
- Publication number 20190355707
- Publication date Nov 21, 2019
- SK HYNIX INC.
- Sang-Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Structures and the Methods of Forming the Same
- Publication number 20190252335
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190139939
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Tae Joo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20190051572
- Publication date Feb 14, 2019
- ROHM CO., LTD.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20190027676
- Publication date Jan 24, 2019
- Murata Manufacturing Co., Ltd.
- Junpei YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET TEST PADS FOR WLCSP FINAL TEST
- Publication number 20190006249
- Publication date Jan 3, 2019
- Adesto Technologies Corporation
- Bard M. Pedersen
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUF...
- Publication number 20180331087
- Publication date Nov 15, 2018
- SK HYNIX INC.
- Sang-Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308812
- Publication date Oct 25, 2018
- Toyota Jidosha Kabushiki Kaisha
- Naoya TAKE
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure of semiconductor device

Semiconductor device and a method of manufacturing thereof

Semiconductor device and method of manufacturing

Universal interposer for a semiconductor package

Semiconductor device having electrode pads arranged between groups...

Semiconductor device

Semiconductor device and method of manufacturing the same

Electronic assembly that includes a bridge

Multichip package manufacturing process

Structure of semiconductor device and method for bonding two substr...

Semiconductor package including semiconductor chip having point sym...

Semiconductor device and a method of manufacturing thereof

Semiconductor interconnect structure and method

Semiconductor device having electrode pads arranged between groups...

Electronic module with sealing resin

Semiconductor device and method of manufacturing

Stacked semiconductor package having mold vias and method for manuf...

Plurality of lead frames electrically connected to inductor chip

Semiconductor device and a method of manufacturing thereof

Multi-access memory system and a method to manufacture the system

Semiconductor device and method of manufacturing

Semiconductor package including multiple semiconductor chips and me...

Semiconductor device having electrode pads arranged between groups...

Semiconductor packaging with reduced cracking defects

Semiconductor device and a method of manufacturing thereof

Apparatuses comprising semiconductor dies in face-to-face arrangements

Semiconductor device and manufacturing method of semiconductor device

Bond structures and the methods of forming the same

Semiconductor device

Semiconductor device with first and second semiconductor chips conn...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

QUASI-MONOLITHIC DIE ARCHITECTURES

SHIFTED VIA-CHAIN ELECTRICAL-TEST MEASUREMENTS FOR HYBRID BONDING A...

3D Packaging Heterogeneous Area Array Interconnections

UNIVERSAL INTERPOSER FOR A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

STRUCTURE OF SEMICONDUCTOR DEVICE

FLIP-CHIP LIGHT EMITTING DIODE (LED) DEVICE

SEMICONDUCTOR PACKAGES

Semiconductor Interconnect Structure and Method

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

Semiconductor Device and Method of Manufacturing

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTR...

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING POINT SYM...

MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM

Semiconductor Device and Method of Manufacturing

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICE

Semiconductor Interconnect Structure and Method

STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUF...

Bond Structures and the Methods of Forming the Same

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

ELECTRONIC MODULE

OFFSET TEST PADS FOR WLCSP FINAL TEST

STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE