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3136032
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Information
Patent Grant
3136032
References
Source
Patent Number
3,136,032
Date Filed
Not available
Date Issued
Tuesday, June 9, 1964
60 years ago
CPC
H01L24/45 - of an individual wire connector
H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L24/11 - Manufacturing methods
H01L24/12 - Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L24/81 - using a bump connector
H01L24/85 - using a wire connector
H01L2224/13099 - Material
H01L2224/45015 - being circular
H01L2224/45147 - Copper (Cu) as principal constituent
H01L2224/45155 - Nickel (Ni) as principal constituent
H01L2224/45565 - Single coating layer
H01L2224/45611 - Tin (Sn) as principal constituent
H01L2224/45616 - Lead (Pb) as principal constituent
H01L2224/45655 - Nickel (Ni) as principal constituent
H01L2224/73265 - Layer and wire connectors
H01L2224/81801 - Soldering or alloying
H01L2924/00011 - Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/01006 - Carbon [C]
H01L2924/01013 - Aluminum [Al]
H01L2924/01015 - Phosphorus [P]
H01L2924/01019 - Potassium [K]
H01L2924/01028 - Nickel [Ni]
H01L2924/01029 - Copper [Cu]
H01L2924/0105 - Tin [Sn]
H01L2924/01074 - Tungsten [W]
H01L2924/01082 - Lead [Pb]
H01L2924/01083 - Bismuth [Bi]
H01L2924/01322 - Eutectic Alloys
H01L2924/014 - Solder alloys
H01L2924/19041 - being a capacitor
H01L2924/19043 - being a resistor
H01L2924/20758 - larger or equal to 80 microns less than 90 microns
H01L2924/30105 - Capacitance
Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
US Classifications
219 - Electric heating
029 - Metal working
228 - Metal fusion bonding
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