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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) with multi-row columnar die interconnects...
- Patent number 11,791,272
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Rong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,158,578
- Issue date Oct 26, 2021
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package with metal post interconnections
- Patent number 10,971,476
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 10,446,499
- Issue date Oct 15, 2019
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging structure
- Patent number 10,418,299
- Issue date Sep 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 10,269,693
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heterogeneous ball pattern package
- Patent number 10,177,107
- Issue date Jan 8, 2019
- Xilinx, Inc.
- Rafael C. Camarota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,163,774
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded die flip-chip package assembly
- Patent number 10,128,205
- Issue date Nov 13, 2018
- Intel Corporation
- Thorsten Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,096,560
- Issue date Oct 9, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,096,559
- Issue date Oct 9, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die device, semiconductor device and method for making the same
- Patent number 10,050,021
- Issue date Aug 14, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,032,733
- Issue date Jul 24, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,997,484
- Issue date Jun 12, 2018
- TOSHIBA MEMORY CORPORATION
- Takeori Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a solder-on-pad structure
- Patent number 9,972,590
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,921,379
- Issue date Mar 20, 2018
- Inphi Corporation
- Liang Ding
- G02 - OPTICS
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,865,569
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill dispensing in 3D IC using metrology
- Patent number 9,859,181
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with multiple plane I/O structure
- Patent number 9,806,064
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit probing structures and methods for probing the same
- Patent number 9,754,847
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor apparatus, system and method of fabrication
- Patent number 9,754,921
- Issue date Sep 5, 2017
- Samsung Electronics Co., Ltd.
- Ki-Tae Park
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package having two substrates
- Patent number 9,721,928
- Issue date Aug 1, 2017
- NXP USA, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging structure
- Patent number 9,711,426
- Issue date Jul 18, 2017
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact optical transceiver by hybrid multichip integration
- Patent number 9,651,751
- Issue date May 16, 2017
- Inphi Corporation
- Liang Ding
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20230253337
- Publication date Aug 10, 2023
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230056222
- Publication date Feb 23, 2023
- SK HYNIX INC.
- Kang Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS...
- Publication number 20220285280
- Publication date Sep 8, 2022
- QUALCOMM Incorporated
- Rong ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20220028790
- Publication date Jan 27, 2022
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Packaging Thereof
- Publication number 20190244887
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20180233486
- Publication date Aug 16, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180102332
- Publication date Apr 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180076156
- Publication date Mar 15, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Chan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS BALL PATTERN PACKAGE
- Publication number 20180033753
- Publication date Feb 1, 2018
- Xilinx, Inc.
- Rafael C. Camarota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE
- Publication number 20180012856
- Publication date Jan 11, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...
- Publication number 20170287873
- Publication date Oct 5, 2017
- Santosh Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20170263582
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170162545
- Publication date Jun 8, 2017
- Samsung Electronics Co., Ltd.
- MIN-SANG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170103958
- Publication date Apr 13, 2017
- Samsung Electronics Co., Ltd.
- CHANHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH ANGLED INTERCONNECT ELEMENTS
- Publication number 20170098623
- Publication date Apr 6, 2017
- GLOBALFOUNDRIES INC.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING STRUCTURE
- Publication number 20170025322
- Publication date Jan 26, 2017
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsuan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING A PATTERNED CONDUCTING PLATE AND METHOD FOR FOR...
- Publication number 20160343632
- Publication date Nov 24, 2016
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20160240509
- Publication date Aug 18, 2016
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MULTIPLE PLANE I/O STRUCTURE
- Publication number 20160197060
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND CARRIER BOARD STRUCTURE OF FLIP-CHIP CHIP-SCALE PACKAGE AN...
- Publication number 20160197033
- Publication date Jul 7, 2016
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- TING-HAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20160155697
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160148891
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packaging Methods and Structures Thereof
- Publication number 20160133536
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160111387
- Publication date Apr 21, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086876
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices And Methods of Packaging Thereof
- Publication number 20160066426
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160005707
- Publication date Jan 7, 2016
- Samsung Electronics Co., Ltd.
- Yong-Hwan KWON
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnect device and method

Integrated circuits (ICs) with multi-row columnar die interconnects...

High density interconnect device and method

High density interconnect device and method

Packaged semiconductor devices and methods of packaging thereof

Bottom package with metal post interconnections

Protrusion bump pads for bond-on-trace processing

High density interconnect device and method

Fan-out wafer level packaging structure

Packaged semiconductor devices and methods of packaging thereof

Heterogeneous ball pattern package

Protrusion bump pads for bond-on-trace processing

Embedded die flip-chip package assembly

Fan-out semiconductor package

Fan-out semiconductor package

Die device, semiconductor device and method for making the same

Fan-out semiconductor package

Semiconductor device and manufacturing method of the same

Semiconductor package having a solder-on-pad structure

Compact optical transceiver by hybrid multichip integration

Planarity-tolerant reworkable interconnect with integrated testing

Underfill dispensing in 3D IC using metrology

Package with multiple plane I/O structure

Circuit probing structures and methods for probing the same

IC structure with angled interconnect elements

Stacked semiconductor apparatus, system and method of fabrication

Integrated circuit package having two substrates

Fan-out wafer level packaging structure

Semiconductor packages

Compact optical transceiver by hybrid multichip integration

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUITS (ICs) WITH MULTI-ROW COLUMNAR DIE INTERCONNECTS...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Packaged Semiconductor Devices and Methods of Packaging Thereof

Protrusion Bump Pads for Bond-on-Trace Processing

DIE DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

HETEROGENEOUS BALL PATTERN PACKAGE

SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE

ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

STACKED SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

IC STRUCTURE WITH ANGLED INTERCONNECT ELEMENTS

FAN-OUT WAFER LEVEL PACKAGING STRUCTURE

CHIP PACKAGE HAVING A PATTERNED CONDUCTING PLATE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGES

PACKAGE WITH MULTIPLE PLANE I/O STRUCTURE

COMPOUND CARRIER BOARD STRUCTURE OF FLIP-CHIP CHIP-SCALE PACKAGE AN...

Protrusion Bump Pads for Bond-on-Trace Processing

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device Packaging Methods and Structures Thereof

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

Electronic Component

Packaged Semiconductor Devices And Methods of Packaging Thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME