Claims
- 1. A solderable band-shaped or filamentary material having an extended shelf-life, said solderable material comprising an inner layer consisting essentially of copper 3.5 to 9.5% by weight tin and 0.03 to 0.13% by weight phophorous, based on the total weight of the inner layer, and an outer layer of a lead alloy.
- 2. A solderable material according to claim 1, wherein the outer layer consists of a lead-tin alloy.
- 3. A solderable material according to claim 2, wherein said outer layer consists of 60 to 95% by weight tin and 5 to 40% by weight lead, based on the total weight of the outer layer.
- 4. A solderable material according to claim 3, wherein said outer layer has a thickness of 4 to 8 .mu.m.
- 5. A solderable material according to claim 2, further comprising a barrier layer between said inner layer and said outer layer, said barrier layer comprising copper, nickel or a mixture thereof.
- 6. A solderable material according to claim 5, wherein said solderable material is a band-shaped material, said inner layer consists of 6.5 to 9.5% by weight tin, 0.07 to 0.13% by weight phosphorous and balance copper, said barrier layer consists of copper, and said outer layer consists of 60% by weight tin and 40% by weight lead.
- 7. A solderable material according to claim 1, wherein said solderable material is a filamentary material, said inner layer consists of 3.5 to 6.5% by weight tin, 0.07 to 1.0% by weight phosphorous and the balance copper, and said outer layer consists of 95% by weight tin and 5% by weight lead.
- 8. A solderable material according to claim 1, wherein said solderable material is a filamentary material, said inner layer consists of 4 to 6% by weight tin, 0.03 to 0.05% by weight phosphorous and the balance copper, and said outer layer consists of 90% by weight tin and 10% by weight lead.
- 9. A solderable material according to claim 1, wherein said solderable material is a band-shaped material, said inner layer consists of 6 to 9% by weight tin, 0.07 to 0.13% by weight phosphorous and the balance copper, and said outer layer consists of 95% by weight tin and 5% by weight lead.
- 10. An electrical conductor comprising a solderable band-shaped or filamentary material having an extended shelf-life, said solderable material comprising an inner layer consisting essentially of copper, 3.5 to 9.5% by weight tin and 0.3 to 0.13% by weight phosphorous, based on the total weight of the inner layer, and an outer layer consisting essentially of tin and lead.
- 11. An electrical conductor according to claim 10, wherein said solderable material further comprises a barrier layer between said inner layer and said outer layer, said barrier layer consisting essentially of copper, nickel or a mixture thereof.
- 12. An electrical conductor according to claim 10, wherein the outer layer of said solderable material consists of 60 to 95% by weight tin and 5 to 40% by weight lead.
- 13. An electrical conductor according to claim 12, wherein said solderable material further comprises a barrier layer between said inner layer and said outer layer, said barrier layer consisting of copper.
- 14. An electronic component at least one electrical conductor, said electric conductor being a solderable band-shaped or filamentary material comprising an inner layer consisting essentially of copper, 3.5 to 9.5% by weight tin, and 0.3 to 0.13% by weight phosphorous, based on the total weight of the inner layer, and an outer layer consisting of a lead alloy.
- 15. An electronic component according to claim 14, wherein said electronic component is a pin connector comprising a plurality of said electrical conductors provided in a contact array, each of said electrical conductors being associated with a contact in said contact array.
- 16. An electronic component according to claim 14, wherein said electronic component is a capacitor comprising at least two electrical conductors, said electrical conductors forming lead wires for said capacitor.
- 17. An electronic component according to claim 14, wherein said electronic component is a coil shell comprising a plurality of said electrical conductors, said electrical conductors forming lead wires for said coil shell.
Priority Claims (1)
Number |
Date |
Country |
Kind |
A 3610/85 |
Dec 1985 |
ATX |
|
Parent Case Info
This application is a continuation-in-part of U.S. Ser. No. 145,743, filed Jan. 19, 1988, abandoned, which is a continuation of U.S. Ser. No. 880,014, filed June 30, 1986, abandoned
US Referenced Citations (21)
Foreign Referenced Citations (23)
Number |
Date |
Country |
385932 |
Dec 1985 |
ATX |
0032326 |
Jul 1981 |
EPX |
2420573 |
Jan 1975 |
DEX |
2601765 |
Jul 1976 |
DEX |
3429393 |
Feb 1985 |
DEX |
3628783 |
Oct 1987 |
DEX |
3625543 |
Mar 1988 |
DEX |
1512235 |
Dec 1967 |
FRX |
1570993 |
Jun 1969 |
FRX |
2127826 |
Feb 1972 |
FRX |
2482791 |
Nov 1981 |
FRX |
2591518 |
Jun 1987 |
FRX |
54-23031 |
Feb 1979 |
JPX |
54-74248 |
Jun 1979 |
JPX |
55-151710 |
Nov 1980 |
JPX |
60-17038 |
Jun 1983 |
JPX |
60-177991 |
Nov 1985 |
JPX |
1117684 |
Feb 1966 |
GBX |
1185786 |
May 1968 |
GBX |
1382201 |
Feb 1972 |
GBX |
1466794 |
Apr 1974 |
GBX |
1476599 |
Dec 1975 |
GBX |
2185704 |
Jul 1987 |
GBX |
Non-Patent Literature Citations (3)
Entry |
Berg Solder-Washer BergPin, Data Sheet 501, Dec. 1982, 4 pages. |
Hutte Taschenbuch fur Eisenhuttenleute, 5. Auflage, Berlin, 1961, S. 1143. |
Stahl Eisen Werkstoffblatt (Steel Iron Specification Sheet), 028-59, 1st tion, Jan. 1959. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
880014 |
Jun 1986 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
145743 |
Jan 1988 |
|