Lead [Pb] as principal constituent

Industry

CPC
H01L2224/29116

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29116Lead [Pb] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for allowing restoration of interconnection of di...
- Patent number 11,251,151
- Issue date Feb 15, 2022
- Mitsubishi Electric Corporation
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,189,549
- Issue date Nov 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,950,527
- Issue date Mar 16, 2021
- Renesas Electronics Corporation
- Shoji Hashizume
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining a surface-mount component to a substrate with sol...
- Patent number 10,879,211
- Issue date Dec 29, 2020
- RSM Electron Power, Inc.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of transferring micro devices
- Patent number 10,431,569
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bonding structure
- Patent number 10,347,602
- Issue date Jul 9, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interconnections having different melting temperatures
- Patent number 10,211,133
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with a thermally conductive layer and methods...
- Patent number 10,074,588
- Issue date Sep 11, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240321665
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER POWER MODULE
- Publication number 20240258196
- Publication date Aug 1, 2024
- AMOSENSE CO., LTD.
- Kyungwhan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240153836
- Publication date May 9, 2024
- ROHM CO., LTD.
- Naoaki TSURUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352376
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, AND METHOD FOR MANUFACTURING SAME
- Publication number 20230326827
- Publication date Oct 12, 2023
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...
- Publication number 20230326948
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298975
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Satoru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20220254703
- Publication date Aug 11, 2022
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210183747
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE
- Publication number 20210166997
- Publication date Jun 3, 2021
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...
- Publication number 20210082868
- Publication date Mar 18, 2021
- RSM ELECTRON POWER, INC.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR ALLOWING RESTORATION OF INTERCONNECTION OF DI...
- Publication number 20200286848
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Jeffrey EWANCHUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190311974
- Publication date Oct 10, 2019
- RENESAS ELECTRONICS CORPORATION
- Shoji HASHIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190221503
- Publication date Jul 18, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20190157192
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device having a metallization structure

Chip assembly

Method for mounting an electrical component in which a hood is used...

Soldering a conductor to an aluminum layer

System and method for allowing restoration of interconnection of di...

Semiconductor device and method for manufacturing the same

Method for assembling a carrier with components, pigment for assemb...

Member for semiconductor device

Bonded structure and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Method and apparatus for creating a bond between objects based on f...

Method of joining a surface-mount component to a substrate with sol...

Semiconductor device and method with clip arrangement in IC package

Electronic component device

Printed adhesion deposition to mitigate integrated circuit package...

Low-temperature bonding with spaced nanorods and eutectic alloys

Chip assembly

Method for applying a bonding layer

Method of transferring micro devices

Method of processing a porous conductive structure in connection to...

Printed adhesion deposition to mitigate integrated circuit delamina...

Micro-bonding structure

Semiconductor devices and methods of forming thereof

Package with interconnections having different melting temperatures

Method for producing member for semiconductor device and semiconduc...

Flip chip interconnection with reduced current density

Semiconductor devices with a thermally conductive layer and methods...

Semiconductor device

Electronic devices with semiconductor die attached with sintered me...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

CIRCUIT BOARD

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

INVERTER POWER MODULE

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

SEMICONDUCTOR DEVICE

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

SEMICONDUCTOR DEVICE

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

POWER MODULE, AND METHOD FOR MANUFACTURING SAME

CHIP-ON-FILM PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...

SYSTEM AND METHOD FOR ALLOWING RESTORATION OF INTERCONNECTION OF DI...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Package with interconnections having different melting temperatures

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...