Lead (Pb) as principal constituent

Industry

CPC
H01L2224/45616

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45616Lead (Pb) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package semiconductor device
- Patent number 11,362,022
- Issue date Jun 14, 2022
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bonding metal wire bond wires to metal pads
- Patent number 9,761,554
- Issue date Sep 12, 2017
- Invensas Corporation
- Willmar Subido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stabilized wire bonded electrical connections and method of making...
- Patent number 7,032,311
- Issue date Apr 25, 2006
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low phosphorus containing band-shaped and/or filamentary material
- Patent number 5,045,410
- Issue date Sep 3, 1991
- Karl Neumayer, Erzeugung und Vertrieb von Kabeln, Drahten isolierten Leitunge...
- Heinz G. Hiesbock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3136032
- Patent number 3,136,032
- Issue date Jun 9, 1964
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTICHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20220310495
- Publication date Sep 29, 2022
- Magnachip Semiconductor, Ltd.
- Hyun Dong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING METAL WIRE BOND WIRES TO METAL PADS
- Publication number 20160329294
- Publication date Nov 10, 2016
- Invensas Corporation
- Willmar SUBIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stabilized wire bonded electrical connections and method of making...
- Publication number 20030234451
- Publication date Dec 25, 2003
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lead (Pb) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multichip packaged semiconductor device

Multichip package semiconductor device

Printed adhesion deposition to mitigate integrated circuit package...

Printed adhesion deposition to mitigate integrated circuit delamina...

Ball bonding metal wire bond wires to metal pads

Stabilized wire bonded electrical connections and method of making...

Low phosphorus containing band-shaped and/or filamentary material

3136032

Patents Applicationslast 30 patents

MULTICHIP PACKAGE AND FABRICATION METHOD THEREOF

BALL BONDING METAL WIRE BOND WIRES TO METAL PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Stabilized wire bonded electrical connections and method of making...