Lead-frames or other flat leads

Industry

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H01L23/495

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/495Lead-frames or other flat leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,249,560
- Issue date Mar 11, 2025
- Rohm Co., Ltd
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic structure for optical semiconductor device, method for pro...
- Patent number 12,237,450
- Issue date Feb 25, 2025
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top circuit and an IC with a gap over th...
- Patent number 12,237,247
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding device
- Patent number 12,230,511
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,224,230
- Issue date Feb 11, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yasuaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated mult-device chip and package
- Patent number 12,224,279
- Issue date Feb 11, 2025
- Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Tsung-Wen Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with grooved die pad
- Patent number 12,224,229
- Issue date Feb 11, 2025
- Kabushiki Kaisha Toshiba
- Kyo Tanabiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20250081476
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...
- Publication number 20250079352
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION
- Publication number 20250079247
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250079269
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Yumin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Management Integrated Circuit (PMIC) and Power Management System
- Publication number 20250079270
- Publication date Mar 6, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Cheng-Han Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...
- Publication number 20250079307
- Publication date Mar 6, 2025
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20250079267
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YAN-WEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SWITCHING POWER DEVICE
- Publication number 20250079268
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250079272
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Yuta SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...
- Publication number 20250079271
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...
- Publication number 20250079273
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079370
- Publication date Mar 6, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Shuichi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250070051
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hidetoshi ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY
- Publication number 20250069984
- Publication date Feb 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250070070
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko BERNARDONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGING DEVICE
- Publication number 20250070073
- Publication date Feb 27, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070103
- Publication date Feb 27, 2025
- Rohm Co., Ltd.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250069996
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...
- Publication number 20250070000
- Publication date Feb 27, 2025
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070076
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069995
- Publication date Feb 27, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE...
- Publication number 20250065728
- Publication date Feb 27, 2025
- Hyundai Motor Company
- Myung Ill YOU
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD
- Publication number 20250069993
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069998
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Takahiro KOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20250070071
- Publication date Feb 27, 2025
- LAPIS Technology Co., Ltd.
- Daisuke TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames or other flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method for manufacturing electronic device

Semiconductor device arrangement with compressible adhesive

Intelligent power module containing exposed surfaces of transistor...

Lead frame and manufacturing method thereof

Packaged electronic device with film isolated power stack

Semiconductor package with wettable flank and related methods

Substrates with solder barriers on leads

Metallic structure for optical semiconductor device, method for pro...

Semiconductor package with top circuit and an IC with a gap over th...

Semiconductor device and method for manufacture of semiconductor de...

Palladium-coated copper bonding wire, manufacturing method of palla...

Method of manufacturing semiconductor devices and corresponding device

High power module package structures

Semiconductor packages with vertical passive components

Semiconductor device and method of forming micro interconnect struc...

Packaged stackable electronic power device for surface mounting and...

Semiconductor package having side wall plating

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor module

Semiconductor device having cavities at an interface of an encapsul...

Systems and methods for low inductance phase switch for inverter fo...

Integrated mult-device chip and package

Laser-cut lead-frame for integrated circuit (IC) packages

Semiconductor device with grooved die pad

Systems and methods for adaptive gate driver for inverter for elect...

Radio frequency package implementing a window frame with edge plati...

Semiconductor packages with increased power handling

ESD protection device

Package substrate having integrated passive device(s) between leads

DC and AC magnetic field protection for MRAM device using magnetic-...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...

SEMICONDUCTOR DEVICE

MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION

POWER MODULE

Power Management Integrated Circuit (PMIC) and Power Management System

SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...

CHIP PACKAGE STRUCTURE

DUAL PACKAGE SWITCHING POWER DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...

BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...

EMBEDDED SEMICONDUCTOR PACKAGING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

DUAL SWITCHING POWER DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE...

PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD