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H05K2201/10628
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/10628
Leaded surface mounted device
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Patents Grants
last 30 patents
Information
Patent Grant
Firing switch for compact capacitive discharge unit
Patent number
11,927,431
Issue date
Mar 12, 2024
Northrop Grumman Systems Corporation
James D. Lucas
F42 - AMMUNITION BLASTING
Information
Patent Grant
Fusing electronic components into three-dimensional objects via add...
Patent number
11,911,825
Issue date
Feb 27, 2024
Hewlett-Packard Development Company, L.P.
Kristopher J. Erickson
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of attaching a contact element to a conductive path a conduc...
Patent number
11,888,279
Issue date
Jan 30, 2024
TE Connectivity Germany GmbH
Andre Martin Dressel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor storage device and heat dissipator
Patent number
11,785,703
Issue date
Oct 10, 2023
Kioxia Corporation
Kazuya Nagasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mechanically bridged SMD interconnects for electronic devices
Patent number
11,744,020
Issue date
Aug 29, 2023
Texas Instruments Incorporated
Kyle Brent Norell
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device
Patent number
11,659,664
Issue date
May 23, 2023
Seiko Epson Corporation
Masataka Kazuno
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting aid and method for mounting electrical components on a pri...
Patent number
11,357,114
Issue date
Jun 7, 2022
BorgWarner Ludwigsburg GmbH
Sisay Tadele
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and substrate having the same mounted thereon
Patent number
11,302,481
Issue date
Apr 12, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Beom Joon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package with pre-applied filler material
Patent number
11,227,776
Issue date
Jan 18, 2022
STMicroelectronics, Inc.
Jefferson Talledo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting system for mechanical-shock resistant printed circuit boar...
Patent number
11,147,179
Issue date
Oct 12, 2021
AEROVIRONMENT, INC.
William John Nicoloff
B64 - AIRCRAFT AVIATION COSMONAUTICS
Information
Patent Grant
Electronic circuit substrate
Patent number
11,096,285
Issue date
Aug 17, 2021
HITACHI AUTOMOTIVE SYSTEMS, LTD.
Kousuke Takase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and method for producing an electronic component
Patent number
11,058,005
Issue date
Jul 6, 2021
VITESCO TECHNOLOGIES GERMANY GMBH
Helmut Karrer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
SMD diode taking a runner as body and manufacturing method thereof
Patent number
11,024,567
Issue date
Jun 1, 2021
SIYANG GRANDE ELECTRONICS CO., LTD.
Yunhui Zhong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting structure for module in electronic device
Patent number
11,019,733
Issue date
May 25, 2021
Samsung Electronics Co., Ltd.
Hyung Dal Kim
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Multilayer electronic component and board having the same
Patent number
10,980,124
Issue date
Apr 13, 2021
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Heung Kil Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,912,186
Issue date
Feb 2, 2021
Mitsubishi Electric Corporation
Shota Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-cost superior performance coinless RF power amplifier
Patent number
10,912,185
Issue date
Feb 2, 2021
Telefonaktiebolaget LM Ericsson (publ)
Reginald Simpson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
Patent number
10,905,010
Issue date
Jan 26, 2021
Robert Bosch GmbH
Helmut Seiband
G01 - MEASURING TESTING
Information
Patent Grant
System and method for minimizing connector pad open-circuit stubs
Patent number
10,856,414
Issue date
Dec 1, 2020
Dell Products, L.P.
Chun-Lin Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for mounting a power amplifier (AP) assembly
Patent number
10,842,028
Issue date
Nov 17, 2020
Telefonaktiebolaget LM Ericsson (publ)
Ronald Nehring
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit boards and circuit board assemblies
Patent number
10,764,994
Issue date
Sep 1, 2020
Hamilton Sundstrand Corporation
Tran Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting structure for module in electronic device
Patent number
10,681,823
Issue date
Jun 9, 2020
Samsung Electronics Co., Ltd.
Hyung Dal Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electrical assemblies for downhole use
Patent number
10,631,409
Issue date
Apr 21, 2020
Baker Hughes, a GE company, LLC
Rocco Difoggio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounting system for mechanical-shock resistant printed circuit boar...
Patent number
10,617,028
Issue date
Apr 7, 2020
AEROVIRONMENT, INC.
William John Nicoloff
B64 - AIRCRAFT AVIATION COSMONAUTICS
Information
Patent Grant
Solder component
Patent number
10,594,061
Issue date
Mar 17, 2020
Japan Aviation Electronics Industry, Limited
Osamu Hashiguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component with metal terminals and electronic component...
Patent number
10,395,831
Issue date
Aug 27, 2019
Taiyo Yuden Co., Ltd.
Naoki Saito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer electronic component and board having the same
Patent number
10,398,030
Issue date
Aug 27, 2019
Samsung Electro-Mechanics Co., Ltd.
Heung Kil Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device
Patent number
10,361,609
Issue date
Jul 23, 2019
Renesas Electronics Corporation
Shinji Nishizono
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Circuit board and on-board structure of semiconductor integrated ci...
