Lead-frames or other flat leads

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H01L23/495

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/495Lead-frames or other flat leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame rolling
- Patent number 12,368,054
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost embedded integrated circuit dies
- Patent number 12,368,089
- Issue date Jul 22, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 12,362,195
- Issue date Jul 15, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 12,354,932
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone isolation capacitor
- Patent number 12,355,025
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate driver, insulation module, low-voltage circuit unit, and high-...
- Patent number 12,355,436
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual current magnetic field sensor
- Patent number 12,352,831
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Stephan Leisenheimer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,933
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,752
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Yoshikatsu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 12,347,757
- Issue date Jul 1, 2025
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having galvanic isolation and method therefor
- Patent number 12,347,753
- Issue date Jul 1, 2025
- NXP USA, INC.
- Jerry Rudiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,755
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with load terminals on which coupled power component and lo...
- Patent number 12,347,754
- Issue date Jul 1, 2025
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded inductor with magnetic core having mold flow enhancing channels
- Patent number 12,347,603
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Joel Nathan Brassfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tip connection portion of terminal member and associated semiconduc...
- Patent number 12,347,750
- Issue date Jul 1, 2025
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Dual die integrated circuit system in an integrated circuit package...
- Patent number 12,341,138
- Issue date Jun 24, 2025
- TDK-MICRONAS GMBH
- Paolo Marozzi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239558
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239506
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239559
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20250233055
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233056
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250226294
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Power Semiconductor Package with Sidewall Contacts
- Publication number 20250226293
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226276
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226281
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL
- Publication number 20250226297
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Kok Yau CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE
- Publication number 20250218974
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...
- Publication number 20250219029
- Publication date Jul 3, 2025
- MURATA MANUFACTURING CO., LTD.
- David M. GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE
- Publication number 20250218976
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250219007
- Publication date Jul 3, 2025
- Mitsubishi Electric Corporation
- Hiroya SANNAI
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames or other flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame rolling

Low cost embedded integrated circuit dies

Systems and methods for power module for inverter for electric vehicle

Method of manufacturing multi-die semiconductor devices and corresp...

Low stress asymmetric dual side module

Integrated circuit (IC) and electronic apparatus

Semiconductor device

Leadframe with a metal oxide coating and method of forming the same

SMDs integration on QFN by 3D stacked solution

Sandwich structure power supply module

Semiconductor device and method for manufacturing the same

Standalone isolation capacitor

Gate driver, insulation module, low-voltage circuit unit, and high-...

Dual current magnetic field sensor

Semiconductor device

Method of manufacturing a semiconductor device

Package and method for manufacturing the same

Replacement buried power rail in backside power delivery

Semiconductor device and a method of manufacture

Semiconductor device

Semiconductor device

Semiconductor device and measurement device

Semiconductor device having galvanic isolation and method therefor

Low stress asymmetric dual side module

Package with load terminals on which coupled power component and lo...

Molded inductor with magnetic core having mold flow enhancing channels

Tip connection portion of terminal member and associated semiconduc...

Systems and methods for power module for inverter for electric vehicle

Dual die integrated circuit system in an integrated circuit package...

Semiconductor device stack-up with bulk substrate material to mitig...

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

CAVITY TAPE FOR PACKAGE PROTECTION

IC PACKAGE WITH DIE AND COPPER POSTS

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

SEMICONDUCTOR DEVICE

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

Embedded Power Semiconductor Package with Sidewall Contacts

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

MULTI-DIE SEMICONDUCTOR PACKAGE

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE

Electronic Component

INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...

MULTI-DIE TRANSFORMER POWER MODULES

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE