Lead-frames or other flat leads

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H01L23/495

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/495Lead-frames or other flat leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and powe...
- Patent number 12,308,304
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing the same
- Patent number 12,308,359
- Issue date May 20, 2025
- Osram Opto Semiconductors GmbH
- Andreas Dobner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concealed gate terminal semiconductor packages and related methods
- Patent number 12,300,583
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta Almagro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electrical component for bridging leadfra...
- Patent number 12,300,585
- Issue date May 13, 2025
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with solid-state power storage device
- Patent number 12,302,628
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for manufacturing thereof
- Patent number 12,300,559
- Issue date May 13, 2025
- Infineon Technologies AG
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor apparatus
- Patent number 12,300,562
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 12,293,960
- Issue date May 6, 2025
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor packaging unit having a plurality of bridging la...
- Patent number 12,288,737
- Issue date Apr 29, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of fabricating the same
- Patent number 12,288,738
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Younghwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly having post connects with solder-based j...
- Patent number 12,288,763
- Issue date Apr 29, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, article comprising the same and manufacturing metho...
- Patent number 12,288,736
- Issue date Apr 29, 2025
- Prevayl Innovations Limited
- Michael John Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 12,283,535
- Issue date Apr 22, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES
- Publication number 20250174611
- Publication date May 29, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of packaging high voltage and high current power devices
- Publication number 20250174528
- Publication date May 29, 2025
- Board of Regents, The University of Texas System
- Alex Q. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT
- Publication number 20250174525
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174526
- Publication date May 29, 2025
- NEXPERIA B.V.
- Wai Hung William Hor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174529
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...
- Publication number 20250167058
- Publication date May 22, 2025
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH RECESSED TERMINALS
- Publication number 20250167082
- Publication date May 22, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE SENSOR CAVITIES
- Publication number 20250164296
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167079
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Ryoji MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250157897
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE
- Publication number 20250157898
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Venero SANTAMARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157913
- Publication date May 15, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
- Publication number 20250157894
- Publication date May 15, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...
- Publication number 20250157829
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Mark Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20250157982
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY
- Publication number 20250157895
- Publication date May 15, 2025
- Infineon Technologies Austria AG
- Hao Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250157896
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Sangjine PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...
- Publication number 20250149506
- Publication date May 8, 2025
- Kirill Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250149402
- Publication date May 8, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames or other flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for an interlocking feature on a power module

Semiconductor device package

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor module

Semiconductor device having wire pieces in bonding member

Semiconductor device and method of manufacturing the same, and powe...

Semiconductor device including semiconductor chip having power tran...

Optoelectronic component and method for producing the same

Concealed gate terminal semiconductor packages and related methods

Semiconductor apparatus

Semiconductor device with electrical component for bridging leadfra...

Dual cool power module with stress buffer layer

Integrated chip with solid-state power storage device

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device including heat sink with exposed side from enc...

Semiconductor packages and methods for manufacturing thereof

Semiconductor module and semiconductor apparatus

Edge bend for isolation packages

Side-solderable leadless package

Method of manufacture for a cascode semiconductor device

Semiconductor device and method of forming leadframe with clip bond...

Thin semiconductor packaging unit having a plurality of bridging la...

Semiconductor device package and method of fabricating the same

Semiconductor device and method for manufacturing the same

Flip chip package assembly having post connects with solder-based j...

Sensor package, article comprising the same and manufacturing metho...

Molded semiconductor package having an embedded inlay

Systems and methods for cooling system and power module for inverte...

IC die and heat spreaders with solderable thermal interface structu...

Semiconductor device

Patents Applicationslast 30 patents

LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES

SEMICONDUCTOR DEVICE

Methods of packaging high voltage and high current power devices

LEAD FRAME AND MANUFACTURING METHOD THEREOF

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...

SEMICONDUCTOR DEVICE

POWER MODULES

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ELECTRONIC PACKAGE WITH RECESSED TERMINALS

MINIATURE SENSOR CAVITIES

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY

INTEGRATED CIRCUIT DEVICE

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

SEMICONDUCTOR PACKAGE STRUCTURE