Patent number
10,314,161
Issue date
Jun 4, 2019
Mitsubishi Electric Corporation
Shinji Matsunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting structure for module in electronic device
Patent number
10,306,773
Issue date
May 28, 2019
Samsung Electronics Co., Ltd.
Hyung Dal Kim
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Patents Applications
last 30 patents
Information
Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
Publication number
20240006403
Publication date
Jan 4, 2024
Molex, LLC
Victor Zaderej
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGED BATTERY
Publication number
20230262899
Publication date
Aug 17, 2023
The Johns Hopkins University
Konstantinos Gerasopoulos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
Publication number
20230254975
Publication date
Aug 10, 2023
Samsung Electronics Co., Ltd.
Sunjae KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES
Publication number
20230171894
Publication date
Jun 1, 2023
TEXAS INSTRUMENTS INCORPORATED
Kyle Brent Norell
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
Publication number
20230156917
Publication date
May 18, 2023
Amphenol Corporation
Paul R. Taylor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL COMPONENT AND CERAMIC SUBSTRATE
Publication number
20230134940
Publication date
May 4, 2023
Shinko Electric Industries Co., Ltd.
Ayako Sakai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT SUB-MOUNT AND ELECTRONIC DEVICE USING THE SAME
Publication number
20230128068
Publication date
Apr 27, 2023
Lextar Electronics Corporation
Ming-Jing LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
Publication number
20230081618
Publication date
Mar 16, 2023
INTELLIMICRO MEDICAL CO., LTD.
Yu-chong Tai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR
Publication number
20220304137
Publication date
Sep 22, 2022
KIOXIA Corporation
Kazuya NAGASAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC MODULE FOR MEDICAL DEVICE
Publication number
20220218920
Publication date
Jul 14, 2022
Norton (Waterford) Limited
James Roche
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
Publication number
20220110214
Publication date
Apr 7, 2022
Intel Corporation
Martin M. Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20220087023
Publication date
Mar 17, 2022
SEIKO EPSON CORPORATION
Masataka Kazuno
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD...
Publication number
20210329793
Publication date
Oct 21, 2021
CONTINENTAL AUTOMOTIVE GMBH
Rafael Del Rey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODULAR CAPACITOR SUBASSEMBLY FOR BACKUP POWER
Publication number
20210045247
Publication date
Feb 11, 2021
Intel Corporation
John Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON
Publication number
20210027946
Publication date
Jan 28, 2021
Samsung Electro-Mechanics Co., Ltd.
Beom Joon CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Circuit Substrate
Publication number
20200205290
Publication date
Jun 25, 2020
Hitachi Automotive Systems, Ltd.
Kousuke TAKASE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
Publication number
20200100364
Publication date
Mar 26, 2020
Vitesco Technologies Germany GmbH
Helmut Karrer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method Of Attaching A Contact Element To A Conductive Path A Condu...
Publication number
20200059056
Publication date
Feb 20, 2020
TE Connectivity Germany GmbH
Andre Martin Dressel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
Publication number
20190335588
Publication date
Oct 31, 2019
Samsung Electro-Mechanics Co., Ltd.
Heung Kil PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System and Method for Minimizing Connector Pad Open-Circuit Stubs
Publication number
20190281698
Publication date
Sep 12, 2019
DELL PRODUCTS, L.P.
Chun-Lin Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...
Publication number
20190132981
Publication date
May 2, 2019
AEROVIRONMENT, INC.
William John Nicoloff
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF
Publication number
20190069438
Publication date
Feb 28, 2019
DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Wei Guo
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
Connecting Arrangement and Corresponding Method for Mounting an Ele...
Publication number
20180352657
Publication date
Dec 6, 2018
ROBERT BOSCH GmbH
Helmut Seiband
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180343736
Publication date
Nov 29, 2018
MITSUBISHI ELECTRIC CORPORATION
Shota SATO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
Publication number
20180310396
Publication date
Oct 25, 2018
OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
Ryo Kobayashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
Publication number
20180310416
Publication date
Oct 25, 2018
Telefonaktiebolaget LM Ericsson (publ)
Ronald NEHRING
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD WITH A RECESS TO ACCOMMODATE DISCRETE COMPONE...
Publication number
20180270957
Publication date
Sep 20, 2018
Intel Corporation
Rajasekaran Swaminathan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MOUNTING STRUCTURE FOR MODULE IN ELECTRONIC DEVICE
Publication number
20180160545
Publication date
Jun 7, 2018
SAMSUNG ELECTRONICS CO., LTD.
Hyung Dal KIM
G02 - OPTICS
Information
Patent Application
ELECTRICAL ASSEMBLIES FOR DOWNHOLE USE
Publication number
20180042111
Publication date
Feb 8, 2018
BAKER HUGHES INCORPORATED
Rocco DIFOGGIO
G01 - MEASURING TESTING
Information
Patent Application
POWER CONVERTER
Publication number
20180042104
Publication date
Feb 8, 2018
Omron Corporation
Shingo NAGAOKA
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER