Lead (Pb) as principal constituent

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H01L2224/85416

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85416Lead (Pb) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules with bifet and harmonic termination and rel...
- Patent number 9,692,357
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including wire bond pad and related systems...
- Patent number 9,660,584
- Issue date May 23, 2017
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,520,835
- Issue date Dec 13, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,490,751
- Issue date Nov 8, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods to fabricate a radio frequency integrated circuit
- Patent number 9,472,514
- Issue date Oct 18, 2016
- Skyworks Solutions, Inc.
- Weimin Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 9,171,821
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 8,952,549
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure enhancing molding compound bondability
- Patent number 8,476,746
- Issue date Jul 2, 2013
- Kun Yuan Technology Co., Ltd.
- Cheng-Yu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,471,383
- Issue date Jun 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking
- Patent number 8,174,127
- Issue date May 8, 2012
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215791
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Jinmo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120326305
- Publication date Dec 27, 2012
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD SYSTEM AND METHOD
- Publication number 20120222892
- Publication date Sep 6, 2012
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe enhancing molding compound bondability and package struct...
- Publication number 20110266662
- Publication date Nov 3, 2011
- Kun Yuan Technology Co., Ltd.
- Cheng-Yu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20110147899
- Publication date Jun 23, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF
- Publication number 20090294952
- Publication date Dec 3, 2009
- TAIWAN SOLUTIONS SYSTEMS CORP.
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor package and structure thereof
- Publication number 20080135939
- Publication date Jun 12, 2008
- Chi Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS

Lead (Pb) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power amplifier systems with control interface and bias circuit

Power amplifier modules including transistor with grading and semic...

Power amplifier modules with bonding pads and related systems, devi...

Power amplifier modules with power amplifier and transmission line...

Radio frequency integrated circuit module

Power amplifier modules with harmonic termination circuit and relat...

Power amplifier modules including tantalum nitride terminated throu...

Power amplifier modules with bifet and harmonic termination and rel...

Power amplifier modules including wire bond pad and related systems...

Power amplifier modules including bipolar transistor with grading a...

Power amplifier modules including bipolar transistor with grading a...

Methods to fabricate a radio frequency integrated circuit

Semiconductor packages and methods of manufacturing the same

Semiconductor packages and methods of manufacturing the same

Package structure enhancing molding compound bondability

Semiconductor package and fabrication method thereof

Integrated circuit device having die bonded to the polymer side of...

Integrated circuit package system employing device stacking

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

WIRE BOND PAD SYSTEM AND METHOD

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

Leadframe enhancing molding compound bondability and package struct...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

Ultra-Thin Semiconductor Package

Fabrication method of semiconductor package and structure thereof